JPS6427222A - Manufacture of thin single crystalline film - Google Patents

Manufacture of thin single crystalline film

Info

Publication number
JPS6427222A
JPS6427222A JP9557588A JP9557588A JPS6427222A JP S6427222 A JPS6427222 A JP S6427222A JP 9557588 A JP9557588 A JP 9557588A JP 9557588 A JP9557588 A JP 9557588A JP S6427222 A JPS6427222 A JP S6427222A
Authority
JP
Japan
Prior art keywords
substrate
film
treated
deposited
epitaxial growth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9557588A
Other languages
Japanese (ja)
Inventor
Masahiro Shigeniwa
Kikuo Kusukawa
Masanobu Miyao
Yasuo Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9557588A priority Critical patent/JPS6427222A/en
Publication of JPS6427222A publication Critical patent/JPS6427222A/en
Pending legal-status Critical Current

Links

Landscapes

  • Thin Film Transistor (AREA)
  • Recrystallisation Techniques (AREA)

Abstract

PURPOSE:To prevent ''a surface (111) from growing' by employing a solid epitaxial growth by forming the thickness of an amorphous semiconductor film 1-5mum. CONSTITUTION:Amorphous Si is deposited at 400 deg.C or less of substrate temperature, the thickness of the deposited film is increased 1mum or more, large intrinsic stress is introduced into the Si, then heat-treated to contract the Si, the stress is further increased, and a solid epitaxial growth is performed. That is, an SiO2 film 2 having an opening at a single crystalline Si substrate 1 of plane azimuth (100). A seed region is formed rectangular, and the direction of its side is set to a direction (100) of the substrate crystal 1. This substrate is introduced into an ultrahigh vacuum chamber, the substrate surface is cleaned, Si is deposited to form an amorphous Si film 3. Then, it is immediately heat- treated, and eventually heat-treated in N2 for drying for solid epitaxial growth. Thus, a preferably crystalline SOI structure can be formed by a solid epitaxially growing method.
JP9557588A 1987-04-24 1988-04-20 Manufacture of thin single crystalline film Pending JPS6427222A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9557588A JPS6427222A (en) 1987-04-24 1988-04-20 Manufacture of thin single crystalline film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9974387 1987-04-24
JP9557588A JPS6427222A (en) 1987-04-24 1988-04-20 Manufacture of thin single crystalline film

Publications (1)

Publication Number Publication Date
JPS6427222A true JPS6427222A (en) 1989-01-30

Family

ID=26436786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9557588A Pending JPS6427222A (en) 1987-04-24 1988-04-20 Manufacture of thin single crystalline film

Country Status (1)

Country Link
JP (1) JPS6427222A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6413805B1 (en) 1993-03-12 2002-07-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device forming method
US6730549B1 (en) 1993-06-25 2004-05-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for its preparation
US7709862B2 (en) 2005-08-02 2010-05-04 Honda Motor Co., Ltd. Ion implantation mask and method for manufacturing same, silicon carbide semiconductor device using ion implantation mask, and method for manufacturing same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6413805B1 (en) 1993-03-12 2002-07-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device forming method
US6730549B1 (en) 1993-06-25 2004-05-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for its preparation
US6756657B1 (en) 1993-06-25 2004-06-29 Semiconductor Energy Laboratory Co., Ltd. Method of preparing a semiconductor having controlled crystal orientation
US7709862B2 (en) 2005-08-02 2010-05-04 Honda Motor Co., Ltd. Ion implantation mask and method for manufacturing same, silicon carbide semiconductor device using ion implantation mask, and method for manufacturing same
US8105927B2 (en) 2005-08-02 2012-01-31 Honda Motor Co., Ltd. Method for manufacturing ion implantation mask, and method for manufacturing silicon carbide semiconductor device

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