JPH10172822A - Coiled electronic parts and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve reliability and productivity by remarkably reducing disconnection of coil lead wire. SOLUTION: A groove 16 is so formed that its depth gradually increases from the side of the end of a bobbin toward the side of a core. Joint is performed in such a manner that a lead wire 20 is trailed along the groove 16. The lead wire 20 is press-fixed corresponding to the depth of the groove 16, and the thickness thereof gradually increases from the side of the end of the bobbin toward the side of the core. (C-2) is a view of the groove 16 shown from the side of the end surface of a flange part 14. And (C-3) is that shown from the side of the core of the flange part 14. In the press-fixed lead wire 20, the form of thickness thereof does not abruptly change, but gradually changes containing a bent part. As a result, the occurrence of disconnection of wire frequently occurred in the part between the joint part and a winding part of the lead wire 20 is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a winding type electronic component such as an inductor, a transformer, a choke coil and the like and a method of manufacturing the same, and more particularly to an improvement against winding breakage.

[0002]

2. Description of the Related Art Various types of wound electronic components have already been put into practical use.
Various improvements have also been made. For example, 51-1
No. 15547 discloses that a coil is wound around a core portion of a core (coil bobbin) having a flange portion at an end portion, and a conductive layer is formed on a peripheral surface of the flange portion. And a fixed inductance element that is also connected to a conductive portion of a printed circuit board. Japanese Utility Model Laid-Open Publication No. 56-110612 discloses an inductance element in which a groove is formed in a flange portion and a coil end is accommodated in the groove.

Japanese Patent Application Laid-Open No. 57-73916 discloses that a terminal of a coil wound around the center of a core is connected to a conductor layer formed on a flange at an end of the core, and an electrode is provided on an end face after resin sealing. Are disclosed. Further, Japanese Utility Model Application Laid-Open No. 61-144616 discloses a chip coil in which a winding lead-out groove is provided in a square flange portion to lead a lead wire, and an electrode is also provided on a side surface of the flange portion.

As described above, the wire-wound electronic component has a structure in which a coil is wound around a core portion and a lead wire of the coil is joined to an electrode of a flange portion. The joining of the coil lead wire to the flange portion is performed by a method such as thermocompression bonding. FIG. 10A shows a state at the time of joining. A coil 903 is wound around a core 902 of a core having a square flange 900 at the end. An electrode 904 is formed on the end face and side face of the flange 900 by a suitable method such as a dipping method using a conductive (silver) paste. The lead wire 906 of the coil 903 is thermocompression-bonded to the electrode 902 of the flange 900 as shown by an arrow FA. More specifically, as shown in FIG. 7B, pressure is applied by a heated pressing member 907 having an oblique portion, and the leading end of the lead wire 906 is cut. The electrode portion is thereafter plated.

When the cross section of the crimping portion of the lead wire 906 is viewed, as shown in FIG. 1B, the thickness changes greatly at the bent position. That is, the crimping portion 908 is crushed flat, and this is continuous with the cylindrical portion 910 having the original shape. For this reason, an external force acts intensively between the joint portion of the lead wire 906 and the winding portion, and has a property of becoming weak at the bent portion.

FIG. 2C shows another winding core shape, and a concave portion 912 for accommodating the lead wire 906 is formed on the side surface of the flange portion 900. Leader line 906
When this is accommodated in the concave portion 912, it becomes as shown in FIG. In the case of such a configuration, the center of the lead line of the recess 912 and the center of the lead line on the core side are at an angle of substantially 90 degrees, and the bending stress is large.
Of course, the same applies to the example of FIG.

On the other hand, in the plating step or the like, a large number of wire-wound electronic components are usually put into a plating tank and rub against each other. Recently, wound-type electronic components have also become so-called bulk compatible, and a large number of wound-type electronic components have been housed in containers and taken out by suction. Also in this case, the wound-type electronic components rub against each other. Then, there is a possibility that the bent portion of the lead wire 906 is affected by the friction and eventually breaks.

Next, a coated copper wire is generally used as the coil 903, but it is necessary to remove the coating at the joint with the electrode 904. As a method of peeling the coating, there are a mechanical (physical) peeling method and a chemical peeling method.
However, the copper wire is easily damaged by the mechanical stripping method, which increases the possibility of disconnection. In addition, the chemical stripping method does not cause such inconveniences, but has disadvantages such as difficulty in precision of stripping margin and difficulty in accuracy of inductance value.

The present invention focuses on the above points,
An object of the present invention is to provide a wound-type electronic component and a method of manufacturing the same, which can reduce disconnection of a coil lead wire and improve reliability and productivity.

[0010]

In order to achieve the above object, in a wire wound electronic component according to the present invention, a lead wire of a coil wound around a core portion of a core is joined to an electrode of a flange portion. In the wire-wound electronic component, a groove is formed on the side surface of the flange portion so as to be deeper from a core end to a core, and the lead wire and the electrode are joined by the groove.

In another aspect of the invention, a groove deeper than the lead wire is formed on the side surface of the flange, and the lead wire and the electrode are joined by this groove. Or, a rounded portion is formed at a corner portion on the core side of the flange portion,
The lead wire is bent along this rounded portion and joined to the electrode. Alternatively, the electrode is formed on the core side of the flange, and the lead wire is joined to the electrode on the core side of the flange. In addition, a buffer layer is formed between the core-side corner of the flange and the lead wire.

In still another invention, a step or a groove for joining the lead wire and the electrode is formed on the side surface of the flange so as to be inclined with respect to the longitudinal direction of the winding core. Alternatively, a groove is formed on the side surface of the flange along the winding direction of the coil, and the lead wire and the electrode are joined by this groove. Alternatively, a conductive resin layer is formed at a joint between the lead wire and the electrode. Alternatively, the lead wire is pulled out from a position away from the flange portion, or a groove is formed on the side surface of the flange portion to join the lead wire and the electrode, and the groove is filled with the exterior.

In the manufacturing method according to the present invention, the lead wire may be
It is characterized in that it is joined to the electrode in a state where the coating is applied. According to the main mode, at the time of joining the lead wires, the covering at the joining site is removed by the coating removing agent. Another manufacturing method is characterized in that the paint is applied in a plurality of times.

The above and other objects, features, and advantages of the present invention will be apparent from the following detailed description and the accompanying drawings.

[0015]

Embodiments of the present invention will be described below in detail with reference to examples.

Embodiment 1 First, Embodiment 1 will be described with reference to FIG. FIG. 1A shows a core 1 according to the first embodiment.
The main part of 0 is shown. In FIG.
The flanges 14 each having a quadrangular prism shape or a quadrangular end face are provided at the ends of the core portion 12. Note that only one flange 14 is shown in the figure. A groove 16 having a substantially V-shaped cross section is formed on each side surface of the flange portion 14.

FIG. 2B shows a cross section of the groove 16 as viewed in the direction of the arrow along the line # 1- # 1 in FIG.
As shown in the figure, the groove 16 has a shape whose depth gradually increases from the core end side toward the core side. An electrode 18 for connecting a coil lead wire is formed on an end surface and a side surface of the flange portion 14 having such a groove 16.

The core 10 having the flanges 14 at both ends of the core 12 is formed by firing ferrite or alumina, for example. The electrode 18 formed on the surface of the flange portion 14 has a thin or thick film layer of 1 to 30 μm made of Ag, Ag-Pd, Ag-Pt, Cu, etc., and Ni, Sn, It is formed of a 1-10 μm plating layer of Sn—Pb or the like. In addition, as an example of the dimensions, the length of the core is about 1.6 mm, and the width and height are about 0.1 mm.
It is about 8 mm. The diameter of the core part at the center of the winding core is 0.2-0.
7 mm, and the width of the flange 16 is 0.2 to 0.5 mm.

Next, the operation of this embodiment will be described. FIG. 1C-1 shows a state where the lead wire is pressure-bonded to the electrode 18 by the groove 16 described above. That is, the lead wire 20 is crimped in accordance with the depth of the groove 16,
The thickness gradually increases from the core end toward the core.
Viewing the groove 16 from the end face side of the flange portion 14 is as shown in FIG. Further, when the groove 16 is viewed from the core side of the flange portion 14, it becomes as shown in FIG. As described above, according to the present embodiment, the thickness of the lead wire 20 that has been crimped does not suddenly change, but gradually changes including the bent portion. Therefore, compared to the background art shown in FIG. 10B, the occurrence of disconnection concentrated between the joining portion of the lead wire 20 and the winding portion is reduced.

FIG. (D-1) shows a modification.
In this example, the groove 22 is deeper on the core side than in the above-described embodiment, and has a depth substantially equal to the diameter of the lead wire 20. For this reason, the groove 2 from the end face side of the flange portion 14
2 is the same as that of the above embodiment (D-2), but when the groove 22 is viewed from the core side of the flange portion 14, it is as shown in the same figure (D-3). . That is, the bent portion on the core side has a thickness substantially corresponding to the diameter of the lead wire 20. For this reason, the change in the thickness shape of the lead wire 20 from the end of the core to the side of the core becomes more gentle compared to the above-described embodiment, and the occurrence of disconnection is further reduced.
In the above example, the groove 16 is configured to be gradually deepened, but may be configured to be gradually deepened. The groove shape is V
Any suitable shape other than the letter shape may be used.

FIG. 2 shows another modification. In the above embodiment, the lead wire 20 was bonded to the electrode 18 by crimping, but in this example, the bonding was performed by a conductive bonding means such as a conductive paste, that is, a conductive resin (conductive adhesive), a solder paste, or plating. Will be FIG. 7A is a cross section along the end surface of the flange portion 14, and FIG.
It is the cross section seen in the arrow direction along line 2- # 2. In these figures, a groove 1 having a substantially U-shaped cross section is provided on the side surface of the flange portion 14.
7 are provided, and the depth thereof is set sufficiently larger than the diameter of the lead wire 20. The electrode 18 is
Is also formed. Leader wire 20 stored in groove 17
Is bonded to the electrode 18 by the conductive paste 19. With such a configuration, the thickness of the lead wire 20 does not change at all, and disconnection due to a sudden change in the thickness is favorably prevented.

[0021]

Second Embodiment Next, a second embodiment will be described with reference to FIG. Each figure shows a longitudinal section of the core. First, the embodiment of (A) has a configuration in which a round portion 32 is formed on the core side of the flange portion 30. The lead wire 20 is wound around the core portion 12 along the rounded portion 32 from the side surface of the flange portion 30. Therefore, the lead wire 20 does not bend at an acute angle as shown in FIG. 10D, and the bending stress is reduced. Further, the lead wire does not come into contact with the sharp corner portion (top portion) of the flange portion, so that the occurrence of disconnection or damage can be prevented.

In the embodiment shown in FIG. 2B, an electrode 34 is formed up to the core side of the flange portion 14, and the lead wire 20 is joined to the core side by an appropriate method such as welding. Junction point 36
And the coil 38 is coated with paint (not shown),
It is not exposed to the outside. Therefore, there is no danger of breaking even if the components rub during plating or bulk mounting. The embodiment shown in FIG. 9C is based on the same viewpoint, and the electrode 40
Are formed not only on the surface of the flange portion 14 but also on the end portion of the core portion 12. The lead wire 20 is connected to the core 12
It is joined by an appropriate method such as welding at the position of the inner electrode 42 formed above.

In the example shown in FIG. 2D, an electrode 44 is formed on the entire surface of the flange portion 14 as in the example shown in FIG. 1B, and the lead wire 20 is crimped through the electrode 44. I have. That is, the core-side corner portion 46 of the flange portion 14 is also covered by the electrode 44, and the lead wire 20 is in contact with the electrode 44 via the electrode 44. For this reason, the lead wire 20 rubs against the electrode 44, but since the same metal is used and the electrode 44 functions as a buffer layer, the occurrence of stress is reduced and the occurrence of disconnection is also reduced. In this example, the metal layer of the electrode is provided as a buffer layer between the flange portion and the lead wire, but another material may be provided as the buffer layer. For example, an organic material or a carbon layer is suitable.

In the example shown in FIG. 2E, a step 52 is formed on the core side of the flange 50, and an electrode 54 is formed up to the step 52. The lead wire 20 is joined to the electrode 54 on the step 52 by an appropriate method such as welding. Also in this example, the joining point 55 and the coil 38 are covered with a paint (not shown) and are not exposed to the outside, similarly to the examples of (B) and (C) described above. Therefore, there is no danger of breaking even if the components rub during plating or bulk mounting.

[0025]

Third Embodiment Next, a third embodiment will be described with reference to FIG. FIG. 7A shows the element body 60 before the core is obtained. The element body 60 has the length of the core, and the cutout portion 62 is formed at the end so as to be rotationally symmetric. The thickness Δt of the cutout 62 substantially corresponds to the diameter of the lead wire, and the width Δw is equal to or less than half of the entire width of the element body 60. When processing is performed except for a part of both ends of the element body 60, a core 64 as shown in FIG.
At the end of the central core 66 of the winding core 64, there is a flange 68,
The flange portion 68 has a step 70 corresponding to the above-described cutout portion 62. Electrodes are formed on the end face and side face of the flange 68, including the surface of the step 70.

FIG. 3C shows the manner in which the coil lead wire 20 is joined to the core 64 as described above. The lead wire 20 is obliquely laid over the step 70 of the flange 68 from the core side, and is crimped to the electrode 72 on the step 70. Since the step 70 is formed relatively wide, the lead wire 20 can be joined obliquely to the longitudinal direction of the core 64. For this reason, the bending of the lead wire 20 at the joint position between the lead wire 20 and the corner of the flange portion 68 is small,
The bending stress is also small. Therefore, disconnection of the lead wire can be reduced favorably. In addition, the winding width is increased, and the number of turns of the coil is increased to increase the L (inductance) value, or there is an advantage that the DC resistance value is reduced by using a thick winding. As shown in FIG. 4D, a step 82 may be provided at the center of the side surface of the flange portion 80. However, if the width is too large, the protruding portion 84 at the end is likely to chip.

[0027]

Embodiment 4 Next, Embodiment 4 will be described with reference to FIG. The embodiments shown in the figure are all examples of various shapes of the groove formed on the side surface of the flange portion. First, in the example shown in FIG. 1A, a tapered groove 102 is formed in a center portion of a side surface of a flange portion (including an electrode) 100. The groove 102
It has a tapered shape that gradually opens from the core end side toward the core side. By forming the groove 102 in such a tapered shape, the bending stress of the coil lead wire 20 at the flange angle is reduced, and the disconnection is also reduced.

In the example shown in FIG. 2B, an arc-shaped groove 104 is formed by further expanding the taper shape. FIG. 4C corresponds to the embodiment of FIG.
A wide groove 106 is formed at the center of the side surface of the. The width of the groove 106 is set in consideration of the chipping described with reference to FIG. By bending the coil lead wire 20 obliquely in the groove 106, bending stress can be similarly reduced.

The example shown in FIG. 5D is an example in which the groove 108 is formed obliquely. The example shown in FIG. 9E is an example in which two grooves 110 are formed in an X shape. In the example of FIG.
The direction of relaxing the bending stress of the lead wire is only one direction along the groove 108, which is inconvenient in coil winding operation. However, in the example of FIG. 7E, the stress relaxing directions are two opposite directions, which is convenient for coil winding work. FIGS. 11F and 11G show a modification of FIG. 11E, in which the grooves 112 and 114 are changed from an X-shape to a V-shape. (F) is a shape that opens from the core side to the core end side, and (G) is a shape that opens from the core end side to the core side. FIG. 17H is a modification of FIG.
Has a bent configuration. FIG. 1I is a modified example of FIG. 1C, in which the groove 118 has a wider configuration. By doing so, the bending angle of the coil is further reduced.

In any of the examples, the bending angle of the lead wire at the core side angle of the flange portion is increased, so that bending stress is eased, and thus breakage is reduced favorably. Further, since the joining distance between the lead wire and the electrode is longer than the width of the flange portion, the coupling force between the lead wire and the electrode is also improved. In addition, in the example of FIG. 4, all the shapes of the groove viewed from the side surface of the flange portion are used. However, if various groove shapes of the end surface side as shown in FIG. Can be reduced.

[0031]

Embodiment 5 Next, Embodiment 5 will be described with reference to FIG. As described above, a coated copper wire is generally used as the coil, but it is necessary to remove the coating at the joint with the electrode. However, stripping the coating has disadvantages such as easy disconnection. Therefore, in this embodiment,
The joining of the coils is started without stripping the coating to reduce the occurrence of disconnection. In the following example,
A case where the lead wire is crimped to the electrode by an ultrasonic crimping method will be described.

FIG. 6A shows a state before crimping. An electrode 202 is formed on the surface of the flange 200, and a lead wire 204 runs on one side surface. The lead wire 204 is held down by the ultrasonic vibrator 206. In this state, the arrow FB is shown in FIG.
When the ultrasonic vibrator 206 is vibrated, the coating 204A of the lead wire 204 is broken and the copper wire 204B is exposed, and the copper wire 204B is further pressed to the electrode 202 as shown by.

Here, as shown by the arrow FC, a gas for removing the coating is blown. When a reducing gas, for example, a nitrogen balance gas (forming gas) containing 2 vol (volume)% or less of hydrogen is blown to the joint, carbonization of the coating material is prevented and decomposition and evaporation occur. Alternatively, when an oxidizing gas such as an oxygen gas is blown, the coating material becomes carbon dioxide. As a result, the coating 204A on the pressure bonding interface and the peripheral portion is removed satisfactorily. Figure (C)
Shows the state after crimping, the copper wire 204B is crimped to the electrode 202, and the coating 204A is removed.

As described above, according to this embodiment, the lead wire is pressure-bonded to the electrode while covering the lead wire. For this reason, the possibility of disconnection due to mechanical removal of the coating from the copper wire is prevented. Unnecessary coating is removed with a reducing gas or an oxidizing gas. Therefore, plating can be performed satisfactorily without adverse effects of the carbonized coating material on the plating process. A similar effect can be obtained by thermocompression in addition to ultrasonic compression. Thermocompression bonding and soldering may be combined. The coating may be removed by immersion in a solvent (liquid) that dissolves the coating in addition to the gas.

[0035]

Sixth Embodiment Next, a sixth embodiment will be described with reference to FIG. First, the example shown in FIG.
Grooves 304 and 306 formed in 0 and 302, respectively,
It is formed in a direction along the winding direction of the coil 308. For this reason, similarly to the above-described embodiment, the flange portions 300, 30
The bend angle on the core side of No. 2 is made obtuse, and disconnection is prevented. In the example shown in FIGS. 6B and 6C, the pulling out of the coil 322 wound around the core portion 320 is performed by the flange portion 3.
By performing the operation from a position slightly distant from 24, the bending angle of the lead wire 326 at the corner of the flange 324 is reduced, and disconnection is prevented.

[0036]

Seventh Embodiment Next, a seventh embodiment will be described with reference to FIG. First, in the example shown in FIG.
The conductive resin layers 416 and 418 are formed so as to cover the joint portions between the electrodes 404 and 406 of No. 02 and the leads 412 and 414 of the coil 410 wound around the core 408. The conductive resin layers 416 and 418 are formed, for example, by applying a conductive resin paste containing Ag by a dipping method and thermosetting (to 1).
80 ° C.). The Paloma method may be used. The coil 410 is provided with an exterior coat 420, and the surfaces of the conductive resin layers 416 and 418 are plated 42
2,424 are applied. According to the present embodiment, the electrode 40
The joints between the lead wires 406 and the lead wires 412 414 are reliably covered with the conductive resin layers 416 418 to be surely protected during mounting. In addition, the conductive resin layer 4
There is also an advantage that the protrusion of the exterior coat 420 is hidden by 16, 418.

Next, the example shown in FIG. 8B is a case where the uncovered (gap) 426 exists between the electrode 404 and the outer coat 420 in the above (A). If there is such a coating residue 426, the lead wire 41 is formed at this portion.
2 is exposed, causing disconnection. However, in the present embodiment, the remaining 4
The portion 26 is covered and protected, and the disconnection is well prevented. The example of FIG. (C) shows the conductive resin layer 4 shown in (B).
This is an example in which 16 is formed only on the side surface of the flange 400.
The same applies to the opposite flange 402.

[0038]

Embodiment 8 Next, Embodiment 8 will be described with reference to FIG. (A) is a plan view, (B) is # 9 of (A).
FIG. 11 is a cross-sectional view taken in the direction of the arrow along line # 9. As shown in these figures, in this embodiment, wide grooves 502 are formed on each side surface of the flange portion 500, respectively.
An electrode 504 is formed on the side and end surfaces of the zero. A coil 508 is wound around the core portion 506, and the lead wire 510 is diagonally joined to the groove 502. In the present embodiment, the outer coat 512 of the core portion 506 is used.
The groove 502 is filled. For this reason, the lead wire 510 is protected by the exterior coat 512, the disconnection of the lead wire 510 is prevented, and the side surface of the flange portion is flattened, so that the attraction during mounting is improved.

[0039]

Other Embodiments There are many embodiments of the present invention, and various modifications can be made based on the above disclosure. For example, the following is also included. (1) In the above-described embodiment, the core has a cylindrical shape at the center of the core and a square core at the flange. However, various types of core shapes may be used, such as a square central portion at the core. There may be one groove in the flange for joining the coil lead wire, but if provided on the side surface of the flange, it is convenient for mounting and characteristic adjustment. The material used for each part may be appropriately selected as needed. (2) The above embodiments may be combined. For example, the embodiment of FIG. 1 and the embodiment of FIG. 5 are combined, and the embodiment of FIGS. 1 to 5 and the embodiment of FIG. 6 are combined.

(3) In the above embodiment, the electrodes are formed by silver paste or the like, but various methods such as plating, sputtering, and vapor deposition may be used. (4) In the above embodiment, the present invention was mainly applied to an inductor.
It can be applied to various wire-wound electronic components such as transformers and bead arrays. Further, the present invention is similarly applicable to a vertical wound electronic component having a flange at only one end of the core. (5) In the above embodiment, silver paste was used.
A paste such as u, Ni, Ni-Cr or a conductive resin may be used.

[0041]

As described above, the present invention has the following effects. (1) Form a groove that gradually becomes deeper from the end toward the core from the end, or a groove that is deeper than the lead wire diameter, and form a rounded part at the corner of the flange on the core side. Forming a step or groove for joining the lead wire and the electrode so as to be oblique to the longitudinal direction, forming a groove in the flange along the coil winding direction of the core, etc. As we decided to reduce the bending stress of the lead wire that bends at the corner of
Disconnection of the coil lead wire can be reduced favorably, and reliability and productivity can be improved. (2) Since the electrode is formed on the core side of the flange portion and the lead wire is joined to the electrode on the core side of the flange portion, the lead wire is not exposed to the outside, and the disconnection thereof is well prevented.

(3) Since the buffer layer is formed between the core-side corner portion of the flange portion and the lead wire, the influence of friction during plating and bulk mounting is reduced, and the disconnection is likewise caused. Good reduction. (4) Since the lead wire is bonded to the electrode in a state where the coating is attached, the occurrence of disconnection is reduced more favorably than when the coating is mechanically peeled off. (5) Since the conductive resin layer is formed at the joint between the coil lead wire and the electrode, the joint is well protected and disconnection is prevented. (6) Since the groove is filled with the exterior material, the lead wire is protected and the disconnection is prevented.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing a modification of the first embodiment.

FIG. 3 is a diagram showing a second embodiment of the present invention.

FIG. 4 is a diagram showing a third embodiment of the present invention.

FIG. 5 is a diagram showing a fourth embodiment of the present invention.

FIG. 6 is a diagram showing a fifth embodiment of the present invention.

FIG. 7 is a diagram showing a sixth embodiment of the present invention.

FIG. 8 is a diagram showing a seventh embodiment of the present invention.

FIG. 9 is a diagram showing an eighth embodiment of the present invention.

FIG. 10 is a view showing a state of joining a coil lead wire to a flange portion.

[Explanation of symbols]

10, 64, 310 ... core 12, 66, 320, 408, 506 ... core part 14, 30, 50, 68, 80, 100, 200, 30
0, 302, 324, 400, 402, 500... Flanges 16, 22, 102, 104, 106, 108, 11
0, 112, 114, 116, 304, 306, 502
... grooves 18.34, 40, 44, 72, 202, 404, 40
6,504 ... electrode 20,204,326,412,414,510 ... lead wire of coil 32 ... rounded portion 36,54 ... junction point 38,308,312,322,410,508 ... coil 42 ... inner electrode 46 ... Core side corners 52, 70, 82 Step 60 Element body 62 Cutout 84 Projection 204A Coating 204B Copper wire 206 Ultrasonic transducer 314, 316 Paint 416, 418 Conductive resin layer 420 , 512 ... Exterior coat 422, 424 ... Plating 426 ... Remaining coating

Continued on the front page (72) Inventor Kazuhiko Otsuka 6-16-20 Ueno, Taito-ku, Tokyo Within Taiyo Denki Co., Ltd. (72) Inventor Nobuhiro Umeyama 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Stock Inside the company (72) Inventor Takayuki Uehara 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Inventor Iwao Fujikawa 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd.

Claims (12)

[Claims] 1. A wound electronic component in which a coil is wound around a core portion of a core provided with a flange portion, and a lead wire of the coil is joined to an electrode on a side surface of the flange portion. A wound type electronic component, wherein a groove is formed on a side surface of the flange portion so as to be deeper from an end of a winding core toward a core portion, and a lead wire and an electrode are joined by the groove. 2. A wound electronic component in which a coil is wound around a core portion of a core provided with a flange portion, and a lead wire of the coil is joined to an electrode on a side surface of the flange portion. A wire-wound electronic component, wherein a groove deeper than the lead wire is formed on a side surface of the flange portion, and the lead wire and an electrode are joined by the groove. 3. A wound electronic component in which a coil is wound around a core portion of a core provided with a flange portion, and a lead wire of the coil is joined to an electrode on a side surface of the flange portion. A wire-wound electronic component, wherein a rounded portion is formed at a corner on the core side of the flange portion, and a lead wire is bent along the rounded portion and joined to an electrode. 4. A wire-wound electronic component in which a coil is wound around a core portion of a core provided with a flange portion, and a lead wire of the coil is joined to an electrode of the flange portion. Is formed on the core side of the flange portion, and the lead wire is joined to the electrode on the core side of the flange portion. 5. A wound electronic component in which a coil is wound around a core portion of a core provided with a flange portion, and a lead wire of the coil is joined to an electrode on a side surface of the flange portion. A wound-type electronic component, wherein a buffer layer is formed between a core-side corner of the flange and a lead wire. 6. A wound electronic component in which a coil is wound around a core portion of a core provided with a flange portion, and a lead wire of the coil is joined to an electrode on a side surface of the flange portion. A winding type electronic component, wherein a step or a groove for joining a lead wire and an electrode is formed on a side surface of the flange so as to be oblique to a longitudinal direction of a winding core. 7. A wound electronic component in which a coil is wound around a core portion of a core provided with a flange portion, and a lead wire of the coil is joined to an electrode on a side surface of the flange portion. A wire-wound electronic component, wherein a groove is formed on a side surface of the flange along a winding direction of the coil, and a lead wire and an electrode are joined by the groove. 8. A wound electronic component in which a coil is wound around a core portion of a core provided with a flange portion, and a lead wire of the coil is joined to an electrode on a side surface of the flange portion. A wire-type electronic component, wherein a conductive resin layer is formed at a joint between the lead wire and the electrode. 9. A coil is wound around a core portion of a core provided with a flange portion, and a lead wire of the coil is joined to an electrode on a side surface of the flange portion. The wound-type electronic component according to claim 1, wherein the lead wire is drawn from a position away from the flange. 10. A coil is wound around a core portion of a core provided with a flange portion, and a lead wire of the coil is joined to an electrode on a side surface of the flange portion. The wound electronic component according to claim 1, wherein a groove is formed on a side surface of the flange to join the lead wire and the electrode, and the groove is filled with the exterior member. 11. A method of manufacturing a wire-wound electronic component in which a coil is wound around a core portion of a core provided with a flange portion, and a lead wire of the coil is joined to an electrode on a side surface of the flange portion. A method for manufacturing a wire-wound electronic component, comprising: joining a wire to the electrode while the wire is covered. 12. The method of manufacturing a wire-wound electronic component according to claim 11, wherein the coating at the joining site is removed by a coating removing agent at the time of joining the lead wires.