CN101211694A - Structure for lead wire terminal of electronic parts - Google Patents
Structure for lead wire terminal of electronic parts Download PDFInfo
- Publication number
- CN101211694A CN101211694A CNA2007101477357A CN200710147735A CN101211694A CN 101211694 A CN101211694 A CN 101211694A CN A2007101477357 A CNA2007101477357 A CN A2007101477357A CN 200710147735 A CN200710147735 A CN 200710147735A CN 101211694 A CN101211694 A CN 101211694A
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- Prior art keywords
- lead
- electronic unit
- wire
- metallising
- capacitor
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title 1
- 239000003990 capacitor Substances 0.000 claims abstract description 104
- 230000001680 brushing effect Effects 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 11
- 239000003985 ceramic capacitor Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 abstract description 26
- 239000002184 metal Substances 0.000 abstract description 15
- 229910052751 metal Inorganic materials 0.000 abstract description 15
- 238000003466 welding Methods 0.000 abstract description 11
- 238000005507 spraying Methods 0.000 abstract description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 56
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000005253 cladding Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 208000034189 Sclerosis Diseases 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/242—Terminals the capacitive element surrounding the terminal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
Abstract
The present inventionv provides a structure of a lead-through terminal of an electron component. In a structure of a lead-through connecting/fixing metal spraying electrodes forming on two end faces of elements of various electron components such as film capacitor, it is impossible to cause bad connection when loading such as caloric test and vehicle, and it is able to reduce dielectric loss etc. The film capacitor is composed of the following parts: capacitor element (18); metal spraying electrodes (19, 19) formed by means of spraying molten metal such as lead and tin on two end faces (18a, 18a) of the capacitor element (18); and a pair of lead-throughs (20) connecting/fixing on the metal spraying electrodes (19, 19) by an electric welding machine. One surface of a metal spraying composition plane (20a) of the lead-through (20) is formed to basically mountain shape or toothing (20b) with succession in vertical direction.
Description
Technical field
The present invention relates to the both ends of the surface of the element that is formed at various electronic units such as film capacitor on the structure of the metallising electrode lead-in wire that is connected/fixes in, carry out at it can not causing bad connection when lift-launchs such as caloric test and vehicle are used, and reduce the structure of lead terminal of the high-quality electronic unit of dielectric loss etc.
Background technology
According to the 1st example of this prior art, has the technology of disclosed capacitor in TOHKEMY 2004-235485 publication communique.This technology is described, and as shown in Figure 9, capacitor 1 has the capacitor element 2 that is wound with metallized film, is connected with lead-in wire 4,4 on the metallising electrode 3,3 of the both ends of the surface that are formed at capacitor element 2.Lead-in wire 4,4 insulation coated wires (twisted wire or single line) in an end of lead-in wire 4,4, expose lead 4a, 4a, and lower end 4b, the 4b of lead 4a, the 4a that is exposed is connected with metallising electrode 3,3 by spot welding or soldering.And such formation thing is accommodated in the housing 5, and the resin (not shown) of filling epoxy etc. in housing 5 seals, thereby constitutes capacitor 1.The capacitor 1 of Gou Chenging can use under various environment like this, but how to use under the surrounding environment of high temperature, high humility.Capacitor element 2 in housing 5 by resin-sealed, even high humility, moisture can not be attached directly on the capacitor element 2 yet, but because lead-in wire 4, the 4 opening 5a sides from housing 5 enter in the resin, so between the insulation coating and lead 4a, 4a of lead-in wire 4,4, between the online and line, moisture immersed probably when perhaps lead 4a, 4a were twisted wire.The moisture of this immersion enters into the inside of capacitor element 2 via metallising electrode 3,3, becomes the main cause that capacitor element 2 deteriorations, performance are reduced sometimes.
According to the 2nd example of this prior art, have that disclosed electronic unit is the technology of film capacitor in TOHKEMY 2001-332444 publication communique.This technology is described, as shown in figure 10, capacitor 6 forms metallising electrode 7 on both ends of the surface, 7, at this metallising electrode 7, connect lead-in wire 8 on 7 as lead-out wire, 8, the film capacitor element 9 that obtains like this is accommodated in the desired locations of an open-ended housing 10 that constitutes by resin or metal, space part in this housing 10 injects liquid resin, before this liquid resin sclerosis, on the liquid resin face, set for example identical resin plate 11 with described liquid resin material, make described liquid resin sclerosis, form the resin bed 12 that upper surface is fixed with resin plate 11 in the space part in housing 10.In addition, in this structure, as shown in figure 10, resin plate 11 is provided with lead-in wire inserting hole 11a, 11a in position, as the lead division of the lead-in wire 8,8 of deriving from the film capacitor element 9 that is accommodated in the housing 10, and resin plate 11 is set for more smaller than the internal diameter size of housing 10.According to film capacitor 6, by adopting the structure that on resin bed 12, is fixed with resin plate 11, the bubble that is produced in constituting the liquid resinous hardening process of resin bed 12 and because the caused through pin hole (not shown) at this part of escape of air does not directly communicate with extraneous gas has been eliminated the main cause of the deterioration in characteristics of capacitor.
Then, the structure of the lead terminal of the film capacitor as electronic unit of the prior art, as cut off shown in the profile shown in Figure 11 of its major part.This film capacitor 13 utilizes solution spraying plating that spraying machine will be made of the material of plumbous and tin etc. on both ends of the surface 14a, the 14a of film capacitor element 14 (having omitted an end face among the figure), forms metallising electrode 15,15.Then, utilize the wire bonds electrode of electric welding machine (not shown) etc., crimping is as end portion 16a, the 16a of two lead-in wires 16,16 that for example are made of the just round line of single line of lead terminal on these both ends of the surface 14a, 14a, and make its dissolving, on this metallising electrode 15,15, fix end portion 16a, the 16a of described two lead-in wires 16,16.
[patent documentation 1] TOHKEMY 2004-235485 publication communique
[patent documentation 2] TOHKEMY 2001-332444 publication communique
According to the 1st example of prior art, the orbicular lead 4a that capacitor 1 is derived, the lower end 4b of 4a, 4b surface are level and smooth peripheries, and this lower end 4b, 4b are fixed on the metallising electrode 3,3 by welding or soldering.And, in order to make this capacitor 1 can be applicable to all colds and warm area, for example before being equipped on the vehicle, implement caloric test as convention, when this follows the test of variations in temperature, the lead 4a of the lead-in wire 4 of this capacitor 1, the lower end 4b of 4a, 4b is bringing into play the expansion effect up and down, sometimes this lead 4a, the lower end 4b of 4a, 4b is because loose contact or use for a long time and from metallising electrode 3, break away from 3, therefore, the dielectric tangent of this capacitor 1 (tan δ) becomes big and dielectric loss increases, exist produce bad or be unsuitable for the problem of the capacitor 1 of mass production specification in the production phase.
The 2nd example according to prior art, it is the structure that on the metallising electrode 7,7 of the capacitor element 9 of film capacitor 6, connects the end portion of lead-in wire 8,8, same with the 1st example of described prior art, the surface of the end portion of this lead-in wire 8,8 in the coupling part of metallising electrode 7,7 forms tabular surface or periphery.So, according to the same reason of the 1st example of described prior art, sometimes go between 8,8 end portion because loose contact or use for a long time and break away from from metallising electrode 7,7, therefore, the dielectric tangent of this film capacitor 6 (tan δ) becomes big and dielectric loss increases, cause the bad of production phase, have the problem that produces the film capacitor 6 that is unsuitable for the mass production specification.
In order to make the film capacitor 13 as electronic unit of the prior art can be applicable to all colds and warm area, for example-40 under the condition of (℃) to+150 (℃), every through repeating to implement one time caloric test in one hour.By this caloric test, end portion 16a, the 16a of the lead-in wire 16,16 of this film capacitor 13 are along arrow A direction shown in Figure 11 and arrow B direction, in metallising electrode 15,15, descend/effect of increasing and shrink/expanded effect, end portion 16a, the 16a of this lead-in wire 16,16 and the contact portion of metallising electrode 15,15 produce space S, and cause the defective mode of joint/connection, dielectric tangent (tan δ) with film capacitor 13 becomes big, the drawback that dielectric loss increases.
The problem points that the problem that the present invention will solve is to solve in the background technology to be narrated.
Summary of the invention
The structure of the lead terminal of electronic unit of the present invention is a purpose to solve above-mentioned problem, provide a kind of with the both ends of the surface of the element that is formed at various electronic units such as film capacitor on the structure of the metallising electrode lead-in wire that is connected/fixes in, carry out can not causing when lift-launchs such as caloric test and vehicle are used bad connection at it, can set dielectric tangent (tan δ) etc. less, and the high-quality electronic unit of minimizing dielectric loss etc. is realized by following structure, method.
Promptly, the invention of putting down in writing according to the 1st aspect, described electronic unit is that the element on this metallising electrode one of the metallising electrode that forms on the both ends of the surface of the element of electronic unit, connection/be fixed on, another lead-in wire and described electronic unit carries out the powder brushing and the electronic unit that obtains, it is characterized in that, any one side in the metallising electrode engagement face of described lead-in wire is formed roughly recess or roughly chevron shape or roughly zigzag in vertical direction a succession ofly.
The invention of putting down in writing according to the 2nd aspect, described electronic unit is that the element on this metallising electrode one of the metallising electrode that forms on the both ends of the surface of the element of electronic unit, connection/be fixed on, another lead-in wire and described electronic unit carries out the powder brushing and the electronic unit that obtains, it is characterized in that, a face and/or another face of the metallising electrode engagement face of described lead-in wire formed roughly recess or roughly chevron shape or zigzag in vertical direction a succession ofly.
The invention of putting down in writing according to the 3rd aspect, described electronic unit is that the element on this metallising electrode one of the metallising electrode that forms on the both ends of the surface of the element of electronic unit, connection/be fixed on, another lead-in wire and described electronic unit carries out the powder brushing and the electronic unit that obtains, it is characterized in that, the side face of the metallising electrode engagement face of described lead-in wire is set to roughly recess or roughly chevron shape or zigzag in vertical direction a succession ofly.
Invention according to the 4th aspect is put down in writing in the invention of being put down in writing, is characterized in that described electronic unit is made of film capacitor, ceramic capacitor, variable capacitor, resistor, variable resistance or rheostat aspect the 1st, 2 or 3.
Invention according to the 5th aspect is put down in writing in the invention of being put down in writing aspect the 1st, 2 or 3, is characterized in that, described one, another lead-in wire are made of single line or twisted wire.
The structure of the lead terminal of electronic unit of the present invention has above-mentioned structure, so have following effect.
Promptly, the invention of putting down in writing according to the 1st aspect, a kind of structure of lead terminal of electronic unit is provided, this electronic unit is that the element on this metallising electrode one of the metallising electrode that forms on the both ends of the surface of the element of electronic unit, connection/be fixed on, another lead-in wire and described electronic unit carries out the powder brushing and the electronic unit that obtains, it is characterized in that, any one side in the metallising electrode engagement face of described lead-in wire is formed roughly recess or roughly chevron shape or roughly zigzag in vertical direction a succession ofly.
Because adopt this structure, so have following effect: on the metallising electrode that forms on the both ends of the surface of the element of electronic unit, connect/fix one, another lead-in wire reliably, when following the caloric test of variations in temperature or in vehicle-mounted etc. the use of cold and warm region, this, another lead-in wire can not produce bad connection fully or engage bad, can be all the time set/keep dielectric tangent (tan δ) of this electronic unit etc. less, significantly reduce dielectric loss etc., can provide high-quality and various electronic units that durability is high.
The invention of putting down in writing according to the 2nd aspect, a kind of structure of lead terminal of electronic unit is provided, this electronic unit is that the element on this metallising electrode one of the metallising electrode that forms on the both ends of the surface of the element of electronic unit, connection/be fixed on, another lead-in wire and described electronic unit carries out the powder brushing and the electronic unit that obtains, it is characterized in that, a face and/or another face of the metallising electrode engagement face of described lead-in wire formed roughly recess or roughly chevron shape or zigzag in vertical direction a succession ofly.
Because adopt this structure, so have following effect: on the metallising electrode that forms on the both ends of the surface of the element of electronic unit, with one, the bottom of another lead-in wire, be that promptly a face and/or another face form roughly concavo-convex or chevron shape roughly a succession ofly for the two sides of metallising electrode engagement face, and connect reliably/fixing, when following the caloric test of variations in temperature or in vehicle-mounted etc. the use of cold and warm region, this, another lead-in wire can not produce bad connection fully or engage bad, can be all the time set/keep dielectric tangent (tan δ) of this electronic unit etc. less, significantly reduce dielectric loss etc., provide high-quality and various electronic units that durability is high, and, described one, the metallising electrode engagement face of another lead-in wire for example can utilize simple stamped metal mould such as the lead forming mechanism of automatic lead welding machine simple and easy, make apace, improve the production of this electronic unit.
The invention of putting down in writing according to the 3rd aspect, a kind of structure of lead terminal of electronic unit is provided, this electronic unit is that the element on this metallising electrode one of the metallising electrode that forms on the both ends of the surface of the element of electronic unit, connection/be fixed on, another lead-in wire and described electronic unit carries out the powder brushing and the electronic unit that obtains, it is characterized in that, the side face of the metallising electrode engagement face of described lead-in wire is set to roughly recess or roughly chevron shape or zigzag in vertical direction a succession ofly.
Because adopt this structure, so have following effect: on the metallising electrode that forms on the both ends of the surface of the element of electronic unit, with one, the bottom of another lead-in wire, be that metallising electrode engagement face forms roughly recess a succession ofly, and connect reliably/fixing, when following the caloric test of variations in temperature or in vehicle-mounted etc. the use of cold and warm region, this, another lead-in wire can not produce bad connection fully or engage bad, can be all the time set/keep dielectric tangent (tan δ) of this electronic unit etc. less, significantly reduce dielectric loss etc., provide high-quality and various electronic units that durability is high, and, described one, the metallising electrode engagement face of another lead-in wire for example can utilize simple stamped metal mould such as the lead forming mechanism of automatic lead welding machine simple and easy, make apace, improve the production of this electronic unit.
The invention of putting down in writing according to the 4th aspect, a kind of structure of lead terminal of electronic unit is provided, in the invention of aspect the 1st, 2 or 3, being put down in writing, it is characterized in that described electronic unit is made of film capacitor, ceramic capacitor, variable capacitor, resistor, variable resistance or rheostat.
Because adopt this structure, so have following effect: at film capacitor, ceramic capacitor, variable capacitor, resistor, on the metallising electrode that forms on the both ends of the surface of the element of various electronic units such as variable resistance or rheostat, connect/fix one reliably, another lead-in wire, when following the caloric test of variations in temperature or in vehicle-mounted etc. the use of cold and warm region, this, another lead-in wire can not produce bad connection fully or engage bad, can be all the time with this film capacitor, ceramic capacitor, variable capacitor, resistor, the dielectric tangent of various electronic units such as variable resistance or rheostat (tan δ) etc. is set/keeps lessly, significantly reduce dielectric loss etc., can be applicable to electronic unit high-quality and the wide scope that durability is high.
According to the invention that the 5th aspect is put down in writing, a kind of structure of lead terminal of electronic unit is provided, in the invention of aspect the 1st, 2 or 3, being put down in writing, it is characterized in that described one, another lead-in wire are made of single line or twisted wire.
Because adopt this structure, so have following effect: one, another lead-in wire can be applicable to single line of general CP line etc. etc., can easily implement/realize the present invention.
Description of drawings
Fig. 1 is the end view of expression as the partial cut of the major part of the lead-in wire coupling part of the film capacitor of electronic unit of the present invention.
Fig. 2 is the stereogram of the partial cut of the state of connection/anchor leg on the metallising electrode that is illustrated on the end face of the capacitor element that is formed at film capacitor of the present invention.
Fig. 3 represents the structure of the lead-in wire used in the film capacitor as electronic unit of the present invention, is the stereogram that has amplified its major part.
Fig. 4 represents the embodiment of the structure of the lead-in wire used in the film capacitor as electronic unit of the present invention, is the stereogram that has amplified its major part.
Fig. 5 is the figure of expression manufacturing as the step of the capacitor element of the film capacitor of electronic unit of the present invention, (a) be the vertical cross section of expression thin-film material, (b) be to be reeled by the winding film machine stereogram of the capacitor devices that this thin-film material constituted is installed, be to utilize pressing equipment to constitute the stereogram of this capacitor devices (c) flatly.
Fig. 6 is the stereogram that has formed the metallising electrode on the both ends of the surface that are illustrated in as the capacitor element of the film capacitor of electronic unit of the present invention.
Fig. 7 is illustrated in as connecting on the metallising electrode on the both ends of the surface of the capacitor element of the film capacitor of electronic unit of the present invention/figure of the making step of fixing lead-in wire, (a) being the end view of state of the shape on the expression metallising composition surface that makes lead-in wire, (b) is the end view that metallising composition surface that expression will go between is fixed on the state on the metallising electrode of capacitor element.
The stereogram of the state of Fig. 8 when to be expression as the manufacturing of the film capacitor of electronic unit of the present invention finish.
Fig. 9 is the stereogram of the 1st example of expression capacitor of the prior art.
Figure 10 is the vertical cross section of the 2nd example of expression film capacitor of the prior art.
Figure 11 is the profile of the major part of the expression lead terminal that cut off the film capacitor as electronic unit of the prior art.
Embodiment
Below, describe the execution mode of structure of the lead terminal of electronic unit of the present invention with reference to the accompanying drawings in detail.
Fig. 1 is the end view of expression as the partial cut of the major part of the lead-in wire coupling part of the film capacitor of electronic unit of the present invention.
Fig. 2 is the stereogram of the partial cut of the state of connection/anchor leg on the metallising electrode that is illustrated on the both ends of the surface of the capacitor element that is formed at film capacitor of the present invention.
Fig. 3 represents the structure of the lead-in wire used in the film capacitor as electronic unit of the present invention, is the stereogram that has amplified its major part.
The 17th, a kind of electronic unit is the film capacitor as the part that is equipped on constant voltage device on the vehicle and other electric products.This film capacitor 17 is probably by constituting with the lower part: capacitor element 18; The motlten metal of spraying plating lead and tin etc. on two end face 18a, 18a of capacitor element 18 and the metallising electrode 19,19 that forms; Utilize electric welding machine etc. to connect/be fixed on one, another lead-in wire 20 on this metallising electrode 19,19.
In Fig. 1, omit a lead-in wire 20.
The following describes the metallising electrode 19 of the side in the film capacitor 17, the lead-in wire 20 of a side etc.
Described lead-in wire 20 has the function as the lead terminal of film capacitor 17, it for example is the CP line, owing to being that iron (Fe) or copper electric conducting materials such as (Cu) have the energising function, its cross sectional shape is round type, rectangle etc., whole by the pole shape, post is bar-shaped or so-called line constitutes.This lead-in wire 20 is made of upper end 20A and bottom 20B, has metallising composition surface 20a on the 20B of this bottom.This lead-in wire 20 does not utilize coatings such as cladding parts in the present embodiment, utilizes cladding parts to coat lead-in wire at 20 o'clock, and the part of its upper end 20A etc. is coated.The bottom 20B of this lead-in wire 20 becomes bare wire.
The metallising composition surface 20a of this lead-in wire 20 is surfaces of this lead-in wire 20, is made of at least two faces or a face in front/rear or a left side/right side sometimes, is made of its whole circumference face sometimes.And, some faces of the metallising composition surface 20a of this lead-in wire 20 are formed roughly chevron shape or roughly zigzag 20b in vertical direction a succession ofly.Fig. 1 and metallising composition surface 20a shown in Figure 3 form roughly chevron shape or roughly zigzag 20b according to vertical direction on a left side/right side in the surface of lead-in wire 20 a succession ofly.Form roughly chevron shape or roughly zigzag 20b on metallising composition surface 20a shown in Figure 2 preceding (F)/back (R) face in the surface of lead-in wire 20.And, be on the metallising composition surface 20a of Fig. 1～shown in Figure 3, form described roughly chevron shape or the structure of zigzag 20b roughly according to vertical direction on two faces in the surface of this lead-in wire 20 a succession ofly.
So as Fig. 1～shown in Figure 3, the metallising composition surface 20a on the surface of described lead-in wire 20 forms roughly chevron shape or roughly zigzag 20b.This formation method is for example used the automatic lead welding machine as described later, utilizes the metal die of this lead forming mechanism, and punch process is somebody's turn to do a left side/right side or preceding (F)/back (R) face of the bottom 20B of lead-in wire 20.As other formation method, utilize the method on the surface of these lead-in wires 20 of cutting such as cutting apparatus in addition.
And, as mentioned above, form chevron shape roughly or of zigzag 20b roughly, the metallising composition surface 20a of another lead-in wire 20 and the both ends of the surface 18a that is formed at described capacitor element 18, metallising electrode 19 butts on the 18a, and at this, on the bottom 20B of another lead-in wire 20, as described later, the wire bonds of utilizing electric welding machine for example just/ negative electrode 22a, 22b switches on, thus these metallising electrode 19 positions are heated, make this metallising electrode 19 fusions, the metallising composition surface 20a of this lead-in wire 20 connects/is fixed on this metallising electrode 19.
Then, effect of the execution mode of the structure of the lead terminal of electronic unit of the present invention etc. is described.At this electronic unit of plant produced film capacitor 17 for example, before dispatching from the factory, generally, carry out caloric test in order to guarantee the quality of electronic unit etc.This caloric test is for example in order to make this electronic unit etc. can be applicable to all colds and warm area,-40 in the scope of (℃) to+150 (℃), every test through repeating once in one hour, under this caloric test, one, another lead-in wire 20 can not produce bad connection etc.And, after film capacitors 17 such as this electronic unit dispatch from the factory, must guarantee that also these film capacitor 17 grades are equipped on vehicle etc. when going up long-time the use, one, another lead-in wire 20 can not produce bad connection etc., have stable fine quality.
So, the film capacitor 17 of the electronic unit in the structure of the lead terminal of electronic unit of the present invention etc. is at one, form roughly chevron shape or roughly zigzag 20b on the vertical direction of the metallising composition surface 20a of another lead-in wire 20 a succession ofly, at this a series of roughly chevron shape or roughly on the face of zigzag 20b, the lead material of metallising electrode 19 is connected/fixes one with tin material, another went between 20 o'clock, fusion is immersed fully, in the present invention, compared with prior art, by roughly chevron shape or roughly zigzag 20b, the enlarged areas of metallising composition surface 20a.And even carry out described caloric test etc., one, another lead-in wire 20 also can not produce the shrink/expanded effect to arrow A direction and arrow B direction shown in the prior art of Figure 11, and also not produce space S.So this, another lead-in wire metallising composition surface 20a of 20 connect under tightening state all the time/are fixed on the metallising electrode 19,19.And, can set this dielectric tangent (tan δ) less, reduce dielectric loss, can provide a kind of when producing and after dispatching from the factory as the film capacitor 17 of electronic unit, even as vehicle-mounted product, also can guarantee the film capacitor of stable fine quality.
[embodiment]
The embodiment of structure of the lead terminal of electronic unit of the present invention then, is described according to Fig. 4.
Fig. 4 represents the embodiment of the structure of the lead-in wire used in the film capacitor as electronic unit of the present invention, is the stereogram that has amplified its major part.
In the present embodiment, this lead-in wire 20 is made of upper end 20A and bottom 20B, has metallising composition surface 20a on the 20B of this bottom.This lead-in wire 20 does not utilize coatings such as cladding parts in the present embodiment, utilizes cladding parts to coat lead-in wire at 20 o'clock, and the part of its upper end 20A etc. is coated.The bottom 20B of this lead-in wire 20 becomes bare wire.The metallising composition surface 20a of this lead-in wire 20 is surfaces of this lead-in wire 20, is made of at least two faces or a face in front/rear or a left side/right side, or as shown in this embodiment, constitutes on its whole circumference face.And, as shown in Figure 4, some faces of the metallising composition surface 20a of this lead-in wire 20 are formed recess 20c in vertical direction a succession ofly.Metallising composition surface 20a shown in Figure 4 relates to the whole circumference face of wire surface, and this recess 20c is set in vertical direction.
Structure of the processing method of the lead-in wire 20 in the present embodiment, other component parts that film capacitor 17 had etc. and effect thereof etc. are roughly the same with described embodiments of the present invention, omit its explanation.
And, the invention is not restricted to above-mentioned film capacitor 17, also can be applicable to the electronic unit of wide scope such as ceramic capacitor, variable capacitor, resistor, variable resistance or rheostat.And then described lead-in wire 20 is not limited to single line, also can be made of twisted wire.
Then, according to the manufacturing step of Fig. 5～Fig. 8 explanation as the film capacitor 17 of electronic unit of the present invention.
At first, make the capacitor element 18 of film capacitor 17.The thin-film material 18A of this capacitor element 18 carries out evaporation/polymerization to the thin dielectric film 18c that for example is made of Al (aluminium) paper tinsel 18b and PET (PETG) material shown in Fig. 5 (a), constitute electrode.Shown in Fig. 5 (b), utilize general winding film machine (not shown) to reel the thin-film material 18A of this capacitor element 18 is installed, thereby constitute capacitor devices 18B.And, use pressing equipment, on the direction shown in the arrow P of Fig. 5 (c), heat and increase the weight of, described capacitor devices 18B (18) is shaped flatly.So far, made capacitor element 18.
Then, as shown in Figure 6, on two end face 18a of capacitor element 18, form metallising electrode 19.The formation method of this metallising electrode 19 for example is, utilizes general spraying machine (not shown) to form as solution such as the lead of metal and tin to the end face 18a of this capacitor element 18 spraying plating from its nozzle.Condenser capacity is under the situation of 2.7 (μ F), as design example, the thickness t of this metallising electrode 19 for example is approximately about 0.5 (mm)～0.8 (mm), and the diameter that at this moment, connects/be fixed on the lead-in wire 20 on this metallising electrode 19 is approximately about 0.8 (mm)～1 (mm).
In this design example, on this metallising electrode 19 during connection/anchor leg 20, expose from the lateral surface of this metallising electrode 19 side of this lead-in wire 20, by face of metallising composition surface 20a formation of this lead-in wire 20, thereby can reach purpose of the present invention.
And the lower end 20B of described lead-in wire 20 must form metallising composition surface 20a.Formation method or processing method as this metallising composition surface 20a, shown in Fig. 7 (a), for example utilize the lead forming mechanism of automatic lead welding machine (not shown), by a metal die 21a, another metal die 21b, punching press and push the metallising composition surface 20a of the bottom 20B of this lead-in wire 20 on arrow C direction, arrow D direction.
Here, a described metal die 21a and another metal die 21b have described roughly chevron shape or zigzag 20b or the forming shape of recess 20c roughly, as Fig. 3 or shown in Figure 4, on the 20a of this metallising composition surface, form roughly chevron shape or roughly zigzag 20b or roughly recess 20c in vertical direction a succession ofly.
Then, make in operation in front and on the bottom 20B of lead-in wire 20, to form chevron shape roughly or roughly zigzag 20b or roughly face and metallising electrode 19 butts of the metallising composition surface 20a of recess 20c, and push wire bonds such shown in Fig. 7 (b) of electric welding machine (not shown) for example just/ negative electrode 22a, 22b, make the metallising composition surface 20a of its bottom 20B that contacts this lead-in wire 20.Thus, the bottom 20B of this lead-in wire 20 plays the energising effect, causes exothermic phenomenon.And by this exothermic phenomenon, the bottom 20B of lead-in wire 20 welds/is fixed on the metallising electrode 19.
In addition, in the drawings, 22c be with wire bonds just/lead-in wire that negative electrode 22a, 22b are connected.And, utilize epoxide resin material that this capacitor element 18 that comprises metallising electrode 19 is carried out priming coat processing, use the epoxide resin material of outer dress usefulness at last, utilize the powder machine for brushing, to comprising connecting portion integral body that grade, this film capacitor 17 by the metallising electrode 19 in capacitor element 18, metallising electrode 19 and 20 film capacitors that constitute 17 that go between, as shown in Figure 8, carry out powder brushing 23, thereby be made into film capacitor 17 as electronic unit.
Electronic unit of the present invention is not limited to the electronic unit of low capacity, also can be applicable to jumbo electronic unit, but effective especially to the film capacitor 17 of low capacity.That is, as shown in Figure 6, the design basis of the film capacitor 17 of the low capacity of 2.7 (μ F) degree is, horizontal wide long L is approximately 12 (mm), and vertical wide long W is approximately 8 (mm), and the area E of this metallising electrode 19,19 is calculated by E=L * W, is approximately 96 (mm
2).
And, the area E of metallising electrode 19 is especially in the film capacitor 17 of low capacity more, according to prior art shown in Figure 11, in caloric test, utilize the expansion effect of lead-in wire 16, this lead-in wire 16 is connected/the stationary state instability with metallising electrode 15, causes bad connection etc., it is big that dielectric tangent (tan δ) becomes, and cause dielectric loss.Structure according to the lead terminal of electronic unit of the present invention can address these problems a little certainly.
Claims (5)
1. the structure of the lead terminal of an electronic unit, this electronic unit is that the element on this metallising electrode one of the metallising electrode that forms on the both ends of the surface of the element of electronic unit, connection/be fixed on, another lead-in wire and described electronic unit carries out the powder brushing and the electronic unit that obtains, it is characterized in that
Any one side in the metallising electrode engagement face of described lead-in wire is formed roughly recess or roughly chevron shape or roughly zigzag in vertical direction a succession ofly.
2. the structure of the lead terminal of an electronic unit, this electronic unit is that the element on this metallising electrode one of the metallising electrode that forms on the both ends of the surface of the element of electronic unit, connection/be fixed on, another lead-in wire and described electronic unit carries out the powder brushing and the electronic unit that obtains, it is characterized in that
A face and/or another face of the metallising electrode engagement face of described lead-in wire are formed roughly recess or roughly chevron shape or zigzag in vertical direction a succession ofly.
3. the structure of the lead terminal of an electronic unit, this electronic unit is that the element on this metallising electrode one of the metallising electrode that forms on the both ends of the surface of the element of electronic unit, connection/be fixed on, another lead-in wire and described electronic unit carries out the powder brushing and the electronic unit that obtains, it is characterized in that
The side face of the metallising electrode engagement face of described lead-in wire is set to roughly recess or roughly chevron shape or zigzag in vertical direction a succession ofly.
4. according to the structure of the lead terminal of claim 1,2 or 3 described electronic units, it is characterized in that,
Described electronic unit is made of film capacitor, ceramic capacitor, variable capacitor, resistor, variable resistance or rheostat.
5. according to the structure of the lead terminal of claim 1,2 or 3 described electronic units, it is characterized in that,
Described one, another lead-in wire are made of single line or twisted wire.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006353605 | 2006-12-28 | ||
| JP2006353605A JP2008166457A (en) | 2006-12-28 | 2006-12-28 | Structure of lead terminal of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101211694A true CN101211694A (en) | 2008-07-02 |
Family
ID=39611636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101477357A Pending CN101211694A (en) | 2006-12-28 | 2007-08-27 | Structure for lead wire terminal of electronic parts |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2008166457A (en) |
| KR (1) | KR20080063040A (en) |
| CN (1) | CN101211694A (en) |
| TW (1) | TW200828365A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800500A (en) * | 2012-08-17 | 2012-11-28 | 扬州日精电子有限公司 | Capacitor machining method |
| CN103954857A (en) * | 2014-04-01 | 2014-07-30 | 扬州日精电子有限公司 | Tan delta control method of thin-film capacitor thermal shock test |
| CN105118670A (en) * | 2015-08-31 | 2015-12-02 | 苏州斯尔特微电子有限公司 | Ceramic capacitor |
| CN106340384A (en) * | 2015-07-10 | 2017-01-18 | 三星电机株式会社 | Method for forming exterior electrode of passive device and passive device having exterior electrode |
| CN108878150A (en) * | 2017-05-09 | 2018-11-23 | 常州华威电子有限公司 | High temperature resistant large ripple current electrolytic capacitor and preparation method thereof |
| CN116237658A (en) * | 2023-02-10 | 2023-06-09 | 六和电子（江西）有限公司 | Composite welding method for film capacitor core and extraction electrode |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6074658B2 (en) * | 2013-02-18 | 2017-02-08 | パナソニックＩｐマネジメント株式会社 | Metallized film capacitors |
| JP6393026B2 (en) * | 2013-08-09 | 2018-09-19 | 日立エーアイシー株式会社 | Metallized film capacitors |
| JP6422727B2 (en) * | 2014-10-20 | 2018-11-14 | ニチコン株式会社 | Busbar welded structure in metalized film capacitors |
| KR20160130910A (en) | 2015-05-04 | 2016-11-15 | (주)누리트론 | Lead terminals of electronic components |
| JP2022049987A (en) * | 2020-09-17 | 2022-03-30 | 株式会社村田製作所 | Multilayer ceramic electronic component and mounting structure of the multilayer ceramic electronic component |
| KR20220123958A (en) | 2021-03-02 | 2022-09-13 | 주식회사 아모텍 | Multi layer ceramic condenser and water temperature sensor module having tha same |
| KR20220151316A (en) | 2021-05-06 | 2022-11-15 | 주식회사 아모텍 | Multi layer ceramic condenser and electronic component package having the same |
-
2006
- 2006-12-28 JP JP2006353605A patent/JP2008166457A/en active Pending
-
2007
- 2007-08-02 TW TW096128355A patent/TW200828365A/en unknown
- 2007-08-27 CN CNA2007101477357A patent/CN101211694A/en active Pending
- 2007-08-31 KR KR1020070088324A patent/KR20080063040A/en not_active Application Discontinuation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800500A (en) * | 2012-08-17 | 2012-11-28 | 扬州日精电子有限公司 | Capacitor machining method |
| CN103954857A (en) * | 2014-04-01 | 2014-07-30 | 扬州日精电子有限公司 | Tan delta control method of thin-film capacitor thermal shock test |
| CN106340384A (en) * | 2015-07-10 | 2017-01-18 | 三星电机株式会社 | Method for forming exterior electrode of passive device and passive device having exterior electrode |
| CN105118670A (en) * | 2015-08-31 | 2015-12-02 | 苏州斯尔特微电子有限公司 | Ceramic capacitor |
| CN108878150A (en) * | 2017-05-09 | 2018-11-23 | 常州华威电子有限公司 | High temperature resistant large ripple current electrolytic capacitor and preparation method thereof |
| CN116237658A (en) * | 2023-02-10 | 2023-06-09 | 六和电子（江西）有限公司 | Composite welding method for film capacitor core and extraction electrode |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200828365A (en) | 2008-07-01 |
| KR20080063040A (en) | 2008-07-03 |
| JP2008166457A (en) | 2008-07-17 |
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