JPS6430536U - - Google Patents
Info
- Publication number
- JPS6430536U JPS6430536U JP1987124927U JP12492787U JPS6430536U JP S6430536 U JPS6430536 U JP S6430536U JP 1987124927 U JP1987124927 U JP 1987124927U JP 12492787 U JP12492787 U JP 12492787U JP S6430536 U JPS6430536 U JP S6430536U
- Authority
- JP
- Japan
- Prior art keywords
- display
- solder
- semiconductor chip
- alignment film
- connection electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 230000002265 prevention Effects 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/10175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/38—Effects and problems related to the device integration
- H01L2924/384—Bump effects
- H01L2924/3841—Solder bridging
Landscapes
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987124927U JPS6430536U (US20030199744A1-20031023-C00003.png) | 1987-08-17 | 1987-08-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987124927U JPS6430536U (US20030199744A1-20031023-C00003.png) | 1987-08-17 | 1987-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430536U true JPS6430536U (US20030199744A1-20031023-C00003.png) | 1989-02-23 |
Family
ID=31375079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987124927U Pending JPS6430536U (US20030199744A1-20031023-C00003.png) | 1987-08-17 | 1987-08-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430536U (US20030199744A1-20031023-C00003.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6111132B2 (US20030199744A1-20031023-C00003.png) * | 1979-08-07 | 1986-04-01 | Kotobuki Sangyo |
-
1987
- 1987-08-17 JP JP1987124927U patent/JPS6430536U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6111132B2 (US20030199744A1-20031023-C00003.png) * | 1979-08-07 | 1986-04-01 | Kotobuki Sangyo |
