JPS6430536U - - Google Patents
Info
- Publication number
- JPS6430536U JPS6430536U JP1987124927U JP12492787U JPS6430536U JP S6430536 U JPS6430536 U JP S6430536U JP 1987124927 U JP1987124927 U JP 1987124927U JP 12492787 U JP12492787 U JP 12492787U JP S6430536 U JPS6430536 U JP S6430536U
- Authority
- JP
- Japan
- Prior art keywords
- display
- solder
- semiconductor chip
- alignment film
- connection electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 230000002265 prevention Effects 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/10175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/38—Effects and problems related to the device integration
- H01L2924/384—Bump effects
- H01L2924/3841—Solder bridging
Landscapes
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987124927U JPS6430536U (ro) | 1987-08-17 | 1987-08-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987124927U JPS6430536U (ro) | 1987-08-17 | 1987-08-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6430536U true JPS6430536U (ro) | 1989-02-23 |
Family
ID=31375079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987124927U Pending JPS6430536U (ro) | 1987-08-17 | 1987-08-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6430536U (ro) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6111132B2 (ro) * | 1979-08-07 | 1986-04-01 | Kotobuki Sangyo |
-
1987
- 1987-08-17 JP JP1987124927U patent/JPS6430536U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6111132B2 (ro) * | 1979-08-07 | 1986-04-01 | Kotobuki Sangyo |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR980006167A (ko) | 버텀리드 반도체 패키지 | |
JPS6430536U (ro) | ||
JPS6430535U (ro) | ||
JPS6237939U (ro) | ||
JPS62180738U (ro) | ||
JPH06326107A (ja) | 半導体素子 | |
JPS6041728Y2 (ja) | 半導体装置 | |
JP2880817B2 (ja) | 半導体集積回路装置 | |
JPH021732U (ro) | ||
JPH0513490A (ja) | 樹脂封止型半導体装置 | |
KR930007920Y1 (ko) | 양면 박막회로판을 갖는 이중 패키지 구조 | |
JPH01283948A (ja) | 樹脂封止型半導体装置 | |
JPH0388350U (ro) | ||
JPS62166636U (ro) | ||
JPH0428245A (ja) | 半導体装置 | |
JPS6364899B2 (ro) | ||
JPS6153934U (ro) | ||
JPS61125054A (ja) | 半導体装置 | |
JPH0373444U (ro) | ||
JPH0343738U (ro) | ||
JPS6413727U (ro) | ||
JPH01125544U (ro) | ||
JPH0298635U (ro) | ||
JPH05283472A (ja) | 半導体装置 | |
JPH0192143U (ro) |