JPS5879931U - Overtemperature rise prevention device - Google Patents
Overtemperature rise prevention deviceInfo
- Publication number
- JPS5879931U JPS5879931U JP17599781U JP17599781U JPS5879931U JP S5879931 U JPS5879931 U JP S5879931U JP 17599781 U JP17599781 U JP 17599781U JP 17599781 U JP17599781 U JP 17599781U JP S5879931 U JPS5879931 U JP S5879931U
- Authority
- JP
- Japan
- Prior art keywords
- prevention device
- rise prevention
- overtemperature rise
- overtemperature
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Fuses (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の温度ヒユーズの断面図、第2図はその動
作後の状態を示す断面図、第3図はそのリード線を折り
曲げた状態を示す断面図である。
第4図および第5図はこの考案の異なる実施例の温度ヒ
ユーズの断面図である。
11、 12,21.22・・・・・・リード線、11
a。
12a、21a、22a・・・・・・膨大部、5・・・
・・・包囲体(絶縁筒体)、6. 7. 25・・・・
・・包囲体(封止樹脂)。FIG. 1 is a sectional view of a conventional temperature fuse, FIG. 2 is a sectional view showing the state after operation, and FIG. 3 is a sectional view showing the state in which the lead wires are bent. 4 and 5 are cross-sectional views of temperature fuses of different embodiments of this invention. 11, 12, 21.22...Lead wire, 11
a. 12a, 21a, 22a... ampullary part, 5...
...enveloping body (insulating cylindrical body), 6. 7. 25...
... Envelope (sealing resin).
Claims (1)
止樹脂よりなる包囲体内に収容してなる温度過昇防止装
置において、前記リード線の封止樹脂との外側封止境界
部に膨大部を設けたことを特徴とする温度過昇防止装置
。In an overtemperature rise prevention device in which a temperature-sensitive operating part is housed in an envelope made of a sealing resin, at least a portion from which a lead wire is led out, an enlarged portion is provided at an outer sealing boundary between the lead wire and the sealing resin. A temperature overrise prevention device characterized by being provided with.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17599781U JPS5879931U (en) | 1981-11-25 | 1981-11-25 | Overtemperature rise prevention device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17599781U JPS5879931U (en) | 1981-11-25 | 1981-11-25 | Overtemperature rise prevention device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5879931U true JPS5879931U (en) | 1983-05-30 |
JPS6128361Y2 JPS6128361Y2 (en) | 1986-08-22 |
Family
ID=29968649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17599781U Granted JPS5879931U (en) | 1981-11-25 | 1981-11-25 | Overtemperature rise prevention device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5879931U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006228661A (en) * | 2005-02-21 | 2006-08-31 | Anzen Dengu Kk | Thermal fuse |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3309481A (en) * | 1965-03-04 | 1967-03-14 | Micro Devices Corp | Thermal switch with thermally collapsible member |
JPS54114738U (en) * | 1978-02-01 | 1979-08-11 |
-
1981
- 1981-11-25 JP JP17599781U patent/JPS5879931U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3309481A (en) * | 1965-03-04 | 1967-03-14 | Micro Devices Corp | Thermal switch with thermally collapsible member |
JPS54114738U (en) * | 1978-02-01 | 1979-08-11 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006228661A (en) * | 2005-02-21 | 2006-08-31 | Anzen Dengu Kk | Thermal fuse |
Also Published As
Publication number | Publication date |
---|---|
JPS6128361Y2 (en) | 1986-08-22 |
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