CN106340384A - Method for forming exterior electrode of passive device and passive device having exterior electrode - Google Patents
Method for forming exterior electrode of passive device and passive device having exterior electrode Download PDFInfo
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- CN106340384A CN106340384A CN201610079567.1A CN201610079567A CN106340384A CN 106340384 A CN106340384 A CN 106340384A CN 201610079567 A CN201610079567 A CN 201610079567A CN 106340384 A CN106340384 A CN 106340384A
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- 238000000034 method Methods 0.000 title claims abstract description 76
- 239000000843 powder Substances 0.000 claims abstract description 96
- 230000008018 melting Effects 0.000 claims abstract description 28
- 238000004372 laser cladding Methods 0.000 claims abstract description 27
- 238000002844 melting Methods 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims description 55
- 229910052751 metal Inorganic materials 0.000 claims description 55
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 239000000155 melt Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 8
- 238000000227 grinding Methods 0.000 claims description 7
- 238000005253 cladding Methods 0.000 claims description 4
- 239000000411 inducer Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- 230000008014 freezing Effects 0.000 claims description 2
- 238000007710 freezing Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 230000003760 hair shine Effects 0.000 claims 2
- 238000000576 coating method Methods 0.000 description 26
- 230000015572 biosynthetic process Effects 0.000 description 25
- 239000011248 coating agent Substances 0.000 description 22
- 239000000428 dust Substances 0.000 description 20
- 238000010586 diagram Methods 0.000 description 15
- 238000005245 sintering Methods 0.000 description 15
- 238000007747 plating Methods 0.000 description 8
- 239000006071 cream Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
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- 230000005611 electricity Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000010309 melting process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a method for forming an exterior electrode of a passive device and a passive device having the exterior electrode. The method comprises the steps of preparing a passive device body; and forming the exterior electrode through melting conductive powder and combining the molten conductive powder with the passive device body according to a laser cladding method.
Description
This application claims submit in Korean Intellectual Property Office on July 10th, 2015
The priority of 10-2015-0098295 korean patent application and rights and interests, the disclosure of described korean patent application
Content is incorporated herein by this.
Technical field
Present inventive concept is related to a kind of method of external electrode forming passive device and the nothing including this external electrode
Source device.More specifically, present inventive concept is related to the dispatch from foreign news agency that a kind of use laser melting coating forms passive device
The method of pole and the passive device including this external electrode.
Background technology
The passive device of such as inducer and capacitor may include external electrode.When manufacturing passive device, lead to
Often external electrode can be formed using metal paste.
Generally, when forming the external electrode of passive device, conductive powder is prepared into the form of cream, and will
The sintering chip (i.e., passive main body) with the external electrode of exposure is immersed in metal paste to allow metal paste
It is attached to chip.In this case, conductive powder is being made form, dipping main body and the burning of cream
The plenty of time is needed, to increase adhesive force during knot chip.
The technique of the formation external electrode according to prior art, by the sintering core of the interior electrode by having exposure
Piece (polishing chip) is dipped in the electrode cream comprising metal dust, glass frit powder, resin and solvent,
And be dried and sinter chip to form external electrode.
Content of the invention
In prior art approaches, need to prepare the technique, by the main body of passive device (i.e., of metal paste powder
Sintering chip) it is dipped into the technique in metal paste and the technique of the metal paste after drying and/or sintering dipping,
Thus leading to relative complex technique.
The exemplary embodiment of present inventive concept provides a kind of use laser melting and coating technique to form the side of external electrode
Method.
It is brilliant that the another aspect of present inventive concept provides a kind of inclusion to have the melting and solidification being formed by fine grain
The passive device of the external electrode of body structure.
According to the exemplary embodiment of present inventive concept, a kind of method of the external electrode of formation passive device can
Including: prepare passive device main body；Using laser cladding by making conductive powder melt binding to passive
The end of apparatus main body forms external electrode.
When forming external electrode, in the end regions of passive device, thermal deformation occurs, thus forming heat affecting
Area (haz), wherein, makes conductive powder melt binding cover described end by using laser cladding
Portion region.
When forming external electrode, the fused junction of passive device main body can be provided to by making laser be irradiated to
Close the conductive powder in region and so that conductive powder is melted and make the metal freezing of melting form external electrode, institute
State laser and be irradiated to the powder being dispersed on melt binding region, the powder dropping on melt binding region
Or on the powder of scattered powder and subsequent whereabouts.In cross section, it is irradiated to swashing on scattered powder
Light can become be more than or equal to 0 ° with the top vertical with melt binding region with respect to melt binding region
And the angle less than 90 ° is irradiated.It is irradiated to the laser on the powder dropping on melt binding region
The angle that laser optical path can not interfered with passive device main body in cross section is irradiated, and described angle is relatively
In powder vertical falling direction more than or equal to 0 ° and less than in the range of 180 °.
When forming external electrode, can arrange and provide melt binding region by laser cladding by conductive powder
At least one powdering inlet, and in cross section, the direction of powdering inlet is formed at respect to fused junction
Close region the top vertical with melt binding region become more than or equal to 0 ° and be less than 90 ° angle it
Interior.
When forming external electrode, when melt binding is executed on end surface, can be so that end surfaces be straight
Vertical form vertically executes melt binding, when peripheral part execution melt binding in end surfaces,
When can be horizontally disposed with end surfaces with rotate passive device main body mode or with tilt when with arrange and turn
The mode of the main body of dynamic passive device is executing melt binding.
In the exemplary embodiment, in the technique forming external electrode, can pass through to make using laser cladding
The conductive powder melt binding being formed by different materials to form multiple external electrodes.
According to the exemplary embodiment of present inventive concept, a kind of passive device may include passive device main body and
It is formed at the external electrode on the end of passive device main body, wherein, passive device main body has heat affected area,
Wherein, thermal deformation occurs in the end regions being covered by external electrode of passive device main body.
Compared with the performance of the remaining area of passive device main body, in particle size and mechanical performance extremely
Few one side, the heat affected area of passive device main body can have different performances.In particle size and machine
At least one of tool performance aspect, the performance of the heat affected area of passive device main body can be uneven,
And heat affected area can have the remaining area with passive device main body towards the remaining area of passive device main body
The close performance of performance.
External electrode can be made up of two or more electrode layers overlieing one another and formed by different metal.
Brief description
By the detailed description carrying out below in conjunction with the accompanying drawings, the above and other aspect of present inventive concept, spy
Advantage of seeking peace will be more clearly understood, in the accompanying drawings:
Fig. 1 be schematically show exemplary embodiment according to present inventive concept formation passive device outer
The diagram of the technique of electrode；
Fig. 2 a and Fig. 2 b be schematically show the exemplary embodiment according to present inventive concept formation passive
The diagram of the technique in the method for the external electrode of device；
Fig. 3 a and Fig. 3 b is the formation schematically showing the another exemplary embodiment according to present inventive concept
The diagram of the technique in the method for the external electrode of passive device；
Fig. 4 is the formation passive device schematically showing the another exemplary embodiment according to present inventive concept
The part of the technique of external electrode diagram；
Fig. 5 is outside the inclusion of the passive device schematically showing the exemplary embodiment according to present inventive concept
The diagram of the part of electrode；
Fig. 6 is the bag of the passive device schematically showing the another exemplary embodiment according to present inventive concept
Include the diagram of the part of external electrode.
Specific embodiment
Hereinafter, it is described below the embodiment of present inventive concept with reference to the accompanying drawings.
However, present inventive concept can be embodied in many different forms, and it is not necessarily to be construed as limiting to
In specific embodiment set forth herein.More precisely, thesing embodiments are provided so that the disclosure will be thorough
Bottom and complete, and the scope of the present disclosure is fully conveyed to those skilled in the art.
Throughout the specification it will be appreciated that, when element (such as, layer, region or wafer (substrate))
Be referred to as " " another element " on ", " being connected to " another element or " being attached to " another element
When, its can directly " " another element " on ", " being connected to " another element or " being attached to " another
One element, or there may be other elements between them.On the contrary, when element is referred to as " directly
" another element " on ", " being directly connected to " another element or during " being bonded directly to " another element,
Can not there is element between them or layer.Identical label indicates identical element all the time.As
Used herein, term "and/or" include any of one or more of listed continuous item and
All combine.
It will be apparent that, term first, second, third, etc. can be used herein to describe each component, assembly,
Region, layer and/or part, but these components, assembly, region, layer and/or part should not be subject to these terms
Restriction.These terms be only used for by a component, assembly, region, layer or part with another component,
Assembly, region, layer or part distinguish.Therefore, in the situation of the teaching without departing from exemplary embodiment
Under, the first component, assembly, region, layer or the part that are discussed below can be named as second component, group
Part, region, layer or part.
Here can using such as " ... on ", " top ", " ... under " and " lower section "
Deng space relative terms, to be easy to describe the relation of an element as shown in drawings and other elements.
It will be appreciated that space relative terms are intended to encompass device in addition to the orientation described in the accompanying drawings existing
Using or operation in different azimuth.For example, if the device in accompanying drawing is reversed, it is described as be in
Other elements " on " or " top " element subsequently will be positioned in other elements " under " or " under
Side ".Therefore, term " ... on " can specific direction with reference to the accompanying drawings and include " ... on "
" ... under " two kinds of orientation.Described device (can be ratated 90 degrees or in its other party by other positioning
Position), and the space relative descriptors being used herein can be made with corresponding explanation.
Term as used herein is only used for describing specific embodiment, rather than is intended to limit present inventive concept.
As used in this, unless the context clearly indicates otherwise, the form " (kind) " of otherwise odd number
" being somebody's turn to do (described) " is also intended to the form including plural number.It will be further understood that making in this specification
Term "comprising" and/or enumerate " inclusion " feature stated of presence, entirety, step, behaviour
Work, component, element and/or the group that they form, but do not preclude the presence or addition of one or more other
Feature, entirety, step, operation, component, element and/or the group that they form.
Hereinafter, present inventive concept is described the schematic diagram with reference to the embodiment illustrating present inventive concept
Embodiment.In the accompanying drawings, for example, due to production technology and/or tolerance, shown shape can be estimated
Deformation.Therefore, the embodiment of present inventive concept should not be construed as being limited to the spy in region being shown in which
Setting shape, for example, the embodiment of present inventive concept includes the change due to manufacturing the shape leading to.Below
Embodiment also can be made up of one or combinations thereof.
The content of invention described below design can have various constructions, although and only proposing here
Required construction, but not limited to this.
Will be described in detail with reference to the accompanying drawings the exemplary embodiment according to inventive concept forms the outer of passive device
The method of electrode.In this case, the label not directly being shown in explained in figure should be by ginseng
Examine the label that remaining in figure indicates to understand, identical label will be used for indicating same or like from start to finish
Element.
Fig. 1 be schematically show exemplary embodiment according to present inventive concept formation passive device outer
The diagram of the technique of electrode.Fig. 2 a and Fig. 2 b is the exemplary reality schematically showing according to present inventive concept
Apply the diagram of the technique in the method for external electrode of formation passive device of example.Fig. 3 a and Fig. 3 b is to illustrate
Property illustrate another exemplary embodiment according to present inventive concept the external electrode of formation passive device method
In technique diagram.Fig. 4 is the another exemplary embodiment schematically showing according to present inventive concept
Form the diagram of the part of the technique of external electrode of passive device.
Fig. 5 and Fig. 6 is the passive device schematically showing the exemplary embodiment according to present inventive concept
Including the diagram in the section of the part of external electrode, therefore, reference will be carried out when describing present inventive concept.
With reference to Fig. 1, the external electrode of formation passive device of the exemplary embodiment according to present inventive concept
Method mays include: prepares passive device main body；Form external electrode 13.When preparing passive device main body,
Passive device main body 11 can be prepared.For example, passive device can be inducer or capacitor.In this feelings
Under condition, passive device can be laminater, but not limited to this.
For example, passive device can have the main body of rectangular parallelepiped shape, but not limited to this.Figure
1 to Fig. 4 shows formation dispatch from foreign news agency in the passive device main body 11 have rectangular parallelepiped shape
The technique of pole.
Then, will describe, referring to figs. 1 to Fig. 4, the technique forming external electrode in detail.When forming external electrode,
Can pass through to make conductive powder 1 melt binding of such as metal dust passive to preparation by laser cladding
The end of apparatus main body 11 is forming external electrode 13.That is, external electrode region need not be made to be dipped into gold
Belong in cream and then sinter described cream or use forms dispatch from foreign news agency according to the plating method of prior art on apparatus main body
Pole, but using the laser melting and coating technique as solder technology, dispatch from foreign news agency can be formed on passive device main body 11
Pole 13.In the case of using laser melting and coating technique, even if no complicated technology (such as, forms Seed Layer
And the technique of the electroless coating of execution plating or similar plating technic, or the end of apparatus main body is dipped into
The technique executing sintering in metal paste and then to it), also can be readily formed external electrode 13.
In this case, the end of passive device main body 11 refers not only to the edge of passive device main body and sets
Put the end of the relevant horizontal direction in direction of passive device, and refer to passive device main body along whole directions
The end of (vertically, in transverse direction and along direction forwardly and rearwardly).In this situation
Under, end not necessarily refers to the end along single direction, can refer to the end along both direction.For example, referring to
Fig. 1, external electrode 13 may be formed at passive device main body 11 based on passive device usual setting side
To two ends on, but not limited to this.
Fig. 5 and Fig. 6 is the exemplary embodiment manufacture schematically showing respectively including according to present inventive concept
The end surfaces of the part of the passive device of external electrode diagram.With reference to Fig. 5 and Fig. 6, according to exemplary
Embodiment, during forming external electrode using laser cladding, in passing through of passive device main body 11
The end regions that the melt binding (for example, the melt binding of metal dust) of conductive powder covers occur
Thermal deformation.In this case, region thermal deformation is heat affected area (haz) 11a.With passive
The performance of the remaining area of apparatus main body 11 is compared, in particle size and/or mechanical properties, hot shadow
Ring area 11a and can have different performances.For example, at least one of particle size and mechanical performance side
Face, the whole region of heat affected area 11a can be uneven.For example, heat affected area 11a can be towards no
The remaining area of source device main body 11 has close with the performance of the remaining area of passive device main body 11
Performance.
For example, heat affected area 11a may be formed to have and by dispatch from foreign news agency on the end of passive device main body 11
Identical or bigger region is compared that is to say, that in fig. 5 and fig., in heat in the region that pole 13 covers
On the surface of zone of influence 11a, the side of the remaining area with respect to passive device main body of heat affected area 11a
Boundary can be identical with the edge in the region that external electrode 13 is covered, although not showing that, described border can surpass
Cross the edge in the region that external electrode 13 is covered.
For example, according to exemplary embodiment, when forming external electrode, can be by providing to passive device
The conductive powder 1 (such as metal dust) in the melt binding region of main body 11 is gone up irradiating laser 3 to make gold
Belong to powder melts and so that motlten metal 1a is solidified and form external electrode 13.In Fig. 1 to Fig. 4, label
1a instructs electro-powder melt or metal melt.In this case, laser 3 can be made to be irradiated to dispersion
Drop to powder or dispersion on melt binding region in the powder on melt binding region, (just)
Powder and subsequent fall powder on.Laser 3 is made to be irradiated to although Fig. 1 to Fig. 4 illustrate only
The situation on the conductive powder of such as metal dust falling just on melt binding region, but can be by making
Laser 3 is irradiated to the powder being dispersed on melt binding region and makes powder melts combine to form external electrode
13.Additionally, after to the powder execution laser melting and coating process being dispersed on melt binding region, all
When conductive powder 1 as metal dust can extraly fall on melt binding region, executable laser melting coating.
For example, when the conduction of the such as metal dust making laser 3 be irradiated to be dispersed on melt binding region
When on powder 1, can make laser 3 in cross section with respect to melt binding region and melt binding region
The angle that vertical top becomes to be less than 90 ° more than or equal to 0 ° is irradiated.
Meanwhile, reference picture 2a, when laser 3 is radiated at the such as metal just dropping on melt binding region
When on the conductive powder 1 of powder, laser 3 can be made not interfere laser with passive device main body 11 in cross section
The angle of 3 light path is irradiated, and described angle is being more than with respect to the direction vertically falling with powder
Within being less than 180 ° equal to 0 °.Fig. 2 a not shown in cross section with respect to powder vertical falling direction
Laser illumination angle is more than or equal to 90 ° of situation, but laser 3 can be irradiated to and drop on melt binding region
Conductive powder 1 compare on lower position, so that the conductive powder 1 of such as metal dust melts.
In this case, in cross section with respect to powder vertical falling direction be less than 180 ° more than 90 °
Within angle, passive device main body 11 should not interfere with the light path of laser 3.Further, since preferably can make
Laser 3 is radiated on the whole whereabouts scope of the conductive powder 1 of the such as metal dust of whereabouts, best
Form vertical falling direction closely 180 ° of the illumination angle in cross section with respect to powder.
Additionally, reference picture 2b, when laser 3 is radiated on the conductive powder 1 of such as metal dust, swash
Light 3 can be irradiated along at least one direction.That is, laser 3 can be irradiated along multiple directions.
Although Fig. 2 b show a case that laser 3 only section partly in along multiple directions irradiate, this
Bright design not limited to this.Laser 3 can be irradiated along remaining direction in cross section.
Meanwhile, the wavelength of the laser 3 of irradiation can diversely be formed.Conduction in view of such as metal dust
The performance of powder 1, optional intensity suitably has the laser 3 of suitable wavelength.
In another embodiment, reference picture 3a and Fig. 3 b, the such as metal powder discharged from powdering inlet 20
The conductive powder 1 at end can arrange melt binding region can be while dropping on melt binding region
Melted by laser 3.In this case, reference picture 3b, can be arranged with powder down to melt binding
At least one powdering inlet 20 that the conductive powder 1 of such as metal dust is discharged by the form on region.
In this case, reference picture 3a, in cross section, the direction of powdering inlet 20 may be formed at phase
The melt binding region top vertical with melt binding region is become to be less than to 90 ° of angle more than or equal to 0 °
Within degree.
Additionally, referring to figs. 1 to Fig. 4, in the exemplary embodiment, passive device main body 11 can be in rectangular
Shape.Although not shown, even if be formed at that in external electrode 13 there is other shape (non-length
Cube shape) the end of passive device in the case of, also can be applied to using such as metal dust
Conductive powder 1 laser cladding.
For example, referring to Fig. 1 to Fig. 4, external electrode 13 may be formed at the end of two ends of rectangular shape
On peripheral part of surface and its end surfaces.In Fig. 1 to Fig. 4, on label 13a finger tip surface
Application (application) region, the application region on the peripheral part on label 13b finger tip surface.Also
It is to say, external electrode can have by making on peripheral part that the application region 13a on end surfaces is with end surfaces
Application region 13b combination and formed region.In this case, external electrode 13 can be by making such as
Conductive powder 1 melt binding of metal dust to end surfaces and then makes conductive powder 1 melt binding to end
The peripheral part on surface is forming.For example, when rotating passive device main body 11, conductive powder 1 can be made
Melt binding is to peripheral part of end surfaces.Although not shown, make leading of such as metal dust
Electro-powder 1 melt binding in the case of end surfaces, rotatable passive device main body 11.In this situation
Under, the end surfaces of two ends of rectangular shape can be a pair relative end surfaces of rectangular shape,
Peripheral part of the end surfaces of rectangular shape can be provided in the end table relative with a pair around end surfaces
Part in the adjacent circumferential surface in face.For example, along its length two surfaces of rectangular shape can
It is end surfaces, but not limited to this.
For example, referring to Fig. 1 to Fig. 4, when executing melt binding on end surfaces, end surfaces are that edge is perpendicular
Nogata is to vertical, and executes melt binding on end surfaces using laser cladding.Additionally, reference picture
1, when melt binding is executed on peripheral part of end surfaces, when its end surfaces is horizontally set,
Rotatable passive device main body 11, and laser melting coating can be executed on peripheral part of end surfaces.Alternatively,
With reference to Fig. 4, when laser melting coating is executed on peripheral part of end surfaces, when making passive device main body
When passive device main body 11 rotatable passive device main body 11 can be set while 11 inclination, can use
Laser melting coating makes conductive powder 1 melt binding of such as metal dust.
For example, referring to Fig. 6, when forming external electrode, can pass through to make such as metal using laser cladding
Conductive powder 1 (being formed by the different materials) melt binding of powder to form multiple external electrodes 131,132
With 133.Fig. 6 shows the passive device including the external electrode 13 with multiple structure.
For example, the formation of external electrode may include formation first electrode layer and forms additional electrode layer, can pass through
Laser cladding is repeated one or more times the formation of additional electrode layer.Fig. 6 shows three external electrodes of formation
The situation of layer 131,132 and 133, but it is provided only by the mode of example.Also can be formed such as
The multiple structure of two-layer or four layers etc..When forming first electrode layer, can pass through to make using laser cladding
The end of the first conductive powder melt binding of such as metal dust to passive device main body 11 to form
One outer electrode layer 131.Formed additional electrode layer when, can be repeated at least once more or more frequently side
Formula makes the additional conductive powder melt binding of such as additional metal powder to first by using laser cladding
Outer electrode layer 131 to form additional electrode layer 132 and 133 respectively.In this case, attached in formation
Power up the such as additional metal powder using during pole additional conductive powder can by with form previous electrode layer
When the different material of the material of the conductive powder of previous electrode layer that uses formed.For example, referring to Fig. 6,
The first external electrode layer 131 can be formed by the laser melting coating of copper powders, swashing of silicon (si) powder can be passed through
Light cladding forms the second electrode lay 132 on the first external electrode layer 131, can be melted by the laser of nickel by powder
Overlay on formation the 3rd outer electrode layer 133 on the second electrode lay 132, but present inventive concept not limited to this.
Additionally, with reference to Fig. 6, when forming additional electrode layer when forming external electrode, due to supplemantary electrode
Layer is formed on electrode layer previously by laser melting coating, and therefore performance changes according to laser melting coating (i.e.,
Thermal deformation) heat affected area 131a and 132a may be formed at the previous electricity being attached that electrode layer is covered
On the surface of pole layer.In figure 6, the depth of heat affected area 131a and 132a and thickness are by by example
Mode illustrate, to help understand present inventive concept.For example, compared with the performance of remaining part,
Particle size and/or mechanical properties, the performance of heat affected area 131a and 132a can be different.
Meanwhile, in figure 6 although the heat affected area 11a being formed in passive device main body 11 is shown as
Single region, but the region being formed by making heat deformable regions assemble, described heat deformable regions exist
Form the second external electrode layer 132 by laser melting coating formation the first external electrode layer 131, by laser melting coating
And formed during the 3rd outer electrode layer 133 is formed by laser melting coating.
Additionally, in figure 6, because heat affected area 131a and 132a is also formed in the first external electrode layer 131
In the second external electrode layer 132, therefore, as the formation of the first external electrode layer 131, can be by swashing
Light cladding is executing the formation of the second external electrode layer 132 and the 3rd outer electrode layer 133.However, and Fig. 6
Shown in situation different, only the first external electrode layer 131 can be formed by laser melting coating, outside second
Electrode layer 132 and the 3rd outer electrode layer 133 can be formed by the other method of plating method etc., and
Non-laser cladding method.If do not execute on the second external electrode layer 132 and/or the 3rd outer electrode layer 133 swashed
Light cladding, for example, when executing plating technic thereon, then will not form on outer electrode layer previously
Heat affected area.However, compared with the situation of some layers forming external electrode 13 only by laser melting coating,
In the case of the whole layers forming external electrode 13 by laser melting coating, simplify technique and production can be increased
Efficiency.That is, as shown in Figure 6, and by outer electrode layer being soaked according to correlation technique
To in metal paste and then after sintering metal cream, execution plating technic to form the situation phase of multilamellar outer electrode layer
Ratio is in the whole outer electrode layers forming the external electrode 13 with multiple structure by laser melting coating
Under, can be by only changing the conductive powder 1 of such as metal dust come shape in single laser melting and coating process
Become multi-layered electrode layer, therefore, technique can be significantly simplified and processing speed can be significantly increased.
When the method for the external electrode of the formation passive device using the embodiment according to present inventive concept, with
According to prior art electrode layer is dipped in metal paste and sintered paste after form the situation phase of external electrode
Ratio can Simplified flowsheet.Additionally, when the formation passive device using the embodiment according to present inventive concept
During the method for external electrode, with according to prior art electrode layer is dipped in metal paste and sintered paste after
The situation forming external electrode is compared, and can increase processing speed thus leading to the raising of the productivity.
Additionally, different from prior art methods, the coating processes of external electrode and sintering process can be reduced to
One technique.Furthermore, it is not necessary that preparing the conductive powder of paste to allow Simplified flowsheet.
According to the embodiment of present inventive concept, when using laser cladding, because laser 3 can be using height
Energy melts to allow conductive powder 1 to be attached to passive device main body 11 (i.e., at once making conductive powder
Sintering chip), to be noticeably greater than, manufacture can be executed according to the speed of the impregnation technology speed of prior art
Technique.Additionally, fusing conductive powder (that is, metal melt 1a) and be exposed to passive device master
The interior electrode in the melt binding region of body can melt simultaneously and mix, therefore, it is possible to provide enough degree of adhesions.
Therefore, there is no need to sintering process.
Additionally, according to the embodiment of present inventive concept, conducting powder is made by sintering process with using metal paste
The ordinary circumstance that end is retained is compared, and external electrode 13 can only be formed by simple metal, therefore, can reduce by
The appearance of the faulty goods leading in impurity.
Additionally, according to the embodiment of present inventive concept, external electrode 13 can only be formed by simple metal, therefore,
It is significantly reduced the thermal deformation of product.
Then, by the passive device of the inclusion external electrode of the embodiment describing according to present inventive concept.At this
Kind in the case of, with reference to according to foregoing example embodiment formation passive device external electrode method and
Fig. 1 to Fig. 4, it should be understood that described description, will omit the explanation repeating.
Fig. 5 is outside the inclusion of the passive device schematically showing the exemplary embodiment according to present inventive concept
The diagram in the section of the part of electrode.Fig. 6 is the another exemplary schematically showing according to present inventive concept
The diagram of the end surfaces of part of inclusion external electrode of the passive device of embodiment.
With reference to Fig. 1, Fig. 5 and/or Fig. 6, the passive dress of the inclusion external electrode 13 according to exemplary embodiment
Put and may include passive device main body 11 and external electrode 13.For example, passive device can be inducer or electric capacity
Device.In this case, passive device can be laminater, but not limited to this.In passive device main body
In 11 inside, passive device may include coiler part or may include interior electrode.For example, passive device master
Body 11 can be formed by ceramic layer or magnetosphere.External electrode 13 may be formed at the end of passive device main body 11
On.Fig. 5 and Fig. 6 respectively illustrates the section of the part of passive device, therefore, respectively illustrates passive
The section that the end of apparatus main body 11 is covered by external electrode 13.
In this case, with reference to Fig. 5 and Fig. 6, covered by external electrode 13 in passive device main body 11
In the end regions of lid, passive device main body 11 can have the heat affected area 11a thermal deformation wherein.
Heat affected area 11a can be during use is manufactured by the heat of the generations such as welding by substrate (female)
Heat on material leads to the region of its performance change, and in the exemplary embodiment of present inventive concept,
Can be formed during the formation external electrode 13 using such as laser cladding and be covered by by external electrode 13
End regions in thermal deformation lead to the heat affected area 11a of its performance change.
For example, because the external electrode 13 of passive device is formed using laser cladding, therefore it can have
Have and crystal structure is condensed by the melting that fine grain is formed.
In the exemplary embodiment, compared with the performance of the remaining area of passive device main body 11, in granule
At least one of size and mechanical performance aspect, the heat affected area 11a of passive device main body 11 can have
Different performances.
In the exemplary embodiment, at least one of particle size and mechanical performance aspect, passive dress
The performance putting the heat affected area 11a of main body 11 can be uneven.Heat affected area 11a is towards passive device
The remaining area of main body 11 can have the performance close with the performance of the remaining area of passive device main body 11.
For example, referring to Fig. 6, in the exemplary embodiment, external electrode 13 can be by overlieing one another and by difference
Two or more electrode layers 131,132 and 133 construction that material is formed forms.In figure 6, pass through
The mode of example provides the external electrode 13 with three-decker, and can be formed have such as double-layer structure or
The external electrode 13 of four-layer structure etc..
In this case, as shown in fig. 6, remaining dispatch from foreign news agency in addition to the outer electrode layer 133 of outermost
Pole layer 131 and 132 can have heat affected area 131a and 132a, wherein, the performance in shown region and its table
The performance of the remainder that the electrode layer being formed on thereon near face covers is different.That is,
In this case, according to the first external electrode layer 131 similar mode, tool can be formed by laser cladding
There is the upper electrode layer 132 of the outer electrode layer 131 of heat affected area 131a and there is the outer of heat affected area 132a
The upper electrode layer 133 of electrode layer 132.According to the formation by the electrode of laser cladding, heat affected area
131a and 132a may be formed in the region of melt binding base material.
Additionally, different from the embodiment shown in Fig. 6, can be formed by plating method rather than laser cladding
Remaining electrode layer in addition to being arranged on the first electrode layer 131 in foot is (that is, shown in Fig. 6
The second external electrode layer 132 and/or the 3rd outer electrode layer 133), in this case, will not pass through
The near surface of the lower electrode layer of outer electrode layer that coating method is formed forms heat affected area.
According to the exemplary embodiment of present inventive concept, because heat affected area 11a may be formed at passive device
The near surface being covered by external electrode 13 in the surface of main body 11, and external electrode 13 do not have and makes conducting powder
The structure that last granule is bonded to each other by the sintering process according to the metal paste of prior art, therefore, can
With the not side by electrode zone being immersed metal paste, remove electrode zone from cream and it is executed with sintering
Method forms the external electrode 13 of the passive device according to present inventive concept.
Additionally, heat affected area 11a can not formed by plating method, wherein, heat affected area 11a is formed at no
The near surface being covered by external electrode 13 in the surface of source device main body 11.Described heat affected area 11a by
In by weld or deformation that thermal cutting etc. causes and formed, and external electrode 13 does not suffer from thermal cutting work
Skill, therefore, experiences welding procedure.In this case, in the embodiment of present inventive concept, can lead to
Cross the conductive powder 1 execution laser melting coating to such as metal dust to form external electrode 13.
Heat affected area 11a may be formed at the table being covered by external electrode 13 in the surface of passive device main body 11
The vicinity in face, defines the outer of passive device according to present inventive concept thus can determine that by laser melting coating
Electrode 13, and, can pass through to make conductive powder 1 fused junction of such as metal dust using laser cladding
Close and to form external electrode 13, thus can be manufactured by the technique simplifying passive compared with the method for the prior art
Device.Additionally, different from electrode zone being immersed the method executing sintering in metal paste and to it, use
Laser cladding, therefore, external electrode 13 is only formed by simple metal and is led to due to impurity so that can reduce
Defect.In addition, it is possible to provide only have the crystal structure of simple metal, thus the heat change of product can be substantially reduced
Shape.
As set forth above, according to the exemplary embodiment of present inventive concept, when by using laser melting coating
When method makes fusion of metal powder to form external electrode, process integrations various used in prior art can be arrived
In one technique, thus leading to the raising of the productivity.That is, with according to prior art by electricity
Pole layer forms external electrode situation after being dipped in metal paste and executing sintering to it is compared, and can simplify manufacture
The technique of product.Therefore, processing speed can be increased thus leading to the improvement of the productivity.
Additionally, according to the exemplary embodiment of present inventive concept, being made by sintering process with using metal paste
The ordinary circumstance that conductive powder is retained is compared, and external electrode 13 can only be formed by simple metal, therefore, can
The appearance of the faulty goods that minimizing is led to due to impurity.
Although having shown that above and describing exemplary embodiment, will for those skilled in the art
It is evident that in the case of without departing from the scope of the present invention being defined by the claims, modification can be made
And modification.
Claims (15)
1. a kind of method of the external electrode forming passive device, methods described includes:
Prepare passive device main body；
Formed outward by making the end of conductive powder melt binding to passive device main body using laser cladding
Electrode.
2. method according to claim 1, wherein, when forming external electrode, in passive device
Thermal deformation in end regions, thus forming heat affected area, wherein, make to lead by using laser cladding
Electro-powder melt binding and cover described end regions.
3. method according to claim 1, wherein, when forming external electrode, is shone by making laser
It is mapped to conductive powder and so that conductive powder is melted and make the metal freezing of melting form external electrode, wherein,
Described conductive powder is provided to the melt binding region of passive device main body,
Described laser is irradiated to the powder being dispersed on melt binding region, drops on melt binding region
Powder or scattered powder and subsequent fall powder on.
4. method according to claim 2, wherein, when forming external electrode, in cross section, shines
It is mapped to laser on scattered powder with vertical with melt binding region with respect to melt binding region upper
Portion becomes more than or equal to 0 ° and the angle less than 90 ° is irradiated.
5. method according to claim 2, wherein, when forming external electrode, in cross section, shines
The laser being mapped on the powder dropping on melt binding region does not interfere laser optical path with passive device main body
Angle be irradiated, described angle with respect to powder vertical falling direction more than or equal to 0 ° and little
In the range of 180 °.
6. method according to any one of claim 1 to 5, wherein, when forming external electrode,
Laser is irradiated along at least one direction.
7. method according to claim 6, wherein, when forming external electrode, laser is passed through in setting
Conductive powder is provided at least one powdering inlet in melt binding region by cladding method, and in cross section,
The direction of powdering inlet is formed at the top vertical with melt binding region with respect to melt binding region and becomes
More than or equal to 0 ° and less than within 90 ° of angle.
8. method according to any one of claim 1 to 5, wherein, passive device main body is in square
Shape parallelepiped shape,
When forming external electrode, external electrode is made to be formed at the end of two ends of rectangular parallelepiped protrusion part shape
On peripheral part of the end surfaces of surface and rectangular parallelepiped protrusion part shape, melted by making conductive powder
It is attached to end surfaces and then make conductive powder melt binding to the week of end surfaces when rotating passive device main body
Enclose partly to form external electrode.
9. method according to claim 8, wherein, when forming external electrode, when on end surfaces
During execution melt binding, melt binding is vertically executed with the upright form of end surfaces, when in end table
During peripheral part execution melt binding in face, when end surfaces are horizontally disposed with to rotate passive device main body
Mode or to execute melt binding in the way of arranging and rotating the main body of passive device when tilting.
10. method according to any one of claim 1 to 5, wherein, forms the step of external electrode
Rapid inclusion: using laser cladding by making the first conductive powder melt binding to the end of passive device main body
Portion is forming the first external electrode；
Additional by making additional conductive powder melt binding be formed to the first external electrode layer using laser cladding
Outer electrode layer,
Wherein, it is repeated once or is formed more times additional electrode layer by laser cladding, additional being formed
The additional conductive powder using during electrode layer by with forming the previous electrode layer using during previous electrode layer
The material that the material of conductive powder is different is formed.
A kind of 11. passive devices, including passive device main body and being formed on the end of passive device main body
External electrode,
Wherein, passive device main body has heat affected area, and wherein, thermal deformation occurs in passive device main body
The end regions being covered by external electrode in.
12. passive devices according to claim 11, wherein, remaining area with passive device main body
The performance in domain is compared, at least one of particle size and mechanical performance aspect, passive device main body
Heat affected area has different performances.
13. passive devices according to claim 12, wherein, in particle size and mechanical performance
At least one aspect, the performance of the heat affected area of passive device main body is uneven, and heat affected area
Towards passive device main body remaining area have close with the performance of the remaining area of passive device main body
Performance.
14. passive devices according to claim 11, wherein, external electrode is by overlieing one another and by not
Constitute with two or more electrode layers that metal is formed.
15. passive devices according to any one of claim 11 to 14, wherein, passive device
It is inducer or capacitor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0098295 | 2015-07-10 | ||
| KR1020150098295A KR102222611B1 (en) | 2015-07-10 | 2015-07-10 | Method for forming exterior electrode of passive device and passive device having exterior electrode |
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| CN106340384A true CN106340384A (en) | 2017-01-18 |
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| CN201610079567.1A Withdrawn CN106340384A (en) | 2015-07-10 | 2016-02-04 | Method for forming exterior electrode of passive device and passive device having exterior electrode |
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| CN87101108A (en) * | 1987-09-29 | 1988-03-30 | 中国科学院上海冶金研究所 | Hot spray process prepares the electrode of solid ceramic device |
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| JPH0329307A (en) * | 1989-06-26 | 1991-02-07 | Matsushita Electric Ind Co Ltd | Manufacture of laminated ceramic chip capacitor |
| KR101249030B1 (en) * | 2011-07-01 | 2013-04-01 | 주성엔지니어링(주) | Solar cell and Method for manufacturing the same |
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2015
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| KR102222611B1 (en) | 2021-03-05 |
| KR20170006905A (en) | 2017-01-18 |
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