JPH08153601A - Electronic part - Google Patents

Abstract

PURPOSE: To provide a low-priced electronic part with which an electronic part element main body, the circumferential part of an electrode and a lead wire can be insulation protected without impairing the weatherability of an electronic part element main body and the circumferential part of an electrode and the workability of a lead wire. CONSTITUTION: The title electronic part 10 contains a disc-shaped, for example, electronic part element main body 12, and electrodes 14a and 14b are formed on both main surfaces of the electronic part element main body 12. Lead wires 16a and 16b are soldered to the electrodes 14a and 14b. The first protective layer 22, consisting of the insulating material such as epoxy resin which is mechanically hard, is formed on the circumference of the electronic part element main body 12 and the electrodes 14a and 14b. Besides, the second protective layer 24, consisting of resisting material such as silicone resin and the like, is continuously formed without break on the lead wires 16a and 16b, excluding their tip part, covering the first protective layer 22 and ranging on the tip side of the lead wires 16a and 16b from the circumference of the electronic part element main body 12 and the electrodes 14a and 14b. A film is formed by coating on the protective layer 24 of the first and the second protective layers 22 and 24 using a dipping method.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, and more particularly, it has a lead wire, and in order to protect and electrically insulate the lead wire from, for example, temperature, humidity and shock,
The present invention relates to an electronic component such as a temperature-sensitive semiconductor element having a lead wire coated with an insulating material, such as a positive characteristic thermistor element and a negative characteristic thermistor element.

[0002]

2. Description of the Related Art FIG. 4 is a diagram showing an example of an electronic component having a lead wire, and FIG.
(B) is a cross-sectional schematic view of (A) as seen from the front,
(C) is sectional drawing solution figure which looked at (A) from the side surface. The electronic component 1 includes, for example, a disc-shaped electronic component element body 2. Disc-shaped electrodes 3a and 3b are formed on the one main surface and the other main surface of the electronic component element body 2, respectively. Lead wires 4a and 4b made of a conductive material such as copper, stainless steel, nickel and phosphor bronze are connected to two electrodes 3a and 3b, respectively.
One ends 5a and 5b of the lead wires 4a and 4b are bent inward so as to intersect each other. The electronic component element body 2 is inserted and sandwiched between the one ends 5a and 5b of the lead wires 4a and 4b. In this state, one end 5a of the lead wires 4a and 4b
And 5b and electrodes 3a and 3b are connected by soldering with solder 6, for example. Further, the peripheral portion X of the electronic component element body 2 and the electrodes 3a, 3b is covered with an insulating material such as epoxy, PBT, nylon, etc., and an insulating coating portion 7 is formed. In this case, these insulating coating portions 7 are formed only on the peripheral portion X of the electronic component element body 2 and the electrodes 3a and 3b.

FIG. 5 is a schematic sectional view showing an example of a conventional electronic component which is the background of the present invention. This electronic component 1
In particular, the lead wire portion Y is also covered with an insulating material as compared with the electronic component shown in FIG. In this electronic component 1, first,
The lead wires 4a and 4b which are not covered with insulation are directly connected to the electronic component element body 2, and then the electronic component element body 2 and the lead wires 4a and 4b are fused with an insulating material such as epoxy resin. It is immersed.
That is, in the electronic component 1, the peripheral portion X of the electronic component element body 2 and the electrodes 3a and 3b, and the lead wire portion Y are coated with an insulating material to form the insulating coating portion 7.

FIG. 6 is an illustrative view showing another example of a conventional electronic component. In this electronic component 1, an intermediate portion of the lead wire portion Y is covered with an insulating material. In this electronic component 1, the entire lead wire portion Y is first covered, and then the lead wire portion Y is covered.
Unnecessary insulating material coated on both ends in the longitudinal direction is removed. In this way, the lead wires 4a and 4b having the insulating coating portion 7 formed at the intermediate portion in the longitudinal direction are directly connected to the electrodes 3a and 3b by the solder 6. further,
The peripheral portion X of the electronic component element body 2 and the electrodes 3a and 3b is covered with an insulating material.

FIG. 7 is an illustrative view showing still another example of a conventional electronic component. Similar to the electronic component 1 shown in FIG. 6, this electronic component 1 also has an intermediate portion of the lead wire portion Y coated with an insulating material. However, compared with the conventional example shown in FIG. By mounting the wires 4a and 4b in the middle portion in the longitudinal direction, the insulating coating portion 7 is formed in the middle portion of the lead wire portion Y.

[0006]

However, in the electronic component 1 shown in FIG. 5, the electronic component element body 2 and the electrodes 3a,
Since the lead wire portion Y is covered with a mechanically hard insulating material which covers the peripheral portion X of 3b and imparts electric insulation and weather resistance to those portions, in particular, the lead wires 4a,
The flexibility of 4b, that is, the flexibility, was very lacking. In other words, while the peripheral parts X of the electronic component element body 2 and the electrodes 3a and 3b and the lead wires Y have different purposes of insulation coating, the electronic component 1 shown in FIG. In the coating process, that is, in the step of simultaneously immersing the peripheral portion X of the electronic component element body 2 and the electrodes 3a and 3b and the lead wire portion Y in a molten insulating material having the same mechanical strength, mechanical strength However, since the same insulating material is simultaneously coated, it is difficult to satisfy the purpose of insulating coating of both the peripheral portion X and the lead wire portion Y of the electronic component element body 2 and the electrodes 3a and 3b.

Further, in the electronic component 1 of FIG. 6, it takes a lot of time to remove unnecessary insulating material and attach the lead wires 4a and 4b to the electronic component element body 2. Furthermore, in the electronic component 1 of FIG. 7, since the insulating tubes are individually inserted into the lead wires 4a and 4b, the number of processing steps increases,
The processing cost was high.

Therefore, the main object of the present invention is to reduce the weather resistance of the peripheral parts of the electronic component element body and the electrodes and the workability of the lead wire at low cost, and to reduce the peripheral parts of the electronic component element body and the electrodes and the leads. An object of the present invention is to provide an electronic component capable of performing insulation protection with respect to a wire.

[0009]

According to the present invention, there is provided an electronic component element body, electrodes formed on one main surface and the other main surface of the electronic component element body, and a lead wire whose one end side is connected to the electrode. The lead wire is electrically insulated from the first protective layer formed on the periphery of the electronic component element body and the electrode to electrically insulate the electronic component element body and the peripheral portion of the electrode and to provide weather resistance. A second protective layer for
The second protective layer is an electronic component formed so as to cover the first protective layer and continuously from the peripheral portion of the electronic component element body and the electrode to the other end side of the lead wire.

The present invention also includes an electronic component element body,
Electrodes formed on one main surface and the other main surface of the electronic component element body, and a lead wire whose one end side is connected to the electrode,
The lead wire is electrically insulated from the first protective layer formed on the periphery of the electronic component element body and the electrode to electrically insulate the electronic component element body and the peripheral portion of the electrode and to provide weather resistance. And a second protective layer for protecting the electronic component element body and the electrode from the periphery of the electrode to the other end side of the lead wire. The first protective layer further comprises: The electronic component is formed on the peripheral portion of the electronic component element body and the electrode so as to cover the second protective layer.

Further, it is preferable that the first protective layer is made of a mechanically hard insulating material and the second protective layer is made of a mechanically flexible insulating material. Also, at the other end of the lead wire,
A flat portion can be formed.

[0012]

In the electronic component according to the first aspect, the first protective layer electrically insulates the electronic component element body and the peripheral portion of the electrode and imparts weather resistance. The second protective layer is
Electrically insulate the leads. Furthermore, since the second protective layer is formed continuously from the peripheral portion of the electronic component element body and the electrode to the other end side of the lead wire so as to cover the first protective layer, The periphery of the electrode is protected in cooperation with the first protective layer.

The electronic component according to claim 2, wherein:
The protective layer electrically insulates the electronic component element body and the peripheral portion of the electrode, and imparts weather resistance. Further, the second protective layer electrically insulates the lead wire. Further, a second protective layer is continuously formed from the peripheral part of the electronic component element body and the electrode to the other end side of the lead wire, and further, the first protective layer covers the second protective layer and the electron is formed. Since it is formed on the peripheral parts of the component element body and the electrodes, the first protective layer and the second protective layer cooperate to protect the peripheral parts of the electronic component element body and the electrodes.

According to another aspect of the electronic component of the present invention, the first protective layer is made of a mechanically hard insulating material and the second protective layer is made of a mechanically flexible insulating material. The electronic component element body and electrode covered with the protective layer of No. 3 have weather resistance, and the lead wire coated with the second protective layer has flexibility.

In the electronic component according to the fourth aspect, since the flat portion is formed at the other end of the lead wire, the contact area becomes large when the lead wire is connected to, for example, a terminal board of an external device.

[0016]

According to the present invention, an electronic component can be obtained in which the peripheral portion of the electronic component element body and the electrode and the lead wire are insulated and protected easily and inexpensively without impairing the workability of the lead wire. To be

In the electronic component according to the first and second aspects, the first protective layer electrically insulates the peripheral portion of the electronic component element body and the electrode, and imparts weather resistance.
Further, the lead wire is electrically insulated by the second protective layer. Furthermore, since the electronic component element body and the peripheral portion of the electrode are protected in cooperation with the first protective layer and the second protective layer, the weather resistance is further improved.

According to another aspect of the electronic component of the present invention, the first protective layer is made of a mechanically hard insulating material and the second protective layer is made of a mechanically flexible insulating material. The lead wire covered with the protective layer does not impair the flexibility of the lead wire itself, and can appropriately cope with bending of the lead wire.

In the electronic component according to the fourth aspect, since the flat portion is formed at the other end of the lead wire, when the lead wire is connected to, for example, a terminal board of an external device, the contact area becomes large, Easy connection and improved workability.

The above-mentioned objects, other objects, features and advantages of the present invention will be more apparent from the following detailed description of the embodiments with reference to the drawings.

[0021]

FIG. 1 is a view showing an embodiment of the present invention, (A) is a front view solution thereof, (B) is a sectional view view of (A) seen from the front, (C) is a cross-sectional schematic view of (A) as seen from the side. The electronic component 10 includes, for example, a disc-shaped electronic component element body 12. On the one main surface and the other main surface of the electronic component element body 12, respectively,
Disc-shaped electrodes 14a and 14b are formed. The two electrodes 14a and 14b have, for example, copper,
Lead wires 16a and 16b made of a conductive material such as stainless steel, nickel and phosphor bronze are connected.

One ends 18 of the lead wires 16a and 16b
a and 18b are bent inward so that they intersect each other. And lead wires 16a and 16b
The electronic component element body 12 is inserted and sandwiched between the one ends 18a and 18b. In this state, one ends 18a and 18b of the lead wires 16a and 16b
And electrodes 14a and 14b are connected by soldering with, for example, solder 20.

Further, the electronic component element body 12 and the electrode 1
A first protective layer 22 is formed on the peripheral portion X such as 4a and 14b. The first protective layer 22 is for ensuring electrical insulation and weather resistance of the electronic component element body 12 and the peripheral portions X of the electrodes 14a and 14b. For the first protective layer 22, a thermosetting resin material such as epoxy-based, diallyl-based, ester-based, amide-based, amide-based, or amide-imide-based is used as the insulating material having excellent mechanical strength and hardness. To be

In this embodiment, the electronic component element body 12 and the electrodes 14 are placed in a melted epoxy resin, for example.
The first protective layer 22 is coated on the X portions by immersing the peripheral X portions of a and 14b and then drying.

Further, in the electronic component 10, the electronic component element body 1 is formed so as to cover the surface of the first protective layer 22.
2 and the peripheral portions X of the electrodes 14a and 14b to the tip ends of the lead wires 16a and 16b, the second protective layer 24.
Is formed. In this case, the second protective layer 24 is continuously formed without interruption from the peripheral portion X of the electronic component element body 12 and the electrodes 14a and 14b to the portion excluding the tip portion of the lead wire portion Y.

The second protective layer 24 is for electrically insulating the lead wires and for ensuring the flexibility of the lead wires 16a, 16b. In this embodiment, as the material of the second protective layer 24, the adhesion between the second protective layer 24 and the lead wires 16a and 16b is good, and the lead wire 16 is
An insulating material that is excellent in flexibility so as not to impede the flexibility of a and 16b, and that is also excellent in weather resistance against mechanical damage during friction between the lead wires 16a and 16b and other articles. Is selected. In this case, in particular, the second protective layer 24 is formed of a mechanically flexible insulating material. In this embodiment, as the second protective layer 24, for example, a silicone resin or a silicone resin mixed with various inorganic substances as a filler is used.

In this embodiment, first, the Y portion is covered with the second protective layer 24 by immersing a predetermined portion of the lead wires 16a and 16b in the Y portion in a molten silicone resin and then drying the portion. To be done. In this case, the silicone resin is coated on the portions of the lead wires 16a and 16b that do not need to be insulation-coated, except for the tips.

The electronic component 10 thus formed
Is the electronic component element body 12 and the electrodes 14a, 14
Since the peripheral X part of b is covered with the first protective layer 22, the X part can be electrically insulated to improve the electrical performance and also have excellent weather resistance and mechanical performance. . Further, since the second protective layer 24 covers the first protective layer 22 so as to cover the predetermined portions of the lead wires 16a and 16b, the periphery of the electronic component element body 12 and the electrodes 14a and 14b. The flexibility of the lead wires 16a and 16b can be secured without impairing the weather resistance of the portion X.

In this electronic component 10, the first protective layer 22
Since the second protective layer 24 and the second protective layer 24 are coated by being dipped in a molten insulating material, mass production is easy, and production automation can be inexpensive. Moreover, the insulating material used for the second protective layer 24 is not related to the protection of the peripheral part X portion of the electronic component element body 12 and the electrodes 14a and 14b, that is, regardless of the insulating material of the first protective layer 22. , You can choose. Therefore, the lead wires 16a and 16b can be coated with an insulating material that does not impair the flexibility and workability of the lead wires 16a and 16b. Further, the second protective layer 24 covers the first protective layer 22 and continuously extends from the peripheral portion X of the electronic component element body 12 and the electrodes 14a and 14b to a predetermined portion of the lead wire portion Y without interruption. Are covered by
The weather resistance of the X portion can be further improved.

As described above, in the electronic component 10 shown in FIG. 1, the weather resistance of the peripheral portion of the electronic component element body 12 and the electrodes 14a and 14b, the flexibility and workability of the lead wires 16a and 16b are not impaired. Thus, the peripheral portions of the electronic component element body 12 and the electrodes 14a and 14b and the lead wires 16a and 16b can be insulated and protected at low cost.

FIG. 2 is a diagram showing another embodiment of the present invention, (A) is a front view solution diagram thereof, and (B) is (A).
Is a sectional schematic view seen from the front, and (C) is a sectional schematic view seen from the side of (A). In the electronic component 10 of the embodiment shown in FIG. 2, compared with the electronic component of the embodiment shown in FIG.
In particular, the arrangement of the first protective layer 22 and the second protective layer 24 is different. That is, in the electronic component 10 of the embodiment shown in FIG. 2, the second protective layer 24 covers the peripheral portion X of the electronic component element body 12 and the electrodes 14a and 14b, and the lead wires 16a and 16b are extended from the X portion. A predetermined portion of the portion Y is continuously covered without breaks.
Furthermore, the first protective layer 22 covers the second protective layer 24 so as to cover the electronic component element body 12 and the electrodes 14a,
The peripheral portion X of 14b is covered. In this case, the first protective layer 22 is coated so as to cover the second protective layer 24 coated on the X portion. The first protective layer 22 and the second protective layer 24 in this embodiment are also formed by immersing them in a molten insulating material as in the embodiment shown in FIG. Electronic component 1 of this embodiment
Even if it is 0, as in the electronic component shown in FIG. 1, the weather resistance of the electronic component element body 12 and the peripheral portions of the electrodes 14a and 14b, the flexibility and workability of the lead wires 16a and 16b are not impaired, and the cost is low. It is possible to insulate and protect the lead wires 16a and 16b from the periphery of the electronic component element body 12 and the electrodes 14a and 14b. Further, the electronic component element body 12 has a second protective layer 24 made of a mechanically flexible insulating material.
Since the second protective layer 24 is in direct contact with the electronic component element body 12 and the lead wires 16a and 16b, the thermal stress can be buffered by the second protective layer 24 even if a thermal shock is applied. .

FIGS. 3A and 3B are views showing still another embodiment of the present invention, in which FIG. 3A is a front view solution thereof, and FIG. 3B is a sectional view view taken along line IIIB-IIIB in FIG. , (C) is a sectional schematic view taken along line IIIC-IIIC in (A). In the electronic component 10 of the embodiment shown in FIG. 3, in the electronic component of the embodiment shown in FIGS. 1 and 2,
In particular, it is characterized in that flat portions 26a and 26b are formed at the tips of the lead wires 16a and 16b, respectively. In this case, the flat portions 26a and 26b are connected to the lead wires 16a and 16b which are not covered with the second protective layer 24.
Is formed by, for example, flattening the tip of the.

On the other hand, in an electronic component having a simple round lead wire, such as the electronic components shown in FIGS. 1 and 2,
There is no problem with those that are inserted into the holes of the circuit board and soldered, but when connecting this electronic component to, for example, the terminal board (connection terminal) of the equipment, the contact dimensions between the terminal board and the lead wire Was small, making connection work difficult. In this case, the connection work was performed by attaching a metal plate piece separately to the tip of the round lead wire, but it was very troublesome.

On the other hand, as shown in the electronic component 10 of FIG. 3, the flat portions 26 are formed at the tips of the lead wires 16a and 16b.
In the case where a and 26b are formed, for example, even when the electronic component 10 is connected to the terminal plate (connection terminal) of another device, the contact area between the lead wires 16a and 16b and the terminal plate (connection terminal) is increased. The connection work can be done easily. Therefore, the lead wires 16a, 16b and the terminal plate (connection terminal) can be easily connected by a method such as spot welding or ultrasonic welding.

In each of the above-mentioned embodiments, the first protective layer 22 and the second protective layer 24 are formed of different insulating materials, but the first protective layer 22 and the second protective layer 24 are different from each other. Does not necessarily have to be formed of different materials, and when a silicone resin material is used for the first protective layer 22 and the second protective layer 24, the The first protective layer 22 may have higher mechanical strength and higher hardness than the second protective layer 24 by adding more inorganic filler to the protective layer 22. Further, a pretreatment such as a primer may be optionally performed between the first protective layer 22 and the second protective layer 24. Further, the first protective layer 22 and the second protective layer 24
In addition to being formed of a single layer, each layer may be formed to have a multi-layer structure. In addition, the second part
The shape of the lead wire covered with the protective layer 24 includes not only round lead wires but also band-shaped ones, molded terminals such as continuous tapes, and the like. It includes.

[Brief description of drawings]

1A and 1B are views showing an embodiment of the present invention, in which FIG. 1A is a front view solution thereof, FIG. 1B is a sectional view view of FIG. 1A viewed from the front, and FIG. It is sectional drawing solution figure which looked at A) from the side surface.

FIG. 2 is a diagram showing another embodiment of the present invention, (A)
Is a front view solution thereof, (B) is a cross-sectional view solution of (A) viewed from the front, and (C) is a cross-section solution view of (A) viewed from the side.

FIG. 3 is a diagram showing still another embodiment of the present invention,
(A) is the front view solution figure, (B) is the line I of (A)
It is a sectional view solution figure in IIB-IIIB, and (C) is a sectional view solution figure in line IIIC-IIIC of (A).

4A and 4B are views showing an example of an electronic component having a lead wire which is a background of the present invention, FIG. 4A is a front view solution thereof, and FIG. 4B is a sectional view view of FIG. And
(C) is sectional drawing solution figure which looked at (A) from the side surface.

FIG. 5 is a schematic sectional view showing an example of a conventional electronic component.

FIG. 6 is an illustrative view showing another example of a conventional electronic component.

FIG. 7 is an illustrative view showing still another example of a conventional electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Electronic component 12 Electronic component Element main body 14a, 14b Electrode 16a, 16b Lead wire 18a One end of lead wire 18b The other end of lead wire 20 Solder 22 First protective layer 24 Second protective layer 26a, 26b Flat portion X Peripheral part of electronic component element body and electrode Y lead wire part

Claims (4)

[Claims] 1. An electronic component element main body, electrodes formed on one main surface and the other main surface of the electronic component element main body, a lead wire whose one end side is connected to the electrode, an electronic component element main body and the electrode A first protective layer formed on a peripheral portion for electrically insulating the electronic component element body and the peripheral portion of the electrode to impart weather resistance;
And a second protective layer for electrically insulating the lead wire, wherein the second protective layer covers the first protective layer and surrounds the electronic component element body and the electrode. An electronic component continuously formed from the portion to the other end side of the lead wire. 2. An electronic component element main body, electrodes formed on one main surface and the other main surface of the electronic component element main body, a lead wire whose one end side is connected to the electrode, an electronic component element main body and the electrode A first protective layer formed on a peripheral portion for electrically insulating the electronic component element body and the peripheral portion of the electrode to impart weather resistance;
And a second protective layer for electrically insulating the lead wire, wherein the second protective layer is continuous from the periphery of the electronic component element body and the electrode to the other end side of the lead wire. An electronic component, wherein the first protective layer is formed on the peripheral portion of the electronic component element body and the electrode so as to cover the second protective layer. 3. The method according to claim 1, wherein the first protective layer is formed of a mechanically hard insulating material and the second protective layer is formed of a mechanically flexible insulating material. Electronic components. 4. The electronic component according to claim 1, wherein a flat portion is formed at the other end of the lead wire.