JPH0419803Y2 - - Google Patents

Description

[Detailed Description of the Invention] "Technical Field" The present invention relates to an electronic component that can be used as a chip component.

"Prior Art" As electronic devices become smaller and the demands for automated mounting and high-density mounting of the electronic components used in them grow, it has become clear that coaxial lead type electronic components, which have been widely used in the past, can also be used as chip components. It has been requested. As a chip component replacing the coaxial lead type, one is known in which cap-shaped electrodes are provided at both ends of the component body and these electrodes are bonded to wiring conductors on a printed circuit board. 1st
The figure is a partial cross-sectional view of an electronic component showing one example.
is a resin body, 2 is a lead wire, 3 is a cap-shaped electrode,
4 is solder. However, this structure inevitably increases costs due to an increase in the number of parts and complicated assembly.

Therefore, as shown in FIG. 2, a structure may be considered in which the tip of the lead wire 2 is rolled into a flange shape and the flange-shaped portion 5 is used as a connection terminal. However, it is difficult to form the flange-like portion 5 close to the resin body 1 in terms of rolling process. Furthermore, if the area of the brim-shaped portion 5 is made sufficiently large, the thickness of the brim-shaped portion 5 becomes thin, and from the viewpoint of mechanical strength of the brim-shaped portion 5,
Also, it is not practically preferred from the viewpoint of adhesive strength to a circuit board by soldering.

"Purpose of the invention" The present invention is intended to solve the above-mentioned conventional drawbacks, and its purpose is to provide a coaxial lead type electronic component that can be used as a chip component, is inexpensive, and is easy to manufacture. do.

"First Embodiment" Hereinafter, an embodiment of the present invention will be described based on the drawings.

Figure 3a shows a coaxial lead type silicon diode, with silver-coated copper lead wires 2 (diameter 0.6
mm) are led out from both ends of the cylindrical epoxy resin body 1 (diameter 2.7 mm, length 5.0 mm).

First, the lead wire 2 is bent vertically in the same direction along both ends of the resin body 1. Next, the lead wire 2 is cut at a point approximately 6.3 mm from the bent portion of the lead wire 2 at a plane that makes an angle of 45° with a plane containing the axes of both of the bent lead wires 2. The external shape at that time is shown in FIG. 3b. Subsequently, the lead wire 2 is bent into an annular shape, with the acute angle portion 2a of the distal end face of the diagonally cut lead wire 2 facing outside and the obtuse angle portion 2b facing inside, thereby forming an annular portion 6. The annular portion 6 is
Roughly speaking, a circular ring having the same central axis and the same outer diameter is drawn for the cylindrical resin body 1. This state is shown in FIG. 3c.

Further, the silicon diode in this state is immersed in a molten solder bath. As a result, the lead wire 2 is coated with the solder layer 7, as shown in FIG. 3d. The solder layer 7 is formed like a film on the inside of the annular portion 6 so as to fill it (in the drawings, it is shown as if the solder layer 7 is formed to a thickness equal to the lead wire diameter for simplification). Although the solder layer 7 is actually quite thin). Furthermore, a solder layer 7 is applied to the tip of the lead wire 2 to compensate for the fact that the annular portion 6 is not completely closed. The solder layer 7 in other parts is extremely thin.

FIG. 3e shows the silicon diode thus produced mounted on a printed circuit board. 8 is an insulating substrate, 9 is a wiring conductor, 10 is an adhesive, and 11 is a solder.

"Second Embodiment" FIG. 4 shows another embodiment of the present invention.
Similarly, it is formed by bending the lead wire 2 of the silicon diode shown in FIG.
This corresponds to the stage in Figure c. In this example, the annular portion 6 wraps around the end of the resin body 1. Therefore, when dipping into a molten solder bath, a film-like solder layer 7 is not formed inside the annular portion 6.
Otherwise, the solder layer 7 is in the same state as in FIG. 3d.
is formed.

The state in which this silicon diode is mounted on a printed circuit board is also similar to that shown in FIG. 3e. However, since the spacing between the annular portions 6 can be made smaller, the pattern spacing of the wiring conductors 9 can be made smaller than in FIG. 3e, which is advantageous in improving the packaging density. Furthermore, since the annular portion 6 is brought into close contact with the resin body 1, there is little concern that the annular portion 6 will be deformed by external force.

"Effects of the Invention" As described above with respect to the embodiments, according to the present invention, it is possible to provide an electronic component that can be used as a chip component, and is inexpensive and easy to manufacture. Therefore, it can contribute to downsizing and improving productivity of electronic devices.

Further, as shown in FIG. 5, when the lead wire 2 is cut vertically, the annular portion 6 is annularly shaped approximately 1
Since it is a wrapped type, a fairly large gap 12 is created. In the present invention, the tip end surface of the lead wire 2 is cut diagonally as shown in FIG. 3b, so that the cutout 12 is compensated for by the tip end surface of the lead wire 2, as shown in FIG. 3c. , the annular portion 6 approaches a completely closed ring. Furthermore,
In the present invention, since the cutout 12 is almost completely closed with solder, an external connection terminal is formed that is thin in width (one round) and has an outer circumferential shape close to a perfect circle. As a result,
The probability that electronic components will get stuck in an electronic component feeding device for automated mounting is reduced. Further, since there is no directionality in the rotational direction of the lead shaft when it is attached to the wiring conductor 9, workability is good. Furthermore, since the external connection terminal is thin, it meets the requirements for miniaturization and high-density packaging of chip components.

"Application Examples" Note that the present invention is not limited to the above embodiments, and various modifications and applications are possible within the scope of the spirit of the present invention. For example, if the outer diameters of the annular portion 6 and the cylindrical resin body 1 are approximately the same, the entire body can be regarded as a cylinder with a constant diameter, so that attachment to the wiring conductor 9 is easiest. However, the annular portion 6
It is also possible to make the diameter of the resin body larger than that of the resin body 1 (for example, the fourth
), or vice versa, it is possible to make the diameter smaller.

[Brief explanation of the drawing]

1 and 2 show a conventional example, in which FIG. 1 is a partially sectional front view, and FIG. 2 is a front view and a side view. Figures 3a to 3e are for explaining the first embodiment of the present invention; figures a and e are front views, and figures b, c and d are front views and side views. FIG. 4 is a front view and a side view showing a second embodiment of the present invention. FIG. 5 is a side view showing a reference example for explaining the present invention. 1 is a resin body (insulating sealing body), 2 is a lead wire, 2
2b is an obtuse angle portion, 6 is an annular portion of the lead wire, 7 is a solder layer, and 12 is a missing annular portion.

Claims (1)

[Claims for Utility Model Registration] (1) Two lead wires extending along substantially the same axis are led out from each end of the insulating seal, and each of the two lead wires extends along the axis. The lead wire has an annular portion that is wound approximately once around the annular portion to serve as an external connection terminal, and the tip end surface of the lead wire, which is the end of the winding of the annular portion, is an inclined surface cut diagonally; an acute angle portion of the inclined surface is located on the outer peripheral surface side of the annular portion;
The obtuse angle portion of the inclined surface is located on the inner circumferential surface side of the annular portion, the acute angle portion of the inclined portion is close to the winding start portion of the annular portion so as to compensate for the lack of the annular portion, and the tip end surface An electronic component characterized in that solder is applied to the annular portion so as to substantially close the gap in the annular portion. (2) The insulating seal is a cylinder having the axis as the central axis, and the annular portion is formed approximately in a circle in a plane perpendicular to the axis with the axis as the central axis. An electronic component according to claim 1 of the utility model registration claim. (3) The electronic component according to claim 2, wherein the outer diameter of the annular portion is approximately equal to the outer diameter of the cylindrical insulating seal. (4) The electronic component according to claim 1 or 2, wherein the annular portion surrounds the insulating seal in the vicinity of both ends of the insulating seal. (5) The application of the solder is performed by dipping the annular portion into molten solder. electronic components.