JPS642444Y2 - - Google Patents
Info
- Publication number
- JPS642444Y2 JPS642444Y2 JP1983017800U JP1780083U JPS642444Y2 JP S642444 Y2 JPS642444 Y2 JP S642444Y2 JP 1983017800 U JP1983017800 U JP 1983017800U JP 1780083 U JP1780083 U JP 1780083U JP S642444 Y2 JPS642444 Y2 JP S642444Y2
- Authority
- JP
- Japan
- Prior art keywords
- annular portion
- electronic component
- axis
- annular
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 20
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 4
- 239000011247 coating layer Substances 0.000 claims 1
- 238000007598 dipping method Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
「技術分野」
本考案は、チツプ部品としての使用を可能にし
た電子部品に関するものである。[Detailed Description of the Invention] "Technical Field" The present invention relates to an electronic component that can be used as a chip component.
「従来技術」
電子機器の小形化が進み、そこに使われる電子
部品の自動化実装および高密度実装の要求が強ま
るにつれて、従来広く用いられてきた同軸リード
タイプの電子部品もチツプ部品として使用できる
ことが要求されてきた。同軸リードタイプを置き
換えたチツプ部品としては、部品本体の両端にキ
ヤツプ状の電極を設け、この電極をプリント基板
の配線導体に接着するものが知られている。第１
図はその１例を示す電子部品の部品断面図で、１
は樹脂体、２はリード線、３はキヤツプ状電極、
４ははんだである。しかし、この構造では部品点
数の増加および組立の複雑化によりコストアツプ
が避けられなかつた。"Prior Art" As electronic devices become smaller and the demands for automated mounting and high-density mounting of the electronic components used in them grow, it has become clear that coaxial lead type electronic components, which have been widely used in the past, can also be used as chip components. It has been requested. As a chip component replacing the coaxial lead type, one is known in which cap-shaped electrodes are provided at both ends of the component body and these electrodes are bonded to wiring conductors on a printed circuit board. 1st
The figure is a cross-sectional view of an electronic component showing one example.
is a resin body, 2 is a lead wire, 3 is a cap-shaped electrode,
4 is solder. However, this structure inevitably increases costs due to an increase in the number of parts and complicated assembly.
そこで、第２図のように、リード線２の先端を
つば状に圧延加工して、つば状部分５を接続端子
として利用する構造も考えられる。しかし、樹脂
体１に近接してつば状部分５を形成するのは圧延
加工上困難である。また、つば状部分５を十分大
面積にすると、つば状部分５の厚さは薄くなつて
しまい、つば状部分５の機械的強度の点からも、
またはんだ付けによる回路基板への接着強度の点
からも実用上好ましくない。 Therefore, as shown in FIG. 2, a structure may be considered in which the tip of the lead wire 2 is rolled into a flange shape and the flange-shaped portion 5 is used as a connection terminal. However, it is difficult to form the flange-like portion 5 close to the resin body 1 in terms of rolling process. Furthermore, if the area of the brim-shaped portion 5 is made sufficiently large, the thickness of the brim-shaped portion 5 becomes thin, and from the viewpoint of mechanical strength of the brim-shaped portion 5,
Also, it is not practically preferred from the viewpoint of adhesive strength to a circuit board by soldering.
「考案の目的」
本考案は、上記従来の欠点を解決するためのも
ので、チツプ部品としての使用が可能で、しかも
安価で製造も容易な同軸リードタイプの電子部品
を提供するものである。``Purpose of the invention'' The present invention is intended to solve the above-mentioned conventional drawbacks, and provides a coaxial lead type electronic component that can be used as a chip component, is inexpensive, and is easy to manufacture.
「実施例」
第３図ａは同軸リードタイプのシリコンダイオ
ードで、シリコンチツプ（図示せず）の両主面に
はんだ付けされた銀被覆銅リード線２（直径0.6
mm）が円柱状エポキシ樹脂体１（直径2.7mm、長
さ5.0mm）の両端から導出されている。``Example'' Figure 3a shows a coaxial lead type silicon diode, with silver-coated copper lead wires 2 (diameter 0.6
mm) are led out from both ends of the cylindrical epoxy resin body 1 (diameter 2.7 mm, length 5.0 mm).
まず、リード線２を樹脂体１の端に沿つて同一
方向に垂直に折り曲げる。次に、リード線２の折
り曲げ部から先１mm以上の部分を、両側のリード
線２の軸を含む平面に平行にプレスして、厚さ約
0.3mm幅１mmの偏平な形状とする。続いて、リー
ド線２の折り曲げ部から約6.3mmの部分でリード
線２を切断する。リード線２の切断面は、リード
線２の軸から45゜傾けられている。第３図ｂにそ
の状態を示す。更に、第３図ｃに示すように、リ
ード線２の偏平部分を樹脂体１の円柱と同じ外径
を有するように環状に折り曲げ、環状部分６を形
成する。このとき、斜めに切断されたリード線２
の切断面を内側に向けて環状の折り曲げをするこ
とによつて、環状部６の切れ目７を小さくしてい
る。 First, the lead wire 2 is bent vertically in the same direction along the edge of the resin body 1. Next, a portion of the lead wire 2 extending 1 mm or more from the bent portion is pressed parallel to a plane containing the axes of the lead wires 2 on both sides to a thickness of approximately 1 mm.
It should be a flat shape with a width of 0.3mm and a width of 1mm. Subsequently, the lead wire 2 is cut at a portion approximately 6.3 mm from the bent portion of the lead wire 2. The cut surface of the lead wire 2 is inclined at 45 degrees from the axis of the lead wire 2. The state is shown in FIG. 3b. Furthermore, as shown in FIG. 3c, the flat portion of the lead wire 2 is bent into an annular shape so as to have the same outer diameter as the cylinder of the resin body 1, thereby forming an annular portion 6. At this time, the lead wire 2 cut diagonally
The cut 7 of the annular portion 6 is made smaller by bending the annular portion 6 into an annular shape with the cut surface facing inward.
更に、この状態のシリコンダイオードを溶融は
んだ槽に浸漬する。この結果、第３図ｄのよう
に、リード線２にはんだ層８が形成される。はん
だ層８は、環状部分６の内側では、ここを埋める
ように膜状に形成されている。リード線２の先端
部では、切れ目７を補うようにはんだ層８が被着
されている。その他の部分でのはんだ層８はごく
薄いものである。 Further, the silicon diode in this state is immersed in a molten solder bath. As a result, a solder layer 8 is formed on the lead wire 2, as shown in FIG. 3d. The solder layer 8 is formed in a film shape inside the annular portion 6 so as to fill the area. A solder layer 8 is applied to the tip of the lead wire 2 to compensate for the cut 7. The solder layer 8 in other parts is extremely thin.
第３図ｅはこうして作成されたシリコンダイオ
ードをプリント基板に実装した状態を示す。９は
絶縁基板、１０は配線導体、１１は接着剤、１２
ははんだである。 FIG. 3e shows the silicon diode thus produced mounted on a printed circuit board. 9 is an insulating substrate, 10 is a wiring conductor, 11 is an adhesive, 12
is solder.
「考案の効果」
以上、実施例について説明したように、本考案
によれば、チツプ部品として使用することが可能
で、しかも安価で製造も容易な電子部品を提供す
ることができる。このため、電子機器の小形化や
生産性向上に貢献することができる。また、外部
端子となる環状部分６が筒状であるため、配線導
体１０への接着面積が大きくなり、配線導体１０
との位置合わせが容易であるとともに接着強度の
大きい接続ができる。更に、環状部分６は円柱状
の一般のリード線に比べて表面積が大きいため、
電子部品の熱放散も良好である。"Effects of the Invention" As described above with respect to the embodiments, according to the present invention, it is possible to provide an electronic component that can be used as a chip component, and is inexpensive and easy to manufacture. Therefore, it can contribute to downsizing and improving productivity of electronic devices. Furthermore, since the annular portion 6 serving as the external terminal is cylindrical, the adhesive area to the wiring conductor 10 is large, and the wiring conductor 10
This allows for easy positioning and a connection with high adhesive strength. Furthermore, since the annular portion 6 has a larger surface area than a general cylindrical lead wire,
Heat dissipation of electronic components is also good.
「応用例」
なお、本考案は上記実施例に限定されることな
く、種々の変形・応用が可能である。以下、これ
について説明する。"Application Examples" The present invention is not limited to the above embodiments, and various modifications and applications are possible. This will be explained below.
(i) 環状部分６が円形を描いている形状が、配線
導体１０への装着時にリード軸の回転方向にお
ける方向性がなくなるので作業性が良く、最も
望ましいと言える。しかし、樹脂体１が四角柱
等の角柱であるときなどは、これに合せて環状
部分６が多角形を描くようにしてもよい。な
お、環状部分６が完全に閉じた円形あるいは多
角形を描くのは製造上困難であるし、実用上、
その必要もない。(i) The shape in which the annular portion 6 is circular is the most desirable because it eliminates the directionality in the rotational direction of the lead shaft when attached to the wiring conductor 10, resulting in good workability. However, when the resin body 1 is a rectangular prism such as a quadrangular prism, the annular portion 6 may draw a polygon to match this. It should be noted that it is difficult in manufacturing to draw the annular portion 6 in a completely closed circle or polygon, and in practical terms,
There's no need for that.
(ii) 円形を描いた環状部分６と円柱状の樹脂体１
の外径が略同一である形状が、全体が一定の径
の円柱と見なせるため、配線導体１０への装着
作業が最も容易である。しかし、環状部分６を
樹脂体１より大径にすることも、またその反対
に小径にすることもあり得る。環状部分６が多
角形を描いているような場合でも同様で、全体
が一定の径の角柱と見なせるようにするのが使
いやすいが、これに限られるものではない。(ii) A circular annular portion 6 and a cylindrical resin body 1
Since a shape in which the outer diameters of the wires are substantially the same can be regarded as a cylinder having a constant diameter as a whole, the work of attaching the wires to the wiring conductor 10 is easiest. However, the annular portion 6 may have a larger diameter than the resin body 1, or vice versa. The same applies to the case where the annular portion 6 is a polygon, and it is convenient to make the entire portion look like a prism with a constant diameter, but the invention is not limited to this.
(iii) 電子部品の小形化という見地から、環状部分
６は樹脂体１の端面にできるだけ近接させてい
る。ただし、配線導体１０のパターンと合わせ
るために環状部分６を樹脂体１の端部からある
程度離す必要がでてくることも考えられる。こ
のときは、環状部分６に加わる外力によるテコ
の作用が大きくなり、リード線２が樹脂体１か
ら出た部分で曲がりやすいので、電子部品の取
扱に注意を要する。(iii) From the standpoint of miniaturizing electronic components, the annular portion 6 is placed as close to the end surface of the resin body 1 as possible. However, it may be necessary to separate the annular portion 6 from the end of the resin body 1 to some extent in order to match the pattern of the wiring conductor 10. At this time, the lever action due to the external force applied to the annular portion 6 increases, and the lead wire 2 tends to bend at the portion where it comes out from the resin body 1, so care must be taken when handling the electronic component.
(iv) 環状部分６が樹脂体１の端部を巻いた構造と
すると、環状部分６の間隔が小さくできるの
で、配線導体１０のパターン間隔を小さくで
き、実装密度の向上に有利である。また、環状
部分６を樹脂体１にほとんど密着させるので、
環状部分６が外力によつて変形する心配が少な
い。(iv) If the annular portion 6 is wound around the end of the resin body 1, the spacing between the annular portions 6 can be reduced, so the pattern spacing of the wiring conductors 10 can be reduced, which is advantageous for improving the packaging density. In addition, since the annular portion 6 is brought into close contact with the resin body 1,
There is little fear that the annular portion 6 will be deformed by external force.
(v) 溶融はんだ中への浸漬によるリード線２への
はんだ層８の形成は省略することも可能であ
る。しかし、環状部分６の外周面は曲げ加工等
によつてひつかかりやすくなつている場合もあ
る。特にリード線２の先端は、切断面であるた
めひつかかりやすい状態である。また、リード
線２の先端で環状部分６に切れ目７ができるの
が通常であり、これによつてもひつかかりやす
い状態になつている。このため、電子部品の自
動化実装のために自動機を使用するとき、電子
部品の送り装置内で電子部品がひつかかつて自
動機を止めてしまうという不都合が発生しやす
い。その点、溶融はんだ中への浸漬によるはん
だ層８を形成すれば、このひつかかりの問題が
解消されて好都合である。(v) It is possible to omit the formation of the solder layer 8 on the lead wire 2 by immersion in molten solder. However, the outer peripheral surface of the annular portion 6 may be easily snagged due to bending or other processes. In particular, the tip of the lead wire 2 is easily snagged because it is a cut surface. Also, a cut 7 is usually formed in the annular portion 6 at the tip of the lead wire 2, which also makes it easily snagged. For this reason, when an automatic machine is used for automated mounting of electronic components, the electronic components are likely to be snagged in the electronic component feeder, causing the automatic machine to stop. In this regard, if the solder layer 8 is formed by immersion in molten solder, the snagging problem is solved, which is convenient.
第１図、第２図は従来例を示すもので、第１図
は部分断面とした正面図、第２図は正面図および
側面図である。第３図ａ〜ｅは本考案の第１の実
施例を説明するためのもので、同図ａ，ｅは正面
図、同図ｂ，ｃ，ｄは正面図および側面図であ
る。
１は樹脂体（絶縁封止体）、２はリード線、６
はリード線の環状部分、８ははんだ層。
1 and 2 show a conventional example, in which FIG. 1 is a partially sectional front view, and FIG. 2 is a front view and a side view. Figures 3a to 3e are for explaining the first embodiment of the present invention; figures a and e are front views, and figures b, c and d are front views and side views. 1 is a resin body (insulating sealing body), 2 is a lead wire, 6
8 is the annular part of the lead wire, and 8 is the solder layer.
Claims (1)
縁封止体の両端からそれぞれ１本づつ導出され
た電子部品において、前記２本のリード線のそ
れぞれが前記絶縁封止体側から順次丸棒部と偏
平部を有しており、前記棒状部に折り曲げ部が
形成されることにより前記偏平部が前記軸から
前記絶縁封止体の外周側に偏位しており、前記
偏平部は前記軸を取り巻くように実質的に環状
に巻かれた環状部分から成る筒状の外部接続端
子を形成していることを特徴とする電子部品。 (2) 前記絶縁封止体が前記軸を中心軸とする円柱
であり、前記環状部分は前記軸を中心軸とする
円筒状である実用新案登録請求の範囲第１項記
載の電子部品。 (3) 前記環状部分の外径が前記絶縁封止体の外径
と略等しい実用新案登録請求の範囲第２項記載
の電子部品。 (4) 前記環状部分が前記絶縁封止体の両端近傍に
おいて前記絶縁封止体を取り巻いている実用新
案登録請求の範囲第１項または第２項記載の電
子部品。 (5) 前記環状部分を有するリード線に溶融はんだ
中への浸漬によるはんだ被覆層が形成されてい
る実用新案登録請求の範囲第１項、第２項、第
３項、または第４項記載の電子部品。[Claims for Utility Model Registration] (1) In an electronic component in which two lead wires extending along substantially the same axis are led out from each end of an insulating seal, Each has a round bar part and a flat part in order from the insulating sealing body side, and by forming a bent part in the rod-shaped part, the flat part is biased from the axis toward the outer circumferential side of the insulating sealing body. an electronic component, wherein the flat part forms a cylindrical external connection terminal consisting of an annular part wound substantially in an annular shape so as to surround the axis. (2) The electronic component according to claim 1, wherein the insulating seal is a cylinder having the axis as the central axis, and the annular portion is cylindrical with the axis as the central axis. (3) The electronic component according to claim 2, wherein the outer diameter of the annular portion is approximately equal to the outer diameter of the insulating sealing body. (4) The electronic component according to claim 1 or 2, wherein the annular portion surrounds the insulating seal in the vicinity of both ends of the insulating seal. (5) The utility model registration claim 1, 2, 3, or 4, wherein the lead wire having the annular portion is coated with a solder coating layer by dipping it into molten solder. electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1780083U JPS59125842U (en) | 1983-02-09 | 1983-02-09 | electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1780083U JPS59125842U (en) | 1983-02-09 | 1983-02-09 | electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59125842U JPS59125842U (en) | 1984-08-24 |
| JPS642444Y2 true JPS642444Y2 (en) | 1989-01-20 |
Family
ID=30149026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1780083U Granted JPS59125842U (en) | 1983-02-09 | 1983-02-09 | electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59125842U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS635245U (en) * | 1986-06-23 | 1988-01-14 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58180641U (en) * | 1982-05-25 | 1983-12-02 | 日本電気ホームエレクトロニクス株式会社 | diode |
-
1983
- 1983-02-09 JP JP1780083U patent/JPS59125842U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS635245U (en) * | 1986-06-23 | 1988-01-14 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59125842U (en) | 1984-08-24 |
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