JPS59125842U - electronic components - Google Patents

electronic components

Info

Publication number
JPS59125842U
JPS59125842U JP1780083U JP1780083U JPS59125842U JP S59125842 U JPS59125842 U JP S59125842U JP 1780083 U JP1780083 U JP 1780083U JP 1780083 U JP1780083 U JP 1780083U JP S59125842 U JPS59125842 U JP S59125842U
Authority
JP
Japan
Prior art keywords
annular portion
axis
electronic component
sealing body
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1780083U
Other languages
Japanese (ja)
Other versions
JPS642444Y2 (en
Inventor
隆昭 横山
Original Assignee
サンケン電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by サンケン電気株式会社 filed Critical サンケン電気株式会社
Priority to JP1780083U priority Critical patent/JPS59125842U/en
Publication of JPS59125842U publication Critical patent/JPS59125842U/en
Application granted granted Critical
Publication of JPS642444Y2 publication Critical patent/JPS642444Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図は従来例を示すもので、第1図は部分断
面とした正面図、第2図は正面図および側面図である。 第3図a〜eは本考案の第1の実施例を説明するための
もので、同図a、  eは正面図、同図す、  c、 
 dは正面図および側面図である。 1は樹脂体(絶縁封止体)、2はリード線、6はリード
線の環状部分、8ははんだ層。 (C) ・用i甲 璽
1 and 2 show a conventional example, in which FIG. 1 is a partially sectional front view, and FIG. 2 is a front view and a side view. Figures 3a to 3e are for explaining the first embodiment of the present invention; figures a and e are front views;
d is a front view and a side view. 1 is a resin body (insulating sealing body), 2 is a lead wire, 6 is an annular portion of the lead wire, and 8 is a solder layer. (C) ・For

Claims (5)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)実質的に同一の軸に沿う2本のリード線が絶縁封
止体の両端からそれぞれ1本づつ導出された電子部品に
おいて、前記2本のリード線のそれぞれが前記軸を取り
巻(ように実質的に環状に曲げられた環状部分を有し、
前記2本のリード線のうち少なくとも前記環状部分を偏
平なリード線とすることによって前記環状部分を筒状と
なし、これら筒状をなす環状部分を外部接続端子として
使用することを特徴とする電子部品。
(1) In an electronic component in which two lead wires extending along substantially the same axis are led out from each end of an insulating seal, each of the two lead wires surrounds the axis ( having an annular portion bent into a substantially annular shape,
An electronic device characterized in that at least the annular portion of the two lead wires is made into a flat lead wire so that the annular portion has a cylindrical shape, and these cylindrical annular portions are used as external connection terminals. parts.
(2)前記絶縁封止体が前記軸を中心軸とする円柱であ
り、前記環状部分は前記軸を中心軸とする円筒状である
実用新案登録請求の範囲第1項記載の電子部品。
(2) The electronic component according to claim 1, wherein the insulating seal is a cylinder having the axis as its central axis, and the annular portion has a cylindrical shape having the axis as its central axis.
(3)  前記円環状部分の外径が前記円柱状の絶縁封
止体の外径と略等しい実用新案登録請求の範囲第2項記
載の電子部品。
(3) The electronic component according to claim 2, wherein the outer diameter of the annular portion is approximately equal to the outer diameter of the cylindrical insulating sealing body.
(4)  前記環状部分が前記絶縁封止体の両端近傍に
 ゛おいて前記絶縁封止体を取り巻いている実用新案登
録請求の範囲第1項または第2項記載の電子部品。
(4) The electronic component according to claim 1 or 2, wherein the annular portion surrounds the insulating sealing body near both ends of the insulating sealing body.
(5)  前記環状部分を有するリード線に溶融はんだ
中への浸漬によるはんだ被覆層が形成されている実用新
案登録請求の範囲第1項、第2項、第3項、または第4
項記載の電子部品。
(5) Utility model registration claim 1, 2, 3, or 4, in which a solder coating layer is formed on the lead wire having the annular portion by dipping it into molten solder.
Electronic components listed in section.
JP1780083U 1983-02-09 1983-02-09 electronic components Granted JPS59125842U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1780083U JPS59125842U (en) 1983-02-09 1983-02-09 electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1780083U JPS59125842U (en) 1983-02-09 1983-02-09 electronic components

Publications (2)

Publication Number Publication Date
JPS59125842U true JPS59125842U (en) 1984-08-24
JPS642444Y2 JPS642444Y2 (en) 1989-01-20

Family

ID=30149026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1780083U Granted JPS59125842U (en) 1983-02-09 1983-02-09 electronic components

Country Status (1)

Country Link
JP (1) JPS59125842U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58180641U (en) * 1982-05-25 1983-12-02 日本電気ホームエレクトロニクス株式会社 diode
JPS635245U (en) * 1986-06-23 1988-01-14

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58180641U (en) * 1982-05-25 1983-12-02 日本電気ホームエレクトロニクス株式会社 diode
JPS635245U (en) * 1986-06-23 1988-01-14

Also Published As

Publication number Publication date
JPS642444Y2 (en) 1989-01-20

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