JPS5923749U - electronic components - Google Patents

electronic components

Info

Publication number
JPS5923749U
JPS5923749U JP11701682U JP11701682U JPS5923749U JP S5923749 U JPS5923749 U JP S5923749U JP 11701682 U JP11701682 U JP 11701682U JP 11701682 U JP11701682 U JP 11701682U JP S5923749 U JPS5923749 U JP S5923749U
Authority
JP
Japan
Prior art keywords
annular portion
axis
electronic component
insulating seal
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11701682U
Other languages
Japanese (ja)
Other versions
JPS635245Y2 (en
Inventor
隆昭 横山
Original Assignee
サンケン電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by サンケン電気株式会社 filed Critical サンケン電気株式会社
Priority to JP11701682U priority Critical patent/JPS5923749U/en
Publication of JPS5923749U publication Critical patent/JPS5923749U/en
Application granted granted Critical
Publication of JPS635245Y2 publication Critical patent/JPS635245Y2/ja
Granted legal-status Critical Current

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Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図は従来例を示すもので、第1図は部分断
面とした正面図、第2図は正面図および側面図である。 第3図a〜dは本考案の第1の実施例を説明するための
もので、同図a、  dは正面図、同図す、  cは正
面図および側面図である。第4区は本考案の第2の実施
例′を示す正面図および側面図である。 1・・・樹脂体(絶縁封止体)、2・・・リート線、6
・・・リード線の環状部分、7・・・はんだ層。
1 and 2 show a conventional example, in which FIG. 1 is a partially sectional front view, and FIG. 2 is a front view and a side view. Figures 3a to 3d are for explaining the first embodiment of the present invention; Figures a and 3d are front views, and Figures 3 and 3 are front and side views. Section 4 is a front view and a side view showing a second embodiment of the present invention. 1...Resin body (insulating sealing body), 2...Leet wire, 6
. . . Annular portion of the lead wire, 7 . . . Solder layer.

Claims (5)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)実質的に同一の軸に沿う2本のリード線が絶縁封
止体の両端からそれぞれ1本づつ導出された電子部品に
おいて、前記2本のリード線のそれぞれが前記軸を取り
巻くように実質的に環状に曲げられた環状部分を有し、
これら環状部分が外部接続用端子であることを特徴とす
る電子部品。−
(1) In an electronic component in which two lead wires extending along substantially the same axis are led out from each end of an insulating seal, each of the two lead wires surrounds the axis. having an annular portion bent into a substantially annular shape;
An electronic component characterized in that these annular portions are external connection terminals. −
(2)前記絶縁封止体か前記軸を中心軸とする円柱であ
り、前記環状部分が、概略、前記軸に垂直な面内にお、
いて前記軸を中心軸として円を描くように形成された円
環状部分である実用新案登録請求の範囲第1項記載の電
子部品。
(2) The insulating seal is a cylinder whose central axis is the axis, and the annular portion is approximately in a plane perpendicular to the axis.
The electronic component according to claim 1, which is registered as a utility model and is an annular portion formed to draw a circle with the axis as the central axis.
(3)前記円環状部分の外径が前記円柱状の絶縁封止体
の外径と略等しい実用新案登録請求の範囲第2項記載の
電子部品。
(3) The electronic component according to claim 2, wherein the outer diameter of the annular portion is approximately equal to the outer diameter of the cylindrical insulating sealing body.
(4)前記環状部分が前記絶縁封止体の両端近傍におい
て前記絶縁封止体を取り巻いている実用新案登録゛請求
の範囲第1項または第2項記載の電子部品。
(4) The electronic component according to claim 1 or 2, wherein the annular portion surrounds the insulating seal in the vicinity of both ends of the insulating seal.
(5)前記環状部分を有するリード線に溶融はんだ中へ
の浸漬によるはんだ被覆層が形成されている実用新案登
録請求の範囲第1項、第2項、第3項、または第4項記
載の電子部品。
(5) Utility model registration claim 1, 2, 3, or 4, wherein the lead wire having the annular portion has a solder coating layer formed by dipping it into molten solder. electronic components.
JP11701682U 1982-07-31 1982-07-31 electronic components Granted JPS5923749U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11701682U JPS5923749U (en) 1982-07-31 1982-07-31 electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11701682U JPS5923749U (en) 1982-07-31 1982-07-31 electronic components

Publications (2)

Publication Number Publication Date
JPS5923749U true JPS5923749U (en) 1984-02-14
JPS635245Y2 JPS635245Y2 (en) 1988-02-12

Family

ID=30269531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11701682U Granted JPS5923749U (en) 1982-07-31 1982-07-31 electronic components

Country Status (1)

Country Link
JP (1) JPS5923749U (en)

Also Published As

Publication number Publication date
JPS635245Y2 (en) 1988-02-12

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