CN87101108A - Hot spray process prepares the electrode of solid ceramic device - Google Patents
Hot spray process prepares the electrode of solid ceramic device Download PDFInfo
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- CN87101108A CN87101108A CN87101108.5A CN87101108A CN87101108A CN 87101108 A CN87101108 A CN 87101108A CN 87101108 A CN87101108 A CN 87101108A CN 87101108 A CN87101108 A CN 87101108A
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- electrode
- spraying
- solid ceramic
- ceramic component
- acetylene
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- 239000000919 ceramic Substances 0.000 title claims abstract description 38
- 239000007787 solid Substances 0.000 title claims abstract description 24
- 239000007921 spray Substances 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000005507 spraying Methods 0.000 claims abstract description 21
- 238000007751 thermal spraying Methods 0.000 claims abstract description 14
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000001257 hydrogen Substances 0.000 claims abstract description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims abstract description 11
- 239000004332 silver Substances 0.000 claims abstract description 11
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 9
- 239000000956 alloy Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000010953 base metal Substances 0.000 claims abstract description 5
- 238000007750 plasma spraying Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 13
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 7
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- QFXZANXYUCUTQH-UHFFFAOYSA-N ethynol Chemical group OC#C QFXZANXYUCUTQH-UHFFFAOYSA-N 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000007772 electrode material Substances 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- 238000010285 flame spraying Methods 0.000 claims 1
- -1 ormolu Substances 0.000 claims 1
- 238000007788 roughening Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 7
- 239000000843 powder Substances 0.000 abstract description 6
- 239000011159 matrix material Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- LNSPFAOULBTYBI-UHFFFAOYSA-N [O].C#C Chemical group [O].C#C LNSPFAOULBTYBI-UHFFFAOYSA-N 0.000 abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010583 slow cooling Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
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Abstract
The present invention is a kind of with base metal replacement silver, prepares the method for electrode on solid ceramic component with thermal spraying.The inventive method adopts conventional hot spray apparatus, with the spraying of oxygen-acetylene (hydrogen) flame and metal wire rod or with oxygen-acetylene (hydrogen) flame and alloy powder spraying or with plasma spraying, spray at the matrix positive and negative that is carved with the solid ceramic component that needs the clamping of the mask clamp of hole shape, lining forms electrode.The ohmic contact of electrode is good, the sample parameters uniformity.This method has alleviated labour intensity, has saved the consumption of a large amount of silver, and the production efficiency height, and the cycle is short, and technology investment is few.
Description
The present invention a kind ofly replaces silver with base metal, prepare the method for electrode with thermal spraying on the solid ceramic device, belongs to the usefulness electrode conductive material is made electrode on solid state device technology.
Must make on solid state components such as ceramic resistor, the electric capacity device and have the good ohmic electrodes in contact.The quality of this electrode of making on ceramic matrix directly has influence on the useful life and the electrical property of components and parts.For this reason, people have carried out broad research to the Ohm contact electrode of preparation solid ceramic device.The sixties, Am Ceram Soc Bull (Vol.39.p304(1960)) and J.Elec-Chemi Soc (Vol 107.p250(1960)) reported the Study of Ohmic Contact result of semiconductor ceramic electrode.In recent years, various ohmic contact slurries (Sino-Japan electronics sensitive technology seminar paper compilation 1986 No.67 and electronic component and material in March, 1984 No.12) " electrode of PTC pottery temperature-sensitive element " (sensitive components staff intelligence net proceeding in May, 1987) literary composition also touched upon chemical plating nickel electrode, magnetron sputtering aluminium electrode, burning ohmic contact ag paste electrode etc. have been developed into again.With these methods and material preparation ceramic component electrode, cost height, what have is also insecure.Wherein, the electrode that the magnetron sputtering aluminum is equipped with, resistance is bigger than normal, and production efficiency is low needs Special Equipment again, so impracticable.At present, industrial production generally adopts be nickel plating and by two kinds of silver by the method for overlying electrode.It mainly is to utilize nickel salt solution under the strong reductant effect that chemical nickel plating prepares the ceramic component electrode, obtains the nickel-phosphor alloy layer of deposition at the element surface with catalytic property.Concrete technological process is surface treatment → sensitization processing → activation processing → reduction → chemical plating.By the silvery power backup utmost point is that the ceramic component surface treatment is clean, with hairbrush silver slurry is coated in above the device, waits and carries out burning infiltration after doing.Like this by overlying electrode, complex process, and to consume a large amount of silver.In order to save silver, make technology for preparing electrode simple again, the invention provides and a kind ofly replace silver to do electrode material with multiple base metal, on solid ceramic component, prepare the method for good ohmic contact electrode with thermal spraying.
The objective of the invention is to adopt oxy-acetylene (hydrogen) flame and metal wire rod thermal spraying; Oxy-acetylene (hydrogen) flame and alloy powder thermal spraying and plasma spraying, the multiple single or multiple metal material electrode of quilt on the matrix of ceramic components, thus both saved silver, simplified technology again.
The present invention adopts oxy-acetylene (hydrogen) flame and metal wire rod gas blowout to be coated with or adopts oxy-acetylene (hydrogen) flame and alloy powder spraying or employing plasma spraying, spray at positive and negative two faces of the matrix that is carved with the solid ceramic component that needs the clamping of the mask clamp of hole shape, become electrode by complex.Before the spraying, solid ceramic component must clean up.It is as follows that thermal spraying of the present invention prepares the electrode device therefor and the material of solid ceramic device: spray equipment is conventional spraying equipment, comprises air compressor, gas tank, drainer, hydrogen cylinder, acetylene cylinder, air cleaner, pressure-reducing valve and spray gun.Wherein, condenser, gas tank, filter, pressure-reducing valve are in order to obtain the air of drying, cleaning, steady pressure.The conductive electrode metal material that adopts has aluminium, zinc, copper and zinc-WU alloy, copper-zinc alloy, copper-WU alloy or needed other conductive electrode material of ceramic components.Technical process is: the alligatoring of ceramic components substrate surface; Cleaning ceramic components and parts substrate; To be sprayed in the mask clamp that the cleaning-drying of packing into after the substrate drying is crossed.In addition, according to the demand of solid ceramic component electrode, in spray gun, pack into different metal wire materials or metal-powder.The metal wire material of spray gun of packing into is walked about in spray gun with certain speed, in order to constantly being melted by high temperature oxy-acetylene (hydrogen) flame at muzzle, by the compressed air piping and druming particulate that nebulizes, sprays on the solid ceramic component substrate surface and forms thin layer electrode.Certainly, the alloy powder of packing into sprays or adopts plasma spraying, then will adopt corresponding spray gun.In the course of injection, after the one side of ceramic component substrate spraying was finished, the mask clamp that can reverse sprayed its another side again.After two faces of ceramic component substrate all sprayed and finish, slow cooling can be opened anchor clamps to about 50 ℃ and be taken out.The process conditions of ceramic components electrode spraying are, earlier substrate are preheating to 200 ℃, reduce to 120 ℃-150 ℃ then and carry out thermal spraying again, and the thin layer electrode thickness of spraying generally is controlled at the 0.08-0.15 millimeters thick.Use thermal spraying of the present invention by the electrode of multiple solid ceramic component, ohmic contact is good, and sample parameters is even all consistent.
Advantage of the present invention is to have reformed the conventional method of the multiple solid ceramic component electrode of quilt that extensively adopts at present, has alleviated labour intensity, has saved the consumption of a large amount of silver.Thereby make by the work simplification of multiple ceramic component electrode, the electrode that is prepared into is even, and ohmic contact is good, and the production efficiency height, and the cycle is short, small investment.
Description of drawings:
Fig. 1 is thermal spraying apparatus figure of the present invention.Wherein, the 1st, compressor; The 2nd, condenser; The 3rd, gas tank; The 4th, air cleaner; The 5th, pressure-reducing valve; The 6th, hydrogen cylinder; The 7th, acetylene gas bottle; The 8th, spray gun; The 9th, be contained in wire or metal-powder in the spray gun; The 10th, be carved with the mask clamp that needs hole shape and the ceramic substrate of clamping.
Fig. 2 is solid ceramic device and the mask clamp that hole shape is arranged.Wherein, the 11st, substrate; The 12nd, the thin layer electrode of thermal spraying; The 13rd, be carved with the stainless steel mask clamp of required hole shape; The 14th, trip bolt on the anchor clamps and nut.
Below in conjunction with the description of drawings embodiments of the invention.
With surface coarsening the solid ceramic component substrate routinely technology clean, oven dry, put into dry stainless steel mask clamp through cleaning up with sampling technology, with screw, nut fastening after, send on the workbench under the spray gun, to be sprayed.
Embodiment 1.
In the present embodiment, pack into the metal wire material of spray gun is aluminium or saxonia metal wire.Oxygen pressure used in the spraying is 0.4 kilograms per centimeter
2; Acetylene air pressure is 0.5 kilograms per centimeter
2Before the solid ceramic component spraying, be preheating to 200 ℃ earlier, be cooled to 120 ℃-150 ℃ then, begin spraying.During spraying, spray the one side of solid-state components substrate earlier, the anchor clamps that reverse then spray another side again.After spraying was finished, slow cooling was taken out to about 50 ℃.The ohmic contact resistance that records coating electrode is better than adopting at present the ohmic contact resistance of the electrode of other method preparation, and the positive and negative performance is in full accord.In addition, also eliminated owing to prepare the electrical quantity inconsistency that electrode brings with other method.
Pack in spray gun copper or copper alloy electrode silk material, used hydrogen-pressure is the 5-6 kilograms per centimeter in the spraying
2; Acetylene air pressure is the 0.5-0.8 kilograms per centimeter
2Other technology, condition are with embodiment 1.Equally, the ohmic contact that records coating electrode is good, even, the component parameter unanimity.
Claims (3)
1, a kind of method that on solid ceramic component, prepares electrode, comprise solid ceramic component substrate surface roughening process, cleaning and conventional spraying equipment: air compressor, gas tank, drainer, hydrogen cylinder, acetylene cylinder, air cleaner, pressure-reducing valve, spray gun is characterized in that:
(1) replace silver with base metal, on solid ceramic component, prepare electrode with thermal spraying,
(2) base metal comprises aluminium, zinc, copper and aluminium alloy, zinc WU alloy, ormolu, copper WU alloy and other required metal of solid ceramic component conductive electrode,
(3) thermal spraying is spraying of oxy-acetylene (hydrogen) flame or plasma spraying,
(4) the spraying coating process condition is: earlier the ceramic components substrate is given heat to 200 ℃, reduce to 120 ℃ of-150 ℃ of sprayings then,
(5) there is one pair to be carved with the mask clamp that electrode needs hole shape.
2, thermal spraying according to claim 1 prepares the method for electrode on solid ceramic component, it is characterized in that, when being conductive electrode material with aluminium or kirsite, oxygen pressure used in the spraying is 0.4 kilograms per centimeter
2, acetylene air pressure is 0.5 kilograms per centimeter
2; When being conductive electrode material with copper or copper alloy, used oxygen is pressed and is the 5-6 kilograms per centimeter in the spraying
2, acetylene air pressure is the 0.5-0.8 kilograms per centimeter
2
3, thermal spraying according to claim 1 prepares the method for electrode on solid ceramic component, it is characterized in that, the thin layer electrode thickness of spraying is the 0.08-0.15 millimeters thick.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 87101108 CN1007297B (en) | 1987-09-29 | 1987-09-29 | Preparation of electrode of ceramic solid parts by means of hot-spraying process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 87101108 CN1007297B (en) | 1987-09-29 | 1987-09-29 | Preparation of electrode of ceramic solid parts by means of hot-spraying process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN87101108A true CN87101108A (en) | 1988-03-30 |
| CN1007297B CN1007297B (en) | 1990-03-21 |
Family
ID=4813190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 87101108 Expired CN1007297B (en) | 1987-09-29 | 1987-09-29 | Preparation of electrode of ceramic solid parts by means of hot-spraying process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1007297B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958169A (en) * | 2010-09-21 | 2011-01-26 | 中国西电电气股份有限公司 | ZnO resistance card bismuth-coating device for DC system and bismuth-coating method thereof |
| CN104392816A (en) * | 2014-10-17 | 2015-03-04 | 汕头市鸿志电子有限公司 | Electric arc spraying process for inner electrode |
| CN104729399A (en) * | 2013-12-24 | 2015-06-24 | 贵州航空发动机研究所 | High-temperature chip mounter for resistance strain gauge |
| CN104988456A (en) * | 2015-06-26 | 2015-10-21 | 武汉钢铁(集团)公司 | Production method for ultrathin steel strip with Cu-Sn/Sn-Au double composite coating |
| CN106340384A (en) * | 2015-07-10 | 2017-01-18 | 三星电机株式会社 | Method for forming exterior electrode of passive device and passive device having exterior electrode |
| CN107068403A (en) * | 2016-02-04 | 2017-08-18 | 株式会社村田制作所 | The manufacture method of electronic unit |
| CN107863212A (en) * | 2017-09-25 | 2018-03-30 | 江苏时瑞电子科技有限公司 | A kind of thermistor plasma spraying copper base metal bipolar electrode and preparation method thereof |
| CN110797215A (en) * | 2019-09-26 | 2020-02-14 | 益阳市锦汇电子有限公司 | Preparation device of small-volume high-specific-volume capacitor |
| WO2020232222A1 (en) | 2019-05-16 | 2020-11-19 | Dragonfly Energy Corp. | Systems and methods for dry powder coating layers of an electrochemical cell |
| WO2022082470A1 (en) * | 2020-10-21 | 2022-04-28 | Dongguan Littelfuse Electronics Company Limited | Masking paper protection technology for electronic component |
-
1987
- 1987-09-29 CN CN 87101108 patent/CN1007297B/en not_active Expired
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958169A (en) * | 2010-09-21 | 2011-01-26 | 中国西电电气股份有限公司 | ZnO resistance card bismuth-coating device for DC system and bismuth-coating method thereof |
| CN104729399A (en) * | 2013-12-24 | 2015-06-24 | 贵州航空发动机研究所 | High-temperature chip mounter for resistance strain gauge |
| CN104392816A (en) * | 2014-10-17 | 2015-03-04 | 汕头市鸿志电子有限公司 | Electric arc spraying process for inner electrode |
| CN104988456A (en) * | 2015-06-26 | 2015-10-21 | 武汉钢铁(集团)公司 | Production method for ultrathin steel strip with Cu-Sn/Sn-Au double composite coating |
| CN106340384A (en) * | 2015-07-10 | 2017-01-18 | 三星电机株式会社 | Method for forming exterior electrode of passive device and passive device having exterior electrode |
| CN107068403B (en) * | 2016-02-04 | 2019-11-26 | 株式会社村田制作所 | The manufacturing method of electronic component |
| CN107068403A (en) * | 2016-02-04 | 2017-08-18 | 株式会社村田制作所 | The manufacture method of electronic unit |
| CN107863212A (en) * | 2017-09-25 | 2018-03-30 | 江苏时瑞电子科技有限公司 | A kind of thermistor plasma spraying copper base metal bipolar electrode and preparation method thereof |
| WO2020232222A1 (en) | 2019-05-16 | 2020-11-19 | Dragonfly Energy Corp. | Systems and methods for dry powder coating layers of an electrochemical cell |
| EP3969188A4 (en) * | 2019-05-16 | 2023-01-25 | Dragonfly Energy Corp. | Systems and methods for dry powder coating layers of an electrochemical cell |
| CN110797215A (en) * | 2019-09-26 | 2020-02-14 | 益阳市锦汇电子有限公司 | Preparation device of small-volume high-specific-volume capacitor |
| CN110797215B (en) * | 2019-09-26 | 2022-01-04 | 益阳市锦汇电子有限公司 | Preparation device of small-volume high-specific-volume capacitor |
| WO2022082470A1 (en) * | 2020-10-21 | 2022-04-28 | Dongguan Littelfuse Electronics Company Limited | Masking paper protection technology for electronic component |
| US20220305522A1 (en) * | 2020-10-21 | 2022-09-29 | Dongguan Littelfuse Electronics Company Limited | Masking paper protection technology for electronic component |
| CN116829519A (en) * | 2020-10-21 | 2023-09-29 | 东莞令特电子有限公司 | Masking paper protection technique for electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1007297B (en) | 1990-03-21 |
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