JPS6430724A - Mold assembly of resin - Google Patents

Mold assembly of resin

Info

Publication number
JPS6430724A
JPS6430724A JP18553487A JP18553487A JPS6430724A JP S6430724 A JPS6430724 A JP S6430724A JP 18553487 A JP18553487 A JP 18553487A JP 18553487 A JP18553487 A JP 18553487A JP S6430724 A JPS6430724 A JP S6430724A
Authority
JP
Japan
Prior art keywords
gate
resin
ejecting pin
slide cores
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18553487A
Other languages
Japanese (ja)
Inventor
Masaharu Ozaki
Masabumi Shimada
Yoshio Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alpha Corp
Original Assignee
Alpha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Corp filed Critical Alpha Corp
Priority to JP18553487A priority Critical patent/JPS6430724A/en
Publication of JPS6430724A publication Critical patent/JPS6430724A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates

Abstract

PURPOSE:To make one process in post-processes unnecessary and consequently simplify the processes by a method wherein slide cores for forming undercut parts in a cavity are provided in a mold assembly and a gate, which has a narrow part at the joint connecting to the cavity, is formed in one of the slide cores in order to cut off the gate simultaneously with the removal of an item from the mold. CONSTITUTION:The tip part of a gate 3, which is produced on a slide core 2 for forming a neck part 1'', is made narrower so as to be easily cut off. By moving a movable side mold 10 after the solidification of resin, the slide cores 2 are opened horizontally and, though a knob 1' and a submarine gate 7 remain stationary, only the gate 3 is moved, resulting in cutting off the resin connected to the gate 3. After that, retainer plates 13 and 14 are moved upwards apart from a mounting plate 12 so as to eject the knob 1' by a sleeve ejecting pin 9 and at the same time the resin solidified at a gate part by a gate ejecting pin 5 and the resin 7 solidified in the submarine gate by a runner ejecting pin 15.
JP18553487A 1987-07-27 1987-07-27 Mold assembly of resin Pending JPS6430724A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18553487A JPS6430724A (en) 1987-07-27 1987-07-27 Mold assembly of resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18553487A JPS6430724A (en) 1987-07-27 1987-07-27 Mold assembly of resin

Publications (1)

Publication Number Publication Date
JPS6430724A true JPS6430724A (en) 1989-02-01

Family

ID=16172485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18553487A Pending JPS6430724A (en) 1987-07-27 1987-07-27 Mold assembly of resin

Country Status (1)

Country Link
JP (1) JPS6430724A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6759746B1 (en) 2000-03-17 2004-07-06 Robert Bruce Davies Die attachment and method
USRE41581E1 (en) 1999-07-12 2010-08-24 Robert Bruce Davies Monolithic low dielectric constant platform for passive components and method
CN103737824A (en) * 2013-12-11 2014-04-23 思柏精密模具注塑（无锡）有限公司 Latent horizontal-motion precision mold of notebook computer battery cover

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5826525B2 (en) * 1978-01-30 1983-06-03 株式会社寺岡精工所 Digital electronic scale with label printer
JPS5919317B2 (en) * 1976-09-10 1984-05-04 セイコーインスツルメンツ株式会社 electronic clock

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919317B2 (en) * 1976-09-10 1984-05-04 セイコーインスツルメンツ株式会社 electronic clock
JPS5826525B2 (en) * 1978-01-30 1983-06-03 株式会社寺岡精工所 Digital electronic scale with label printer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE41581E1 (en) 1999-07-12 2010-08-24 Robert Bruce Davies Monolithic low dielectric constant platform for passive components and method
US6759746B1 (en) 2000-03-17 2004-07-06 Robert Bruce Davies Die attachment and method
CN103737824A (en) * 2013-12-11 2014-04-23 思柏精密模具注塑（无锡）有限公司 Latent horizontal-motion precision mold of notebook computer battery cover
CN103737824B (en) * 2013-12-11 2015-12-02 思柏精密模具注塑（无锡）有限公司 The parallel-moving type precision die of hiding of cells in notebook computer lid

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