JPS642444Y2 - - Google Patents
Info
- Publication number
- JPS642444Y2 JPS642444Y2 JP1983017800U JP1780083U JPS642444Y2 JP S642444 Y2 JPS642444 Y2 JP S642444Y2 JP 1983017800 U JP1983017800 U JP 1983017800U JP 1780083 U JP1780083 U JP 1780083U JP S642444 Y2 JPS642444 Y2 JP S642444Y2
- Authority
- JP
- Japan
- Prior art keywords
- annular portion
- electronic component
- axis
- annular
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 20
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 4
- 239000011247 coating layer Substances 0.000 claims 1
- 238000007598 dipping method Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1780083U JPS59125842U (ja) | 1983-02-09 | 1983-02-09 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1780083U JPS59125842U (ja) | 1983-02-09 | 1983-02-09 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59125842U JPS59125842U (ja) | 1984-08-24 |
JPS642444Y2 true JPS642444Y2 (ko) | 1989-01-20 |
Family
ID=30149026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1780083U Granted JPS59125842U (ja) | 1983-02-09 | 1983-02-09 | 電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59125842U (ko) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS635245U (ko) * | 1986-06-23 | 1988-01-14 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58180641U (ja) * | 1982-05-25 | 1983-12-02 | 日本電気ホームエレクトロニクス株式会社 | ダイオ−ド |
-
1983
- 1983-02-09 JP JP1780083U patent/JPS59125842U/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS635245U (ko) * | 1986-06-23 | 1988-01-14 |
Also Published As
Publication number | Publication date |
---|---|
JPS59125842U (ja) | 1984-08-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10224138B2 (en) | Electrode structure and the corresponding electrical component using the same and the fabrication method thereof | |
CN101211694A (zh) | 电子部件的引线端子的结构 | |
JPS642444Y2 (ko) | ||
JPH08153601A (ja) | 電子部品 | |
JPS635245Y2 (ko) | ||
KR970006425B1 (ko) | 칩형 콘덴서 및 그 제조방법 | |
US5107324A (en) | Two-terminal semiconductor device of surface installation type | |
JPH0419803Y2 (ko) | ||
JPS6334280Y2 (ko) | ||
US20240147632A1 (en) | Wiring board | |
JPS587842A (ja) | 電子部品 | |
JPH0214193Y2 (ko) | ||
KR930002809B1 (ko) | 2단자 면실장형 반도체장치 | |
JPH11233351A (ja) | 表面実装型コイル部品及びその製造方法 | |
JPH0353474Y2 (ko) | ||
JPH01227413A (ja) | チップ形コンデンサ | |
JPH0234463B2 (ko) | ||
JP2858252B2 (ja) | 表面実装用電子部品の電極構造 | |
JPH037947Y2 (ko) | ||
JPH0522371B2 (ko) | ||
JPH0249758Y2 (ko) | ||
JP2684068B2 (ja) | 積層フィルムコンデンサ | |
JPH027170B2 (ko) | ||
JPH0214194Y2 (ko) | ||
JPS5947749A (ja) | レジンパツケ−ジ型半導体装置 |