JPS642472U - - Google Patents
Info
- Publication number
- JPS642472U JPS642472U JP9653387U JP9653387U JPS642472U JP S642472 U JPS642472 U JP S642472U JP 9653387 U JP9653387 U JP 9653387U JP 9653387 U JP9653387 U JP 9653387U JP S642472 U JPS642472 U JP S642472U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- soldering
- area
- wiring board
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000006071 cream Substances 0.000 description 1
Description
第１図は本考案の印刷配線板の実施例の主要部
上面図、第２図は面実装部品（ＳＯＰ）の１例の
斜視図、第３図は従来の印刷配線板に第２図に示
した面実装部品を実装したときの主要部上面図、
第４図はこの印刷配線板の面実装部品を実装する
前の状態の上面図、第５図は第３図の印刷配線板
の主要部側断面図、第６図は第１図の本考案の印
刷配線板の主要部側断面図、第７図はその印刷配
線板の面実装部品を実装する前の状態の上面図を
示す。
１……面実装部品、３……端子、４……印刷配
線板、５，５ａ，５ｂ……印刷配線パタン、６…
…クリームハンダ、７……ハンダ付け領域、８…
…連結領域。
Fig. 1 is a top view of the main parts of an embodiment of the printed wiring board of the present invention, Fig. 2 is a perspective view of an example of a surface mount component (SOP), and Fig. 3 is a conventional printed wiring board shown in Fig. 2. A top view of the main parts when the surface mount components shown are mounted,
Figure 4 is a top view of this printed wiring board before mounting surface mount components, Figure 5 is a side sectional view of the main parts of the printed wiring board of Figure 3, and Figure 6 is the invention of the invention shown in Figure 1. FIG. 7 is a side sectional view of the main part of the printed wiring board, and FIG. 7 is a top view of the printed wiring board before surface mounting components are mounted thereon. 1...Surface mount component, 3...Terminal, 4...Printed wiring board, 5, 5a, 5b...Printed wiring pattern, 6...
...Cream solder, 7...Soldering area, 8...
...connected area.
Claims (1)
ンダ付け接続するための、連続した印刷配線パタ
ンを有する印刷配線板において、前記印刷配線パ
タンは、あらかじめハンダが塗布されており前記
各端子をそれぞれ受け入れるハンダ付け領域と、
そのハンダ付け領域の間を電気接続する連結領域
とから成り、前記ハンダ付け領域はその幅より狭
い幅の連結領域により電気接続されていることを
特徴とする印刷配線板。 In a printed wiring board having a continuous printed wiring pattern for electrically connecting a plurality of terminals of a surface mount component together by soldering, the printed wiring pattern is coated with solder in advance and connects each of the terminals. Each accepts a soldering area,
A printed wiring board comprising a connecting area for electrically connecting the soldering areas, wherein the soldering area is electrically connected by the connecting area having a width narrower than the width of the soldering area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9653387U JPS642472U (en) | 1987-06-25 | 1987-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9653387U JPS642472U (en) | 1987-06-25 | 1987-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS642472U true JPS642472U (en) | 1989-01-09 |
Family
ID=31321493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9653387U Pending JPS642472U (en) | 1987-06-25 | 1987-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS642472U (en) |
-
1987
- 1987-06-25 JP JP9653387U patent/JPS642472U/ja active Pending