JPS56148533A - Gate cut-off device for die for injection molding - Google Patents

Gate cut-off device for die for injection molding

Info

Publication number
JPS56148533A
JPS56148533A JP5343480A JP5343480A JPS56148533A JP S56148533 A JPS56148533 A JP S56148533A JP 5343480 A JP5343480 A JP 5343480A JP 5343480 A JP5343480 A JP 5343480A JP S56148533 A JPS56148533 A JP S56148533A
Authority
JP
Japan
Prior art keywords
die
gate
hole
molding
cutter pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5343480A
Other languages
Japanese (ja)
Inventor
Osamu Ikeda
Takashi Komatsuzaki
Yuji Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP5343480A priority Critical patent/JPS56148533A/en
Publication of JPS56148533A publication Critical patent/JPS56148533A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates

Abstract

PURPOSE:To manufacture a molding with high productivity and with no gate traces by arranging a movable cutter pin equipped with a cutting blade in the gate part of a die and cutting a gate while a molding stays inside a die. CONSTITUTION:A through hole which is part of a sprue at the time of injection molding is provided and besides, a cutting blade 15 is installed on the cavity 1 side of the through hole, thus constituting a cutter pin 9. Next, a cutter pin 9 is arranged in a through hole on a movable die and in a guide hole 14 on a movable die 4 in a freely sliding manner to form a gate cutoff device. Resin injected through a spool runner 2 using the above-mentioned device is introduced into a cavity 1 through a gate part 3 formed by both dies 4, 5 and a through hole on the cutter pin 9. Following this procedure, during the process of curing of the filled resin (or during a period until the die is opened after curing), a hydraulic cylinddr 10 is actuated to cause the cuter pin 9 to ascend, so that a gate which is a molding is cut off by the blade 15.
JP5343480A 1980-04-21 1980-04-21 Gate cut-off device for die for injection molding Pending JPS56148533A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5343480A JPS56148533A (en) 1980-04-21 1980-04-21 Gate cut-off device for die for injection molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5343480A JPS56148533A (en) 1980-04-21 1980-04-21 Gate cut-off device for die for injection molding

Publications (1)

Publication Number Publication Date
JPS56148533A true JPS56148533A (en) 1981-11-18

Family

ID=12942731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5343480A Pending JPS56148533A (en) 1980-04-21 1980-04-21 Gate cut-off device for die for injection molding

Country Status (1)

Country Link
JP (1) JPS56148533A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4647275A (en) * 1984-09-27 1987-03-03 Lynn Lundquist Runner shearing assembly for plastic injection molding dies
JPH03106626A (en) * 1989-09-20 1991-05-07 Toshiba Corp Apparatus for cutting gate of plastic molding mold
JPH04102825U (en) * 1991-02-18 1992-09-04 市光工業株式会社 In-mold gate cut pin for thermoplastic injection molding
EP0745954A2 (en) * 1995-05-31 1996-12-04 HERBST, Richard Method of making plastic objects and semi-finished product to be used in the method
EP0693736A3 (en) * 1994-07-21 1997-07-30 Hitachi Maxell Board for IC card and manufacturing method therefor
CN105269773A (en) * 2015-11-17 2016-01-27 重庆持恒模具有限公司 Automatic water opening cutting die
JP2021154503A (en) * 2020-03-25 2021-10-07 トヨタ自動車株式会社 Manufacturing method and manufacturing apparatus for fiber reinforced plastic molded product

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS496844U (en) * 1972-04-18 1974-01-21
JPS5196851A (en) * 1975-02-21 1976-08-25 SHASHUTSUSEIKEIYOKANAGATA
JPS5521125B2 (en) * 1971-10-21 1980-06-07

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521125B2 (en) * 1971-10-21 1980-06-07
JPS496844U (en) * 1972-04-18 1974-01-21
JPS5196851A (en) * 1975-02-21 1976-08-25 SHASHUTSUSEIKEIYOKANAGATA

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4647275A (en) * 1984-09-27 1987-03-03 Lynn Lundquist Runner shearing assembly for plastic injection molding dies
JPH03106626A (en) * 1989-09-20 1991-05-07 Toshiba Corp Apparatus for cutting gate of plastic molding mold
JPH04102825U (en) * 1991-02-18 1992-09-04 市光工業株式会社 In-mold gate cut pin for thermoplastic injection molding
EP0693736A3 (en) * 1994-07-21 1997-07-30 Hitachi Maxell Board for IC card and manufacturing method therefor
US5725819A (en) * 1994-07-21 1998-03-10 Hitachi Maxell, Ltd. Injection molding method for board for IC card
US6191366B1 (en) 1994-07-21 2001-02-20 Hitachi Maxell, Ltd. Board for IC card having component mounting recess
EP0745954A2 (en) * 1995-05-31 1996-12-04 HERBST, Richard Method of making plastic objects and semi-finished product to be used in the method
EP0745954A3 (en) * 1995-05-31 1998-04-29 HERBST, Richard Method of making plastic objects and semi-finished product to be used in the method
CN105269773A (en) * 2015-11-17 2016-01-27 重庆持恒模具有限公司 Automatic water opening cutting die
JP2021154503A (en) * 2020-03-25 2021-10-07 トヨタ自動車株式会社 Manufacturing method and manufacturing apparatus for fiber reinforced plastic molded product
US11440275B2 (en) * 2020-03-25 2022-09-13 Toyota Jidosha Kabushiki Kaisha Method for manufacturing fiber reinforced resin molded article, and manufacturing device thereof

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