JPH0216520Y2 - - Google Patents
Info
- Publication number
- JPH0216520Y2 JPH0216520Y2 JP13022983U JP13022983U JPH0216520Y2 JP H0216520 Y2 JPH0216520 Y2 JP H0216520Y2 JP 13022983 U JP13022983 U JP 13022983U JP 13022983 U JP13022983 U JP 13022983U JP H0216520 Y2 JPH0216520 Y2 JP H0216520Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- hole
- metal tube
- lead wire
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 13
- 239000011810 insulating material Substances 0.000 claims description 6
- 230000002265 prevention Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Insulating Bodies (AREA)
Description
【考案の詳細な説明】
(a) 考案の技術分野
本考案は、筐体に貫通接着する端子のシヨート
防止構造に係り、とくに端子の当接部を半田の付
着し難い金属材料で形成した端子のシヨート防止
構造に関するものである。[Detailed description of the invention] (a) Technical field of the invention The invention relates to a structure for preventing shortening of terminals that are bonded through the housing, and is particularly concerned with terminals in which the abutting part of the terminal is made of a metal material that is difficult to adhere to with solder. This relates to a shot prevention structure.
(b) 従来技術の問題点
第１図は、従来の取付け構造を説明するための
要部断面図で、１は筐体、２は端子、３は半田、
１１はリード線用外導体穴、１２は端子接着穴、
２１は金属管、２２はリード線である。(b) Problems with the conventional technology Figure 1 is a sectional view of the main parts to explain the conventional mounting structure, in which 1 is the housing, 2 is the terminal, 3 is the solder,
11 is the outer conductor hole for the lead wire, 12 is the terminal adhesive hole,
21 is a metal tube, and 22 is a lead wire.
導電性の良好な金属たとえば銅等からなる筐体
１の所定位置にリード線用外導体穴１１および端
子接着穴１２を設け、該リード線用外導体穴１１
および端子接着穴１２に貫通接着する端子２を、
コバール等からなる金属管２１に絶縁材料例えば
ガラス等を介してリード線２２を固着した前記端
子２を筐体１に設けたリード線用外導体穴１１お
よび端子接着穴１２に挿通して、前記金属管２１
との当接部を半田３で接着している。ところが半
田付けの際に半田３が前記リード線用外導体穴１
１とリード線２２の隙間に流れ込み、該リード線
２２と筐体１とがシヨートするという問題点があ
つた。 An outer conductor hole 11 for a lead wire and a terminal bonding hole 12 are provided at predetermined positions of a housing 1 made of a metal with good conductivity, such as copper, and the outer conductor hole 11 for a lead wire is provided at a predetermined position.
and the terminal 2 to be bonded through the terminal bonding hole 12,
The terminal 2, in which a lead wire 22 is fixed to a metal tube 21 made of Kovar or the like through an insulating material such as glass, is inserted into the outer conductor hole 11 for the lead wire and the terminal adhesive hole 12 provided in the housing 1. metal tube 21
The abutting part is bonded with solder 3. However, during soldering, the solder 3 is attached to the lead wire outer conductor hole 1.
1 and the lead wire 22, and the lead wire 22 and the housing 1 were shot.
(c) 考案の目的
本考案は、上記従来の問題点に鑑み、端子当接
部を半田の付着し難い金属材料で形成しリード線
用外導体穴を設けたブツシユを圧入した端子のシ
ヨート防止構造を提供することを目的とするもの
である。(c) Purpose of the invention In view of the above-mentioned conventional problems, the present invention has been developed to prevent shortening of terminals in which the terminal abutment part is made of a metal material that does not easily adhere to solder, and a bush with an outer conductor hole for the lead wire is press-fitted. The purpose is to provide structure.
(d) 考案の構成
前述の目的を達成するために本考案は、金属管
にリード線を絶縁部材で固着してなる端子を筐体
に半田付けするに際し、該筐体に設けた前記端子
当接部を半田の付着し難い材料とし、リード線用
外導体穴を設けたブツシユを圧入したことによつ
て達成される。(d) Structure of the invention In order to achieve the above-mentioned object, the present invention provides a method for soldering a terminal formed by fixing a lead wire to a metal tube with an insulating material to a casing. This is achieved by making the contact part of a material that is difficult to adhere to with solder and press-fitting a bush with an outer conductor hole for the lead wire.
(e) 考案の実施例
以下図面を参照しながら本考案に係る端子のシ
ヨート防止構造の実施例について詳細に説明す
る。(e) Embodiments of the invention Examples of the terminal shot prevention structure according to the invention will be described in detail below with reference to the drawings.
第２図は、本考案に係る端子のシヨート防止構
造の一実施例を説明するための要部断面図で、前
図と同等の部分については同一符号を付してお
り、４はブツシユ、１２は端子接着穴である。 FIG. 2 is a cross-sectional view of the main parts for explaining one embodiment of the terminal shot prevention structure according to the present invention, in which the same parts as in the previous figure are given the same reference numerals, 4 is a bush, 12 is a is the terminal adhesive hole.
端子２はコバール等からなる金属管２１に絶縁
材料例えばガラス等を介してリード線２２を固着
して構成される。導電性の良好な金属たとえば銅
等からなる筐体１に該端子２を接続するための穴
を設けるには、先ず、所定位置に該金属管の外径
とほぼ同じ径の端子接着穴を設ける。次に該端子
接着穴１２に、筒状のブツシユ４を、該筐体の表
面より奥まで圧入する。該ブツシユ４は半田の付
着し難い材料たとえばアルミニウム、ステンレス
鋼等で形成し、該端子接着穴１２の径とほぼ同じ
外径を有し、且つ該リード線が接触しないよう該
リード線２２の径より大きい内径のリード線用外
導体穴を設ける。そして、該ブツシユ４を圧入し
た端子接着穴に１２に、前記端子２を該ブツシユ
４と当接するまで挿通して、該金属管２１の周囲
を該端子接着穴１２の該ブツシユ４と接していな
い内壁に半田で接着する。 The terminal 2 is constructed by fixing a lead wire 22 to a metal tube 21 made of Kovar or the like through an insulating material such as glass. To provide a hole for connecting the terminal 2 to the housing 1 made of a metal with good conductivity, such as copper, first, a terminal bonding hole with a diameter approximately the same as the outer diameter of the metal tube is provided at a predetermined position. . Next, the cylindrical bush 4 is press-fitted into the terminal bonding hole 12 to the depth below the surface of the casing. The bush 4 is made of a material to which solder does not easily adhere, such as aluminum or stainless steel, and has an outer diameter that is approximately the same as the diameter of the terminal bonding hole 12, and has a diameter that is approximately the same as the diameter of the lead wire 22 so that the lead wires do not come into contact with each other. Provide an outer conductor hole for the lead wire with a larger inner diameter. Then, the terminal 2 is inserted into the terminal adhesive hole 12 into which the bush 4 was press-fitted until it comes into contact with the bush 4, so that the periphery of the metal tube 21 does not come into contact with the bush 4 in the terminal adhesive hole 12. Adhere to the inner wall with solder.
ブツシユ４はアルミニウム等の半田の付着し難
い材料で形成されているため、ブツシユ４の表面
と半田との吸着力より、半田内の原子間の吸引力
の方が勝り、半田は端子接着穴１２の内壁近辺に
かたまり、リード線用外導体穴まで流れ込まずリ
ード線と外導体がシヨートする恐れがなくなる。 Since the bushing 4 is made of a material such as aluminum to which solder does not easily adhere, the attraction between the atoms in the solder is stronger than the adsorption force between the surface of the bushing 4 and the solder, and the solder sticks to the terminal bonding hole 12. The lead wires and the outer conductor will not get stuck near the inner wall and will not flow into the lead wire outer conductor hole, eliminating the risk of the lead wires and outer conductor being shot.
なお、本実施例では金属管２１とリード線２２
の固着する絶縁材料はガラスを用いた説明をした
が、ガラスに限らず合成樹脂等であつても構わな
い。 In addition, in this embodiment, the metal tube 21 and the lead wire 22
In the explanation, glass is used as the insulating material to which the insulating material is fixed, but it is not limited to glass and may be made of synthetic resin or the like.
(f) 考案の効果
以上の説明から明らかなように、本考案に係る
端子のシヨート防止構造によれば、従来の構造に
比べて接着作業能率および品質の向上が期待でき
る。(f) Effects of the invention As is clear from the above explanation, the terminal shoot prevention structure according to the invention can be expected to improve bonding efficiency and quality compared to conventional structures.
第１図は、従来の取付け構造を説明するための
要部断面図、第２図は、本考案に係る端子のシヨ
ート防止構造の一実施例を説明するための要部断
面図である。
図において、１……筐体、２……端子、３……
半田、１１……リード線用外導体穴、４……ブツ
シユ、１２……端子接着穴、２１……金属管、２
２……リード線をそれぞれしめす。
FIG. 1 is a sectional view of a main part for explaining a conventional mounting structure, and FIG. 2 is a sectional view of a main part for explaining an embodiment of a terminal shot prevention structure according to the present invention. In the figure, 1... Housing, 2... Terminal, 3...
Solder, 11...Outer conductor hole for lead wire, 4...Button, 12...Terminal adhesion hole, 21...Metal tube, 2
2... Indicates each lead wire.
Claims (1)
部材で固着してなる端子を、該穴に接触しないよ
う挿通し、該金属管との当接部を半田付けする構
造において、 該穴は、該金属管の外径と同程度の径を有して
該筐体に設けられた端子接着穴に、該端子接着穴
の径とほぼ同じ外径で該リード線より大きい内径
のリード線用外導体穴を有し半田の付着し難い材
料からなるブツシユを、該筐体の表面より奥まで
圧入して形成され、 該金属管は該端子接着穴に該ブツシユと当接す
るまで挿入され、該金属管の周囲は該端子接着穴
の該ブツシユと接していない内壁に半田で接着さ
れたことを特徴とする端子のシヨート防止構造。[Claim for Utility Model Registration] A terminal consisting of a lead wire fixed in a metal tube with an insulating material is inserted into a hole provided in the housing so as not to contact the hole, and the contact part with the metal tube is inserted. In the structure for soldering, the hole has an outer diameter approximately the same as the diameter of the terminal bonding hole and fits into a terminal bonding hole provided in the housing with a diameter approximately the same as the outer diameter of the metal tube. It is formed by press-fitting a bush made of a material to which solder does not adhere, which has an outer conductor hole for the lead wire with an inner diameter larger than that of the lead wire, deep into the surface of the housing, and the metal tube fits into the terminal bonding hole. A terminal shot prevention structure characterized in that the metal tube is inserted until it comes into contact with a bushing, and the periphery of the metal tube is bonded by solder to an inner wall of the terminal bonding hole that is not in contact with the bushing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13022983U JPS6037179U (en) | 1983-08-22 | 1983-08-22 | Terminal short-circuit prevention structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13022983U JPS6037179U (en) | 1983-08-22 | 1983-08-22 | Terminal short-circuit prevention structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6037179U JPS6037179U (en) | 1985-03-14 |
| JPH0216520Y2 true JPH0216520Y2 (en) | 1990-05-08 |
Family
ID=30294816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13022983U Granted JPS6037179U (en) | 1983-08-22 | 1983-08-22 | Terminal short-circuit prevention structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6037179U (en) |
-
1983
- 1983-08-22 JP JP13022983U patent/JPS6037179U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6037179U (en) | 1985-03-14 |
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