JPS6426852U - - Google Patents

Info

Publication number
JPS6426852U
JPS6426852U JP12126087U JP12126087U JPS6426852U JP S6426852 U JPS6426852 U JP S6426852U JP 12126087 U JP12126087 U JP 12126087U JP 12126087 U JP12126087 U JP 12126087U JP S6426852 U JPS6426852 U JP S6426852U
Authority
JP
Japan
Prior art keywords
lead frame
lead
utility
view
connecting part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12126087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12126087U priority Critical patent/JPS6426852U/ja
Publication of JPS6426852U publication Critical patent/JPS6426852U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図乃至第3図は、本考案の一実施例を示し
、第1図はリードフレーム平面図、第2図は該リ
ードフレームを接続するときの半田デイツプ状態
を示す図、第3図は半田デイツプ後の状態を示す
図である。第4図は従来のリードフレームの平面
図、第5図は同じくその部分拡大図である。第6
図はリードを接続する部材の一例である基材の平
面図である。第7図は従来技術を示し、第8図は
従来技術の問題点を説明するための模式図である
。 1……リードフレーム、2a〜2f……リード
、3……連結部。
1 to 3 show an embodiment of the present invention, in which FIG. 1 is a plan view of a lead frame, FIG. 2 is a diagram showing a solder dip state when connecting the lead frame, and FIG. FIG. 3 is a diagram showing the state after solder dip. FIG. 4 is a plan view of a conventional lead frame, and FIG. 5 is a partially enlarged view thereof. 6th
The figure is a plan view of a base material that is an example of a member for connecting leads. FIG. 7 shows the prior art, and FIG. 8 is a schematic diagram for explaining the problems of the prior art. 1...Lead frame, 2a to 2f...Leads, 3...Connecting portion.

Claims (1)

【実用新案登録請求の範囲】 複数のリードを連結して成るリードフレームに
おいて、 溶融性物質から成る連結部を有することを特徴
とするリードフリレーム。
[Claims for Utility Model Registration] A lead-free frame comprising a plurality of leads connected together, characterized by having a connecting part made of a fusible substance.
JP12126087U 1987-08-07 1987-08-07 Pending JPS6426852U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12126087U JPS6426852U (en) 1987-08-07 1987-08-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12126087U JPS6426852U (en) 1987-08-07 1987-08-07

Publications (1)

Publication Number Publication Date
JPS6426852U true JPS6426852U (en) 1989-02-15

Family

ID=31368106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12126087U Pending JPS6426852U (en) 1987-08-07 1987-08-07

Country Status (1)

Country Link
JP (1) JPS6426852U (en)

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