WO2021054109A1

WO2021054109A1 - Pin terminal, connector, wire harness with connector, and control unit

Info

Publication number: WO2021054109A1
Application number: PCT/JP2020/032933
Authority: WO
Inventors: 倫丈竈本; 暁博加藤; 充弘公文代; 喜文坂
Original assignee: 株式会社オートネットワーク技術研究所; 住友電装株式会社; 住友電気工業株式会社
Priority date: 2019-09-19
Filing date: 2020-08-31
Publication date: 2021-03-25
Also published as: JP2021048094A

Abstract

This pin terminal comprises a stick-shaped substrate and a plated layer that covers a prescribed area of the substrate, wherein: the plated layer comprises a tin-based layer formed of a metal including tin; one end of the substrate includes a leading end covering part that covers a region of the substrate, the region fully extending in the peripheral direction; the tin-based layer includes the leading end covering part; the leading end covering part includes a thin film section and a thick film section at different locations in the peripheral direction of the substrate; and the material constituting the substrate is pure copper or a copper alloy having a Zn content of not more than 20 mass%.

Description

Pin terminal, connector, wire harness with connector, and control unit

The present disclosure relates to pin terminals, connectors, wire harnesses with connectors, and control units.
This application claims the priority based on Japanese Patent Application No. 2019-170932 of the Japanese application dated September 19, 2019, and incorporates all the contents described in the Japanese application.

A rod-shaped pin terminal is used as a terminal for connecting the other side terminal and the circuit board. The pin terminal typically has a base material made of a copper alloy and a tin-plated layer covering the surface of the base material, as described in the specification [0002] of Patent Document 1.

Patent Document 1 discloses a plating layer constituting the outermost layer in which a Sn—Pd-based alloy phase is present in the Sn matrix and the Pd content in the outermost layer is in a specific range. ..

JP 2015-094000

The pin terminals of this disclosure are
A pin terminal including a rod-shaped base material and a plating layer covering a predetermined region of the base material.
The plating layer includes a tin-based layer composed of a metal containing tin.
One end side of the base material is provided with a tip covering portion that covers the entire circumferential region of the base material.
The tin-based layer includes the tip covering portion and contains the tip covering portion.
The tip covering portion includes a thin film portion and a thick film portion at different positions in the circumferential direction of the base material.
The constituent material of the base material is a copper alloy having a Zn content of 20% by mass or less, or pure copper.

The connectors of the present disclosure are
The pin terminal of the present disclosure is provided.

The wire harness with a connector of the present disclosure is
The connector of the present disclosure and the wire harness are provided.
The wire harness is connected to the region on the other end side of the pin terminal.

The control unit of the present disclosure is
The connector of the present disclosure or the wire harness with the connector of the present disclosure and a circuit board are provided.
The circuit board and the region on one end side of the pin terminal are connected by solder.

FIG. 1 is a perspective view showing an outline of a pin terminal according to an embodiment. FIG. 2 is a cross-sectional view taken along the II-II cutting line shown in FIG. FIG. 3 is a cross-sectional view taken along the III-III cutting line shown in FIG. FIG. 4 is a side view showing an outline of the connector according to the embodiment. FIG. 5 is a side view showing an outline of the wire harness with a connector according to the embodiment. FIG. 6 is a side view showing an outline of the control unit according to the embodiment. FIG. 7 is a process diagram illustrating a method for manufacturing a pin terminal. FIG. 8A shows the sample No. prepared in Test Example 1. It is a figure which shows the micrograph which photographed the cross section which cut the region on one end side of the pin terminal 3 in the plane orthogonal to the axis. FIG. 8B is a diagram showing a magnified micrograph of a region surrounded by a broken line rectangle B in the photomicrograph of FIG. 8A. FIG. 8C is a diagram showing a magnified micrograph of a region surrounded by a broken line rectangle C in the photomicrograph of FIG. 8A. FIG. 8D is a diagram showing a magnified micrograph of a region surrounded by a broken line rectangle D in the photomicrograph of FIG. 8A. FIG. 8E is a diagram showing a magnified micrograph of a region surrounded by a broken line rectangle E in the photomicrograph of FIG. 8A. FIG. 9 is a graph showing the relationship between the heat treatment temperature, the maximum wetting force, and the number of tin protrusions for the pin terminals of each sample prepared in Test Example 2. FIG. 10 is a graph showing the relationship between the thickness of the outer layer made of pure tin and the maximum wetting force among the tin-based layers existing in the region on one end side of the base material for the pin terminals of each sample prepared in Test Example 2. Is. FIG. 11 shows the thickness of the inner layer made of an alloy containing tin and copper and the number of tin protrusions among the tin-based layers existing in the region on one end side of the base material for the pin terminals of each sample prepared in Test Example 2. It is a graph which shows the relationship with. FIG. 12A shows the sample No. 2 which was not heat-treated after the secondary plating in Test Example 2. It is a figure which shows the micrograph which photographed the surface of the thin film part about the pin terminal of 1. FIG. 12B shows the sample No. 2 in Test Example 2 in which the heat treatment temperature after the secondary plating was set to 200 ° C. It is a figure which shows the micrograph which photographed the surface of the thin film part about 2 pin terminals. FIG. 12C shows the sample No. 2 in Test Example 2 in which the heat treatment temperature after the secondary plating was 220 ° C. It is a figure which shows the micrograph which photographed the surface of the thin film part about the pin terminal of 4. FIG. 12D shows the sample No. 2 in Test Example 2 in which the heat treatment temperature after the secondary plating was 240 ° C. It is a figure which shows the micrograph which photographed the surface of the thin film part about 50 pin terminals.

[Issues to be solved by this disclosure]
Pin terminals that can prevent defective soldering are desired. Further, it is desirable to use a pin terminal which is excellent in solder wettability and also has excellent insertability when connecting to the mating terminal.

The area on one end side of the pin terminal is used for the area connected to the circuit board. The area on the other end of the pin terminal is used for the area connected to the other terminal.

Solder is generally used to connect the pin terminal and the through hole of the circuit board. With conventional pin terminals, solder icicles may occur when solder is applied. Solder icicles are icicle-shaped protrusions that are formed by the molten solder dripping and solidifying when soldering. In applications where a large number of pin terminals are arranged close to each other, if there is a pin terminal with long solder icicles, the solder icicles conduct conduction between this pin terminal and the pin terminal adjacent to this pin terminal. That is, a short circuit is conceivable.

Further, conventionally, in order to ensure good solder wettability, a so-called post-plating method is used as described in Patent Document 1. The post-plating method is a method in which a plate material is punched out or plastically processed to form a base material having a predetermined shape, and then a plating layer is formed on the base material. In the post-plating method, the outer peripheral surface of the base material is covered with a plating layer substantially over the entire circumference. Therefore, in the region on one end side of the pin terminal to which the solder is applied, the solder comes into contact with the tin plating layer without directly contacting the base material. Therefore, the pin terminals produced by the post-plating method are excellent in solder wettability.

However, in the post-plating method, the portion of the plating layer that covers the edge of the base material may be locally thickened, that is, an enlarged portion may be formed. If there is an enlarged portion in the region on the other end side of the pin terminal, the frictional force when the pin terminal is inserted into the mating terminal and connected tends to increase. If the frictional force is large, a large insertion force is required. As a result, the insertability of the pin terminal tends to decrease.

Some connectors have a large number of pin terminals. The insertion force at the connector increases in proportion to the number of pin terminals. Therefore, in applications such as those in which a large number of pin terminals are arranged close to each other as described above, the insertability of the connector tends to be further lowered. Therefore, it is desired to keep the insertion force low.

Patent Document 1 states that by providing the above-mentioned specific outermost layer, the above-mentioned insertion force can be lowered and good solder wettability can be ensured. However, if the outermost layer is formed by the post-plating method, the above-mentioned enlarged portion may occur. Therefore, there is room for improvement in reducing the insertion force. Further, in the manufacturing process, it is necessary to form a Pd plating layer. Therefore, there is room for improvement in terms of manufacturability.

Therefore, one of the purposes of this disclosure is to provide a pin terminal capable of preventing soldering defects. Another object of the present disclosure is to provide a connector, a wire harness with a connector, and a control unit capable of preventing soldering defects.

[Effect of the present disclosure]
The pin terminals of the present disclosure, the connectors of the present disclosure, the wire harness with the connector of the present disclosure, and the control unit of the present disclosure can prevent soldering defects.

[Explanation of Embodiments of the present disclosure]
First, the contents of the embodiments of the present disclosure will be listed and described.
(1) The pin terminal according to one aspect of the present disclosure is
A pin terminal including a rod-shaped base material and a plating layer covering a predetermined region of the base material.
The plating layer includes a tin-based layer composed of a metal containing tin.
One end side of the base material is provided with a tip covering portion that covers the entire circumferential region of the base material.
The tin-based layer includes the tip covering portion and contains the tip covering portion.
The tip covering portion includes a thin film portion and a thick film portion at different positions in the circumferential direction of the base material.
The constituent material of the base material is a copper alloy having a Zn content of 20% by mass or less, or pure copper.

With the pin terminals of the present disclosure, when solder is applied to the tip coating, soldering defects, especially solder icicles, are unlikely to occur. The reason for this is that the Zn content in the base material is low. In such a pin terminal of the present disclosure, in an application in which a large number of pin terminals are arranged close to each other, for example, in an application connected to a circuit board of various control units, adjacent pin terminals are short-circuited by solder icicles. Can be prevented. Therefore, the pin terminals of the present disclosure are suitable for connectors and the like having a large number of pin terminals.

Further, the pin terminal of the present disclosure has excellent solder wettability on one end side of the base material. The reason for this is that the tip covering portion that covers the surface on one end side of the base material over the entire circumference can be used for the bonding region with the solder.

Further, the pin terminal of the present disclosure is excellent in insertability into the mating terminal on the other end side of the base material. One of the reasons for this is as follows. A pin terminal provided with a tip covering portion having different thicknesses of a thin film portion and a thick film portion on one end side of the base material does not have the above-mentioned enlarged portion on the other end side of the base material. With such a pin terminal, the insertion force when connecting the region on the other end side of the base material to the mating terminal is small.

Such a pin terminal of the present disclosure may be manufactured by the following manufacturing method. This manufacturing method uses not the above-mentioned post-plating method but a so-called pre-plating method and a post-plating method in which a plating formation region is partially used in combination, and a specific heat treatment is performed after the post-plating. Hereinafter, this manufacturing method may be referred to as a multi-stage plating manufacturing method. Details of the multi-stage plating method will be described later. The pre-plating method is a method of forming a base material having a predetermined shape by forming a tin-based layer on a plate as a material of the base material and then punching a plate with the tin-based layer. By performing a specific heat treatment after the partial post-plating, the tin-based layer formed by the pre-plating method, particularly the layer composed of pure tin, is prevented from melting. As a result, the occurrence of the enlarged portion is prevented.

In addition, according to the multi-stage plating method, it is possible to reduce the occurrence of whiskers on the surface of the tin-based layer due to a specific heat treatment. Such pin terminals of the present disclosure can prevent short circuits between adjacent pin terminals due to whiskers in applications where a large number of pin terminals are arranged close to each other.

In addition, the pin terminals of the present disclosure are also excellent in manufacturability. One of the reasons for this is that it is not necessary to form a Pd plating layer.

(2) As an example of the pin terminals of the present disclosure,
The tip covering portion includes an outer layer and an inner layer, and has an outer layer and an inner layer.
The constituent material of the outer layer is pure tin.
Examples of the constituent material of the inner layer include a form of an alloy containing tin and copper.

In the above form, the outer layer is excellent in solder wettability, and the inner layer can reduce the generation of whiskers.

(3) As an example of the pin terminal of (2) above,
A point 1 mm from one end of the pin terminal along the longitudinal direction of the pin terminal is set as a measurement point, and the difference between _{the maximum value t 1} and the minimum value t _{2 of the thickness of the tip covering portion measured at the measurement point.} Examples thereof include a form in which (t _{1 −} t _{2) is 0.20 μm or more.}

The above form can be manufactured by a multi-stage plating method. In this case, the number of whiskers in the thin film portion tends to decrease. Further, in this case, since the occurrence of the enlarged portion is prevented as described above, the above-mentioned form is excellent in insertability into the mating terminal. Further, in this case, the thickness of the tin-based layer formed by the pre-plating method generally corresponds to _{the difference (t 1-} t _2). That is, the region on the other end side of the base material includes a tin-based layer having a thickness of 0.20 μm or more in a part of the base material in the circumferential direction. Such a pin terminal of the present disclosure can also reduce the connection resistance with the terminal on the other side.

(4) As an example of the pin terminal of (2) or (3) above,
A point 1 mm from one end of the pin terminal along the longitudinal direction of the pin terminal is set as a measurement point, and the ratio _{of the maximum value t 1} and the minimum value t _{2 of the thickness of the tip coating portion measured at the measurement point.} Examples _{thereof include a form in which t 2} / t ₁ is 0.2 or more and less than 0.8.

The above form can be manufactured by a multi-stage plating method. In this case, the number of whiskers in the thin film portion tends to decrease. Further, in this case, since the occurrence of the enlarged portion is prevented as described above, the above-mentioned form is excellent in insertability into the mating terminal.

(5) As an example of the pin terminal of (3) or (4) above,
The thin film portion is provided in contact with the base material and has the minimum value t ₂ .
Examples of the thick film portion include a form having the _{maximum value t 1.}

The above form is excellent in solder wettability, and it is easier to reduce the occurrence of whiskers in the thick film portion.

(6) As an example of any one of the pin terminals (3) to (5) above,
In the cross section of the base material, in which the portion provided with the tip covering portion is cut in a plane orthogonal to the axis thereof.
The shape of the base material is rectangular and
The outer peripheral surfaces of the base material include a first surface and a second surface arranged to face each other, and a third surface and a fourth surface arranged to face each other.
The portion of the tip covering portion that covers at least one of the first surface and the second surface has the maximum value t ₁ .
A portion of the tip covering portion that covers at least one of the third surface and the fourth surface may have a form having the _{minimum value t 2.}

The above form can be manufactured by the multi-stage plating method, so it is excellent in manufacturability. Typically, the first surface and the second surface are surfaces on which a plating layer is formed by a pre-plating method. The third and fourth surfaces are cut surfaces by punching.

(7) As an example of the pin terminal of (6) above,
The plating layer includes a base layer between a portion of the tip covering portion that covers the first surface and the second surface and the base material.
The portion of the tip covering portion that covers the third surface and the fourth surface is provided in contact with the base material.
Examples of the constituent material of the base layer include a form of pure nickel or a nickel alloy.

Especially in the thick film part, the generation of whiskers is likely to be reduced by the underlying layer.

(8) As an example of the pin terminal of (6) or (7) above,
On the first surface, the second surface, the third surface, and the fourth surface, a point 1 mm, a point 3 mm, and a point 5 mm along the longitudinal direction of the pin terminal from one end of the pin terminal. Is a measurement point for the thickness of the tip covering portion, and the difference between the maximum thickness and the minimum thickness is taken at the three measurement points, and the maximum value of this difference is 1.0 μm or less.

In the above form, it is easy to secure a long area to which the solder is applied in the longitudinal direction of the pin terminal, and it is easy to apply the solder.

(9) As an example of any one of the pin terminals (2) to (8) above,
The thickness of the outer layer in the thin film portion is 0.5 μm or more.
The thickness of the inner layer in the thin film portion may be 0.1 μm or more.

(10) As an example of the pin terminals of the present disclosure,
The number of whiskers existing on the surface of the thin film portion is 15 or less in a square field of view having a side length of 0.35 mm.
The maximum wetting force of the tip covering portion measured by the meniscograph tester may be 0.25 mN or more.

The above form has a high maximum wetting force and is excellent in solder wettability. Further, in the above embodiment, the number of whiskers is small in the thin film portion even when the thin film portion is in contact with the base material. Therefore, in the above-mentioned applications in which a large number of pin terminals are arranged close to each other, it is possible to prevent short circuits between adjacent pin terminals due to whiskers. Such a form is more suitable for a connector or the like having a large number of pin terminals.

(11) As an example of the pin terminals of the present disclosure,
The other end side of the base material is provided with a rear end covering portion and an exposed region at different positions in the circumferential direction of the base material.
The tin-based layer includes the rear end covering portion.
The rear end covering portion covers a part of the circumferential direction on the other end side of the base material.
In the exposed region, a form in which the plating layer is not provided and the base material is exposed can be mentioned.

In the above embodiment, the region on one end side of the base material is a region connected to the circuit board, and the region on the other end side of the base material is a region connected to the terminal on the other side, so that the solder wettability is excellent. It also has excellent insertability into the terminal on the other side. Further, in the above embodiment, the connection resistance with the mating terminal can be reduced by the rear end covering portion.

(12) The connector according to one aspect of the present disclosure is
It is provided with any one of the pin terminals (1) to (11) above.

In the connector of the present disclosure, the region on one end side of the pin terminal and the circuit board can be satisfactorily connected by solder by the tip coating portion. In particular, when solder is applied to the tip coating portion, soldering defects such as solder icicles are unlikely to occur. Therefore, the connector of the present disclosure can prevent short circuits between adjacent pin terminals due to solder icicles even when a large number of pin terminals are arranged close to each other. Further, in the connector of the present disclosure, the region on the other end side of the pin terminal can be easily inserted into the mating terminal. If the multi-stage plating method is used, the number of whiskers on the surface of the tip coating is small.

(13) The wire harness with a connector according to one aspect of the present disclosure is
The connector of (12) above and the wire harness are provided.
The wire harness is connected to the region on the other end side of the pin terminal.

In the wire harness with a connector of the present disclosure, the area on one end side of the pin terminal and the circuit board can be satisfactorily connected by soldering. In particular, when solder is applied to the region on one end side of the pin terminal, soldering defects such as solder icicles are unlikely to occur. Therefore, the wire harness with a connector of the present disclosure can prevent short circuits between adjacent pin terminals due to solder icicles even when a large number of pin terminals are arranged close to each other. Further, the wire harness with a connector of the present disclosure is excellent in insertion workability because it is easy to insert the region on the other end side of the pin terminal into a terminal attached to the end of the wire harness, that is, a terminal on the other side. Further, in the wire harness with a connector of the present disclosure, if the multi-stage plating method is used, the number of whiskers at each pin terminal is small, so that it is possible to prevent the adjacent pin terminals from being short-circuited by the whiskers.

(14) The control unit according to one aspect of the present disclosure is
The connector of the above (12) or the wire harness with the connector of the above (13) and a circuit board are provided.
The circuit board and the region on one end side of the pin terminal are connected by solder.

In the control unit of the present disclosure, the area on one end side of the pin terminal and the circuit board are satisfactorily connected by solder. Therefore, the connection resistance between the pin terminal and the circuit board is low. In particular, when solder is applied to the region on one end side of the pin terminal, soldering defects such as solder icicles are unlikely to occur. Therefore, the control unit of the present disclosure can prevent short circuits between adjacent pin terminals due to solder icicles even when a large number of pin terminals are arranged close to each other. Further, the control unit of the present disclosure is excellent in insertion workability because the region on the other end side of the pin terminal can be easily inserted into a terminal attached to the end of the wire harness, that is, a terminal on the other side. In particular, even when a large number, for example, 200 or more, and 250 or more pin terminals are provided, the insertion force when connecting to the mating terminal is not too large, and the insertion work can be easily performed. Further, even when the control unit of the present disclosure is provided with a large number of pin terminals, if the multi-stage plating method is used, the number of whiskers at each pin terminal is small, so that adjacent pin terminals are prevented from being short-circuited by the whiskers. it can.

(15) As an example of the control unit of the present disclosure,
Examples of the circuit board include a form in which at least one of engine fuel injection and engine ignition is controlled.

The above form may include a large number, for example, 200 or more, and further 250 or more pin terminals. Even in this case, the above-described embodiment can prevent the adjacent pin terminals from being short-circuited by solder icicles. Further, in the above form, the insertion force when connecting to the other end terminal is not too large, and the insertability is excellent. Further, if the multi-stage plating method is used, a short circuit between adjacent pin terminals due to whiskers is unlikely to occur.

[Details of Embodiments of the present disclosure]
Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The same reference numerals in the figures indicate the same names.

[Pin terminal]
(Overview)
Hereinafter, the pin terminals of the embodiment will be described mainly with reference to FIGS. 1 to 3.
The pin terminal 1 of the embodiment is a rod-shaped metal member as shown in FIG. The pin terminal 1 is typically supported by the housing 60 of the connector 6 as shown in FIG. 4 to be described later, and is used as an electrical connection member. The area on one end side of the pin terminal 1 is used as a connection area with the terminal on the other side. The region on the other end side of the pin terminal 1 is used as a connection region with the circuit board 80 as shown in FIG. 6 to be described later.

Specifically, the pin terminal 1 includes a rod-shaped base material 2 and a plating layer 3. The plating layer 3 covers a predetermined region of the base material 2. The plating layer 3 includes a tin-based layer 30 made of a metal containing tin (Sn).

In the pin terminal 1 of the embodiment, the range in which the surface of the base material 2 is covered by the tin-based layer 30 differs between the region on one end side and the region on the other end side of the base material 2. In the region on one end side of the base material 2, as shown in FIG. 2, the tin-based layer 30 covers the entire circumference of the base material 2 in the circumferential direction. In the region on the other end side of the base material 2, as shown in FIG. 3, the tin-based layer 30 covers a part of the base material 2 in the circumferential direction and does not cover the other part. In the region on the other end side of the base material 2, the plating layer 3 is not provided and a part of the base material 2 is exposed. Hereinafter, the region of the base material 2 exposed from the plating layer 3 is referred to as an exposed region 26. In particular, in the pin terminal 1 of the embodiment, the constituent material of the base material 2 is a copper alloy having a Zn content of 20% by mass or less, or pure copper.
Hereinafter, the overall configuration of the base material 2 and the plating layer 3 will be described first. Next, the region on one end side and the region on the other end side of the base material 2 will be described in order.

(Base material)
<composition>
The base material 2 which is the main body of the pin terminal 1 is made of pure copper or a copper alloy.

Pure copper contains 99.9% by mass or more of copper (Cu), and the balance is composed of unavoidable impurities. The base material 2 made of pure copper has high conductivity and tends to have low connection resistance.

Copper alloy is an alloy that contains additive elements, the balance is composed of Cu and unavoidable impurities, and contains the largest amount of Cu. In particular, when the constituent material of the base material 2 is a copper alloy, the content of zinc (Zn) in the copper alloy is 20% by mass or less.

It is considered that Zn in the copper alloy constituting the base material 2 easily promotes the formation of solder icicles. Further, it is considered that the smaller the Zn content in the copper alloy, the less likely it is that solder icicles will be generated. As a result, in an application in which a large number of pin terminals 1 are arranged close to each other, it is easy to prevent short circuits between adjacent pin terminals 1 due to solder icicles. From the viewpoint of preventing short circuits due to solder icicles, the Zn content is preferably 15% by mass or less, more preferably 12% by mass or less, and 10% by mass or less. Copper alloys having a Zn content of 1% by mass or less and further 0.5% by mass or less are preferable because they are less likely to cause solder icicles and are superior to pure copper in terms of mechanical strength and the like. It is considered that pure copper containing substantially no Zn is less likely to cause solder icicles.

In a copper alloy having a Zn content of 20% by mass or less, examples of additive elements other than Zn include tin (Sn), phosphorus (P), iron (Fe) and the like. The total content of the additive elements is, for example, 0.05% by mass or more and 15% by mass or less.

Specific copper alloys include iron-containing copper containing Fe and phosphor bronze containing Sn and P. Examples of copper containing iron include alloy number C1940 specified in JIS. Examples of phosphor bronze include alloy numbers C5911 and C5210.

C1940 contains Fe in an amount of 2.1% by mass or more and 2.6% by mass or less, Zn in an amount of 0.05% by mass or more and 0.20% by mass or less, and P in an amount of 0.015% by mass or more and 0.150% by mass or less.

C5191 and C5210 contain Sn of 5.5% by mass or more and 7.0% by mass or less, 7.0% by mass or more and 9.0% by mass or less, and P of 0.03% by mass or more and 0.35% by mass or less. , Zn content is 0.20% by mass or less.

The specific composition of C1940 is specified in JIS H 3100: 2018. The specific composition of C5911 is specified in JIS H 3110: 2018. The specific composition of C5210 is specified in JIS H 3130: 2018.

<shape>
The outer shape of the base material 2 is typically a rectangular parallelepiped shape. Although not shown, the base material 2 may have a locally overhanging portion at an appropriate position in the longitudinal direction thereof. The overhanging portion is used for positioning with respect to the housing 60 and the like. In addition, the outer shape of the base material 2 may be a polygonal columnar shape such as a hexagonal columnar shape, a columnar shape having a curved outer peripheral surface such as a columnar column or an elliptical columnar shape, or the like.

When the outer shape of the base material 2 is a rectangular parallelepiped, as shown in FIGS. 2 and 3, the cross-sectional shape of the base material 2 cut by a plane orthogonal to the axis of the base material 2 is rectangular. Can be mentioned. Typically, the cross-sectional shape is square. In this case, the outer peripheral surface of the base material 2 includes a first surface 21 and a second surface 22 arranged to face each other and a third surface 23 and a fourth surface 24 arranged to face each other in the above cross section. .. The third surface 23 and the fourth surface 24 are provided so as to be substantially orthogonal to the first surface 21 and the second surface 22. In FIGS. 2 and 3, the first surface 21 and the second surface 22 are the upper surface and the lower surface of the paper surface, and the third surface 23 and the fourth surface 24 are the left surface and the right surface of the paper surface.

<size>
The size of the base material 2, for example, length, width, height and the like can be appropriately selected. The length of the base material 2 is the length along the axis of the base material 2. The width of the base material 2 is a length along a direction orthogonal to the axis of the base material 2, for example, in the cross sections shown in FIGS. 2 and 3, the length of the first surface 21 and the length of the second surface 22. Is. The height of the base material 2 is a length along a direction orthogonal to both the axial direction and the width direction of the base material 2, for example, in the above cross section, the length of the third surface 23 and the length of the fourth surface 24. Is. For example, the width and height of the base material 2 are 0.3 mm or more and 5.0 mm or less, respectively.

(Plating layer)
<Overview>
A predetermined region on the surface of the base material 2 is covered with a plating layer 3 including a tin-based layer 30. One end side of the base material 2 includes a tip covering portion 31. The other end side of the base material 2 is provided with a rear end covering portion 32. The tin-based layer 30 includes a front end covering portion 31 and a rear end covering portion 32.

As shown in FIG. 2, the tip covering portion 31 covers the entire area in the circumferential direction on one end side of the base material 2. The tip covering portion 31 containing tin is excellent in solder wettability. With such a tip covering portion 31, the region on one end side of the base material 2 can be satisfactorily wetted with the solder over the entire circumference of the base material 2 in the circumferential direction.

As shown in FIG. 3, the rear end covering portion 32 covers a part of the circumferential direction on the other end side of the base material 2. The rear end covering portion 32 containing tin is soft and easily deformed. With such a rear end covering portion 32, the region on the other end side of the base material 2 can reduce the connection resistance with the mating terminal.

<composition>
As shown in FIGS. 2 and 3, the tin-based layer 30 includes an outer layer 302 and an inner layer 301. The constituent material of the outer layer 302 is pure tin. The constituent material of the inner layer 301 is an alloy containing tin and copper. The outer layer 302 is provided on the outer periphery of the inner layer 301 in contact with the inner layer 301.

Pure tin contains 99% by mass or more of Sn, and the balance is composed of unavoidable impurities. Further, pure tin may contain Sn in an amount of 99.8% by mass or more. The alloy containing tin and copper is typically a binary alloy of Sn and Cu, and the balance may be composed of unavoidable impurities. The alloy may contain an element such as Zn in addition to Sn and Cu.

The outer layer 302 made of pure tin has excellent solder wettability. Therefore, when the tip covering portion 31 includes the outer layer 302, the region on one end side of the base material 2 can be satisfactorily wetted with the solder. When the rear end covering portion 32 includes the outer layer 302, the connection resistance with the mating terminal can be reduced.

The inner layer 301 made of the above alloy reduces the generation of whiskers on the surface of the tin-based layer 30. Therefore, when the front end covering portion 31 and the rear end covering portion 32 are provided with the inner layer 301, it is possible to prevent the adjacent pin terminals 1 from being short-circuited by the whisker in an application in which a large number of pin terminals 1 are arranged close to each other. be able to.

The tin-based layer 30 including the inner layer 301 which is an alloy layer and the outer layer 302 which is a pure tin layer can be typically manufactured by forming a pure tin layer by various plating methods and then performing a heat treatment. Can be mentioned.

The plating layer 3 may include a layer other than the tin-based layer 30. For example, the plating layer 3 may include a base layer 300 between the tin-based layer 30 and the base material 2. Examples of the constituent material of the base layer 300 include pure nickel and nickel alloy. The base layer 300 made of pure nickel or a nickel alloy reduces the generation of whiskers on the surface of the tin-based layer 30. The pin terminal 1 including the base layer 300 and the tin-based layer 30 including the inner layer 301 can more effectively prevent the short circuit caused by the whiskers described above. In addition, the base layer 300 increases the rigidity of the plating layer 3 and contributes to the improvement of wear resistance.

Pure nickel contains 99% by mass or more of nickel (Ni), and the balance is composed of unavoidable impurities. Further, pure nickel may contain 99.9% by mass or more of Ni. The nickel alloy is an alloy containing an additive element, the balance of which is Ni and unavoidable impurities, and which contains the largest amount of Ni. Examples of the additive element include Sn, Zn, Cu and the like.

(Area on one end side)
The region on one end side of the base material 2 is covered with the tip covering portion 31 which is a tin-based layer 30, and the base material 2 is not exposed. The tip covering portion 31 is not a uniform thickness in the circumferential direction of the base material 2 but is partially different at a predetermined point along the longitudinal direction of the pin terminal 1, for example, 1 mm from one end of the pin terminal 1. Has a thickness. That is, the tip covering portion 31 includes the thin film portion 34 and the thick film portion 35 at different positions in the circumferential direction of the base material 2. The existence of the thin film portion 34 and the thick film portion 35 at the predetermined point can be typically confirmed by observing a cross section cut in a plane orthogonal to the axis of the pin terminal 1 at the predetermined point. The thin film portion 34 is a region where the thickness of the tip covering portion 31 is relatively thin. The thick film portion 35 is a region where the thickness of the tip covering portion 31 is relatively thick.

<thickness>
Hereinafter, the thickness of the tip covering portion 31 which is the tin-based layer 30 will be described in detail.
The pin terminal 1 satisfies at least one of the following conditions (1) and (2) with respect _{to the maximum value t 1} and the minimum value t ₂ of the thickness of the tip covering portion 31 measured at the following measurement points, for example. Can be mentioned.
(1) The difference (t _{1 −} t ₂ _{) between the maximum value t 1} and the minimum value t ₂ is 0.20 μm or more.
(2) The ratio t ₂ / t _{1 of the} _{maximum value t 1} and the minimum value t ₂ is 0.2 or more and less than 0.8.
The measurement point is a point 1 mm along the longitudinal direction of the pin terminal 1 from one end of the pin terminal 1 in the area where the tip covering portion 31 is provided in the pin terminal 1. Maximum value _{t 1,} the minimum value _{t 2,} the details of the measurement method of the thickness _{_{_{t 31, t 32, t i}}} , t o , which will be described later, it will be described in Test Examples below. When the tip covering portion 31 includes the inner layer 301 and the outer layer 302, the thickness of the tip covering portion 31 is the total thickness of the thickness of the inner layer 301 and the thickness of the outer layer 302.

Typically, as shown in FIG. 2, the thin film portion 34 has a minimum value t ₂ . The thick film portion 35 has a maximum value t ₁ . Further, the thin film portion 34 is typically provided in contact with the base material 2.

The pin terminal 1 that satisfies at least one of the conditions (1) and (2) is excellent in solder wettability due to the tip coating portion 31 on one end side of the base material 2, and is connected to the mating terminal on the other end side of the base material 2. Excellent insertability. One of the reasons for the excellent insertability is that the rear end covering portion 32 does not have a locally thick enlarged portion on the other end side of the base material 2, preferably a uniform thickness in the longitudinal direction of the base material 2. Because it has. Here, if a multi-stage plating method in which multi-stage plating and a specific heat treatment are performed is used, a tin-based layer 30 having a non-uniform thickness in the circumferential direction of the base material 2 is provided on one end side of the base material 2, as described above. A pin terminal 1 having a tin-based layer 30 having no enlarged portion on the other end side of the base material 2 can be obtained. That is, the pin terminal 1 satisfying at least one of the conditions (1) and (2) can be obtained. Therefore, the pin terminal 1 having the tip covering portion 31 satisfying a specific thickness condition on one end side of the base material 2 is provided with the rear end covering portion 32 having no enlarged portion on the other end side of the base material 2. I can say.

The difference (t _{1 −} t ₂ ) may be, for example, 0.30 μm or more, 0.50 μm or more, and 0.80 μm or more. When the difference (t _{1 −} t ₂ ) is 1.0 μm or more, the pin terminal 1 can easily maintain good solder wettability.

There is no particular upper limit for the difference (t _1- t _2). However, the larger the difference (t _1- t ₂ ), the longer the plating time by the pre-plating method, and the lower the manufacturability. From the viewpoint of good manufacturability, the difference (t _1- t ₂ ) is, for example, 5.0 μm or less, 4.5 μm or less, 4.0 μm or less. When the difference (t _{1 −} t ₂ ) is 0.20 μm or more and 5.0 μm or less, and further 1.0 μm or more and 4.0 μm or less, the pin terminal 1 is excellent in solder wettability, insertability, and manufacturability. Further, the connection resistance between the pin terminal 1 and the other terminal tends to be low.

It can be said that the larger the ratio t ₂ / t ₁ is in the above range, the thicker the thin film portion 34 is. Therefore, the region on one end side of the base material 2 can be more reliably wetted with the solder by the tip covering portion 31. The smaller the ratio t ₂ / t ₁ is in the above range, the easier it is to properly secure the plating thickness by the pre-plating method. From these points, the ratio t ₂ / t ₁ may be, for example, 0.25 or more, 0.30 or more, 0.35 or more, 0.40 or more. Further, the ratio t ₂ / t ₁ may be, for example, 0.75 or less, 0.70 or less, and 0.60 or less. When the ratio t ₂ / t ₁ is 0.25 or more and 0.75 or less, and further 0.40 or more and 0.60 or less, the pin terminal 1 is excellent in solder wettability, insertability, and manufacturability.

The pin terminal 1 that satisfies both the conditions (1) and (2) is more excellent in solder wettability due to the tip coating portion 31 on one end side of the base material 2, and is inserted into the mating terminal on the other end side of the base material 2. Better in sex.

Although it depends on the size of the base material 2, _{the absolute value of the maximum value t 1} is, for example, 1.0 μm or more and 7.0 μm or less. The absolute value of the minimum value t ₂ is, for example, 0.8 μm or more and 4.0 μm or less. However, t ₂ <t ₁ .

As specific positions of the maximum value t ₁ and the minimum value t ₂ , when the cross-sectional shape of the base material 2 is the above-mentioned rectangular shape, a portion of the tip covering portion 31 that covers at least one of the first surface 21 and the second surface 22. Has a maximum value of t ₁ . Further, it can be mentioned that the portion of the tip covering portion 31 that covers at least one of the third surface 23 and the fourth surface 24 has a minimum value t _2.

As a more specific form, as shown in FIG. 2, the first surface 21 and the second surface 22 are each provided with a thick film portion 35, and the third surface 23 and the fourth surface 24 are provided with a thin film portion 34, respectively. Can be mentioned. At least one thick film portion 35 has a maximum value t ₁ . At least one thin film portion 34 has a minimum value t ₂ . The tip covering portion 31 having such a thin film portion 34 and a thick film portion 35 can be obtained by using, for example, a multi-stage plating method. A tin-based layer by the pre-plating method and a tin-based layer by the post-plating method are formed on the first surface 21 and the second surface 22. That is, a thick tin-based layer is formed. This thick tin-based layer finally forms the thick film portion 35. A tin-based layer by a post-plating method is formed in contact with each surface on the third surface 23 and the fourth surface 24, which are cut surfaces by punching. The third surface 23 and the fourth surface 24 do not have a tin-based layer formed by the pre-plating method. That is, on the third surface 23 and the fourth surface 24, a thin tin-based layer formed by the post-plating method is formed in contact with each surface. This thin tin-based layer finally forms the thin film portion 34.

As shown in FIG. 2, the thickness of the thick film portion 35 provided on the first surface 21 and the second surface 22, and the thickness of the thin film portion 34 provided on the third surface 23 and the fourth surface 24 are respectively. It can be mentioned that the thickness is uniform along the surface. The uniform thickness along each surface means that the difference between the following maximum thickness and minimum thickness is less than 0.20 μm. A plurality of measurement points are taken with respect to the tip covering portion 31 on each surface from one end of the pin terminal 1 along the longitudinal direction of the pin terminal 1, for example, at a point of 1 mm. The difference between the maximum thickness and the minimum thickness of the thickness of the tip covering portion 31 measured at the measurement points on each surface is taken. When the above difference is 0.15 μm or less and 0.10 μm or less, it can be said that the thick film portion 35 and the thin film portion 34 have a more uniform thickness at the above points. If the thick film portion 35 and the thin film portion 34 have uniform thicknesses, the thickness of the solder tends to be uniform.

It can be mentioned that the thickness of the thick film portion 35 on the first surface 21 and the thickness of the thick film portion 35 on the second surface 22 are substantially equal. Further, it can be mentioned that the thickness of the thin film portion 34 on the third surface 23 and the thickness of the thin film portion 34 on the fourth surface 24 are substantially equal to each other. In the cross section shown in FIG. 2, this form can be said to have a symmetrical shape centered on the bisector in the width direction and the bisector in the height direction of the pin terminal 1. The symmetrically shaped pin terminal 1 is easy to adjust molding conditions and plating conditions, and is excellent in manufacturability.

Regarding the thickness of the tin-based layer 30 provided on the first surface 21 to the fourth surface 24, the difference in thickness in the longitudinal direction of the pin terminal 1 is small. In this form, it is easy to secure a long region in the tip covering portion 31 to which the solder is applied in the longitudinal direction of the pin terminal 1. Therefore, the pin terminal 1 can easily apply solder to the region on one end side of the base material 2.

Quantitatively, on the first surface 21, the second surface 22, the third surface 23, and the fourth surface 24, a point 1 mm and a point 3 mm along the longitudinal direction of the pin terminal 1 from one end of the pin terminal 1. And 5 mm are used as measurement points for the thickness of the tip covering portion 31. Take the difference between the maximum thickness and the minimum thickness at the three measurement points on each surface. Of the four differences obtained for the four surfaces, the maximum value is 1.0 μm or less.

The maximum value of the above difference may be 0.95 μm or less, further 0.90 μm or less, 0.85 μm or less, and 0.80 μm or less.

When the tip covering portion 31 includes the inner layer 301 and the outer layer 302, the thickness t ₃₁ of the inner layer 301 in the thin film portion 34 may be 0.1 μm or more. _{Further, the thickness t 32} of the outer layer 302 in the thin film portion 34 is 0.5 μm or more.

_{If the thickness t 31} of the inner layer 301 is 0.1 μm or more, whiskers are unlikely to be generated on the surface of the thin film portion 34 by the inner layer 301 even if the thin film portion 34 is provided in contact with the base material 2. If the number of whiskers is small, preferably if there are virtually no whiskers, it is possible to prevent the adjacent pin terminals 1 from being short-circuited by the whiskers. The thickness t ₃₁ may be, for example, 0.11 μm or more and 0.15 μm or more. Further, when the thickness t ₃₁ is 0.2 μm or more, the occurrence of whiskers is further reduced.

_{When the thickness t 32} of the outer layer 302 is 0.5 μm or more, the portion of the base material 2 provided with the thin film portion 34, that is, the third surface 23 and the fourth surface 24 in FIG. 2 are well wetted with the solder by the outer layer 302. Can be done. The thickness t ₃₂ may be, for example, 0.6 μm or more and 0.8 μm or more. Further, when the thickness t ₃₂ is 1.0 μm or more, the portion of the base material 2 provided with the thin film portion 34 can be better wetted with the solder.

The upper limit of the thickness t ₃₁ of the inner layer 301 and the upper limit of the thickness t ₃₂ of the outer layer 302 are not particularly set. However, as the thicknesses t ₃₁ and t ₃₂ are larger, the plating time becomes longer and the manufacturability tends to decrease. From the viewpoint of good manufacturability, the thickness t ₃₁ of the inner layer 301 is, for example, 1.0 μm or less and 0.8 μm or less. The thickness t ₃₂ of the outer layer 302 is, for example, 3.9 μm or less and 3.5 μm or less. _{When the thickness t 31} of the inner layer 301 is, for example, 0.1 μm or more and 1.0 μm or less, and further 0.15 μm or more and 0.8 μm or less, the pin terminal 1 can reduce the occurrence of whiskers and is excellent in manufacturability. _{When the thickness t 32} of the outer layer 302 is, for example, 0.5 μm or more and 3.9 μm or less, and further 1.0 μm or more and 3.5 μm or less, the pin terminal 1 is excellent in solder wettability and also excellent in manufacturability.

The thickness of the outer layer 302 in the thick film portion 35 _{is thicker than the thickness t 32} of the outer layer 302 in the thin film portion 34, for example, 1.0 μm or more, 1.5 μm or more, 2.0 μm or more. The thickness of the inner layer 301 in the thick film portion 35 _{is thicker than the thickness t 31} of the inner layer 301 in the thin film portion 34, for example, 0.20 μm or more, further 0.25 μm or more, 0.30 μm or more.

When the base layer 300 is provided, the thickness of the base layer 300 is, for example, 0.3 μm or more and 4.0 μm or less, and further 0.5 μm or more and 2.0 μm or less.

<Construction>
The tip covering portion 31 may be provided in contact with the base material 2 over the entire circumference of the base material 2 in the circumferential direction. In this case, it is preferable that both the thin film portion 34 and the thick film portion 35 include an inner layer 301 and an outer layer 302. The reason for this is that the outer layer 302 is excellent in solder wettability, while the inner layer 301 can reduce the generation of whiskers on an arbitrary surface of the tip covering portion 31. _{The thickness t 31} of the inner layer 301 of the thin film portion 34 is more preferably 0.1 μm or more. The reason for this is that the generation of whiskers can be reduced in the thin film portion 34 as described above, and the thickness of the inner layer 301 of the thick film portion 35 _{is thicker than the thickness t 31} , so that the generation of whiskers can be further reduced. Is.

The tip covering portion 31 may be provided so as to be in contact with the base material 2 at a part in the circumferential direction of the base material 2 and not to be in contact with the base material 2 at another portion. An underlayer 300 may be provided at a portion of the tip covering portion 31 that does not come into contact with the base material 2. As an example, the thin film portion 34 is provided in contact with the base material 2, and the thick film portion 35 is provided in contact with the base layer 300 without contacting the base material 2. _{As described above, if the thickness t 31} of the inner layer 301 of the thin film portion 34 is 0.1 μm or more, the thin film portion 34 can reduce the generation of whiskers. In the thick film portion 35, the generation of whiskers can be further reduced by the base layer 300 in addition to the relatively thick inner layer 301. This form can be produced by forming a base layer 300 made of pure nickel or a nickel alloy in the pre-plating method and then forming a tin-based layer when the multi-stage plating method is used.

As a more specific form, when the cross-sectional shape of the base material 2 is the above-mentioned rectangular shape, the plating layer 3 is located between the portion of the tip covering portion 31 that covers the first surface 21 and the second surface 22 and the base material 2. It is mentioned that the base layer 300 is provided and the above-mentioned portion is the thick film portion 35. Further, the portion of the tip covering portion 31 that covers the third surface 23 and the fourth surface 24 is provided in contact with the base material 2, and the above-mentioned portion is the thin film portion 34. That is, the first surface 21 and the second surface 22 are provided with the base layer 300 and the thick film portion 35 in this order. The third surface 23 and the fourth surface 24 include a thin film portion 34 and do not include a base layer 300.

The tip covering portion 31 may be provided so as not to come into contact with the base material 2 over the entire circumference in the circumferential direction of the base material 2. That is, the base layer 300 is provided over the entire circumference of the base material 2 in the circumferential direction, and the tip covering portion 31 is provided on the base layer 300. In this case, the base layer 300 reduces the generation of whiskers on any surface of the tip covering portion 31. However, when this form is manufactured by using the multi-stage plating method, masking is required and the manufacturability is lowered. Specifically, after forming the base layer 300 and the tin-based layer by the pre-plating method, punching is performed. Next, a part of the base material 2 in the circumferential direction is masked, and then the base layer 300 is formed. After that, the masking is removed to form the tin-based layer 30 so as to cover the entire circumference of the base material 2. From the viewpoint of good manufacturability, it is preferable that the base layer 300 is provided in a part of the base material 2 in the circumferential direction.

<Whisker>
It is desirable that the tip covering portion 31 has a small number of whiskers. The whiskers here are protrusions made of tin, and are relatively long protrusions specified in JIS C 60068-2-82: 2009, for example, needle-shaped protrusions having a length of 10 μm or more.

In particular, when the thin film portion 34, which is a relatively thin portion of the tip covering portion 31, is in contact with the base material 2 containing copper, whiskers are more likely to occur in the thin film portion 34 than in the thick film portion 35. _{This is because the thickness t 31} of the inner layer 301 provided in the thin film portion 34 as described above tends to be thinner than the thickness of the inner layer 301 provided in the thick film portion 35. Quantitatively, the number of whiskers present in the thin film portion 34 is 15 or less in the following field of view. The field of view is a square region having a side length of 0.35 mm. The method for measuring the number of whiskers will be described in a test example described later.

If the number of whiskers is 15 or less in the region of 0.35 mm × 0.35 mm, the number of whiskers in the thin film portion 34 is small. Therefore, in an application in which a large number of pin terminals 1 are arranged close to each other, it is possible to prevent short circuits between adjacent pin terminals 1 due to whiskers. The smaller the number of whiskers, the more reliable the above-mentioned short circuit can be prevented. From the viewpoint of preventing the short circuit, the number of whiskers is preferably 10 or less, 5 or less, 3 or less, and more preferably 0, that is, no whiskers are present in the region. As the protrusion made of tin, there is a spherical protrusion called a nodule, that is, a relatively short protrusion. Although nodules are present, the short circuit is unlikely to occur if the whiskers, which are the relatively long protrusions described above, are few, preferably not present.

The pin terminals 1 having 15 or less whiskers in the above region typically have an inner layer 301 provided in the thin film portion 34 having a thickness t ₃₁ of 0.1 μm or more. Further, such a pin terminal 1 can be manufactured by, for example, a multi-stage plating method.

<Wet power>
The tip covering portion 31 is excellent in solder wettability. Quantitatively, the maximum wetting force of the tip covering portion 31 measured by the Meniscograph tester is 0.25 mN or more. The method for measuring the maximum wetting force will be described in a test example described later.

When the maximum wetting force is 0.25 mN or more, the region on one end side of the base material 2 can be well wetted with the solder by the tip coating portion 31, and the solder wettability is excellent. The larger the maximum wetting force, the better the solder wetting property. From the viewpoint of good solder wettability, the maximum wetting force is preferably 0.26 mN or more, more preferably 0.28 mN or more, and more preferably 0.30 mN or more.

There is no particular upper limit on the maximum wetting force.

The pin terminal 1 having a maximum wetting force of 0.25 mN or more typically includes an outer layer 302 over the entire circumference of the base material 2 in the circumferential direction in a region on one end side of the base material 2, and is provided in the thin film portion 34. _{It can be mentioned that the thickness t 32} of the outer layer 302 is 0.5 μm or more. Such a pin terminal 1 can be manufactured by, for example, a multi-stage plating method.

(Area on the other end side)
The other end side of the base material 2 includes a rear end covering portion 32 and an exposed region 26. The rear end covering portion 32 and the exposed region 26 are provided at different positions in the circumferential direction of the base material 2. In the exposed region 26, the plating layer 3 is not provided and the base material 2 is exposed.

The rear end covering portion 32 is continuous with the front end covering portion 31 and constitutes an integral tin-based layer 30. _{However, the thickness t 35} of the rear end covering portion 32 and the thickness of the thick film portion 35 of the front end covering portion 31, typically the maximum value t ₁ , are often different. Depending on this difference in thickness, the tin-based layer 30 has a step in the longitudinal direction of the base material 2.

As a specific position of the rear end covering portion 32 and the exposed region 26, when the cross-sectional shape of the base material 2 is the above-mentioned rectangular shape, the rear end covering is performed on the first surface 21 and the second surface 22 as shown in FIG. It has a portion 32, and the third surface 23 and the fourth surface 24 are exposed regions 26. In this form, the thick film portion 35 of the tip covering portion 31 is provided in the region on one end side of the base material 2 on the first surface 21 and the second surface 22, and the rear end covering portion 32 is provided in the region on the other end side of the base material 2. To be equipped. Further, in this form, the thin film portion 34 is provided in the region on one end side of the third surface 23 and the fourth surface 24, and the base material 2 is exposed in the region on the other end side of the base material 2.

The thickness of the rear end covering portion 32 provided on the first surface 21 and the second surface 22, respectively, is a uniform thickness in the longitudinal direction of the base material 2. The uniform thickness in the longitudinal direction means that the maximum value of the difference between the following maximum thickness and minimum thickness is less than 0.2 μm. In the area where the rear end covering portion 32 is provided in the pin terminal 1, a point 1 mm, a point 3 mm, and a point 5 mm are rearward along the longitudinal direction of the pin terminal 1 from the other end of the pin terminal 1. It is used as a measurement point for the thickness of the end covering portion 32. Take the difference between the maximum thickness and the minimum thickness at the three measurement points on each surface. Take the maximum value out of the two differences obtained for the two sides. When this maximum value is 0.15 μm or less and further 0.1 μm or less, it can be said that the rear end covering portion 32 has a more uniform thickness. If the rear end covering portion 32 has a uniform thickness in the longitudinal direction, the pin terminal 1 does not have the above-mentioned enlarged portion, and the region on the other end side of the base material 2 is inserted into the mating terminal. Easy to do.

As shown in FIG. 3, the thickness of the rear end covering portion 32 provided on the first surface 21 and the second surface 22, respectively, is a uniform thickness along each surface. The uniform thickness along each surface means that the following difference between the maximum thickness and the minimum thickness satisfies less than 0.20 μm. A plurality of measurement points are taken from the other end of the pin terminal 1 along the longitudinal direction of the pin terminal 1 with respect to the rear end covering portion 32 on each surface, for example, at a point of 1 mm. The difference between the maximum thickness and the minimum thickness of the thickness of the rear end covering portion 32 measured at the measurement points on each surface is taken. When the above difference is 0.15 μm or less and 0.10 μm or less, it can be said that the rear end covering portion 32 has a more uniform thickness at the above points. If the rear end covering portion 32 has a uniform thickness, it is easy to appropriately secure a contact area with the mating terminal, and the connection resistance tends to be low.

It can be mentioned that the thickness of the rear end covering portion 32 on the first surface 21 and the thickness of the rear end covering portion 32 on the second surface 22 are substantially equal. In the cross section shown in FIG. 3, this form can be said to have a symmetrical shape centered on the bisector in the width direction and the bisector in the height direction of the pin terminal 1. The symmetrically shaped pin terminal 1 is easy to adjust molding conditions and plating conditions, and is excellent in manufacturability.

When the multi-stage plating method is used, the rear end covering portion 32 is manufactured by a tin-based layer formed by the pre-plating method. The thickness of this tin-based layer corresponds to the _{difference (t 1 −} t ₂ ) in the tip covering portion 31 as described above. _{When the thickness t 35} of the rear end covering portion 32 is the difference (t _{1 −} t ₂ ) or more, it is easy to appropriately secure the contact area with the mating terminal, and the connection resistance with the mating terminal is likely to be low.

As a specific thickness of the rear end covering portion 32, the thickness of the thick film portion 35 of the front end covering portion 31, typically _{thinner than the maximum value t 1} , can be mentioned. Further, if the rear cover portion 32 comprises an inner layer 301 and outer layer 302, the thickness _{t i} of the inner layer 301 of the rear cover portion 32 thicker than the thickness _{t 31} of the inner layer 301 of the thin film portion 34, a thick film It is mentioned that it is thinner than the thickness of the inner layer 301 of the portion 35. In this case, the thickness _{t o} of the outer layer 302 of the rear cover portion 32 is thicker than the thickness _{t 32} of the outer layer 302 of the thin film portion 34, thinner include than the thickness of the outer layer 302 of the thick portion 35 Be done. Such a pin terminal 1 can be manufactured by, for example, a multi-stage plating method.

[connector]
Hereinafter, the connector 6 of the embodiment will be described mainly with reference to FIG.
The connector 6 of the embodiment includes the pin terminal 1 of the embodiment. Typically, the connector 6 includes a plurality of pin terminals 1 and a housing 60. Each pin terminal 1 is held in the housing 60 in a state of being bent in an L shape.

The housing 60 is a molded body made of an electrically insulating material such as resin. The housing 60 has a bottom portion and a peripheral wall portion. A plurality of through holes (not shown) are provided on the bottom in an aligned state. By press-fitting each pin terminal 1 into each through hole, the bottom portion holds the pin terminal 1. The pin terminals 1 held at the bottom are arranged at predetermined intervals in the vertical direction of the paper surface and the vertical direction of the paper surface of FIG. 4, respectively. The peripheral wall portion is erected from the peripheral edge of the bottom portion and is continuous in an annular shape. A mating connector having a mating terminal, for example, a connector 76 shown in FIG. 5, which will be described later, is inserted into the internal space surrounded by the bottom portion and the peripheral wall portion. Note that FIG. 4 and FIG. 6 described later are shown by cutting out a part of the housing 60.

In each pin terminal 1, the area on one end side including the tip covering portion 31 is exposed to the outside of the housing 60. In each pin terminal 1, the other end region including the rear end covering portion 32 is arranged in the internal space of the housing 60. Each pin terminal 1 is attached to the housing 60 so that the portion of the base material 2 where the rear end covering portion 32 is provided, for example, the first surface 21 and the second surface 22 are arranged on the upper side and the lower side of the paper surface of FIG. Be retained. When the connector 76 is inserted, the rear end covering portion 32 is electrically connected by contacting the mating terminal which is a female terminal.

The number of pin terminals 1 in the connector 6, the arrangement position of the pin terminals 1 with respect to the bottom of the housing 60, the shape of the housing 60, the constituent materials of the housing 60, and the like can be appropriately selected.

[Wire harness with connector]
Hereinafter, the wire harness 7 with a connector of the embodiment will be described mainly with reference to FIG.
The wire harness 7 with a connector of the embodiment includes the connector 6 of the embodiment and the wire harness 70. A wire harness 70 is connected to the region on the other end side of the pin terminal 1 where the rear end covering portion 32 is provided. The region of the pin terminal 1 on the one end side where the tip covering portion 31 is provided is connected to the circuit board 80. One end of the wire harness 70 is electrically connected to the circuit board 80 by the connector 6. The other end of the wire harness 70 is electrically connected to an electronic device (not shown) controlled by the circuit board 80.

The wire harness 70 includes one or more electric wires 71 and

connectors

74 and 75 attached to each end of the electric wires 71. The electric wire 71 includes a conductor and an electrically insulating layer. The conductor is typically composed of a conductive material such as copper, aluminum, or an alloy thereof. The electrically insulating layer is made of an electrically insulating material such as resin and covers the outer periphery of the conductor. Appropriate male and female connectors can be used for the

connectors

74 and 75.

The wire harness 7 with a connector may include another connector 76 between the connector 75 of the wire harness 70 and the connector 6 of the embodiment as illustrated in FIG. For example, the connector 75 is a male connector and the connector 76 is a female connector.

[control unit]
Hereinafter, the control unit 8 of the embodiment will be described mainly with reference to FIG.
The control unit 8 of the embodiment includes the connector 6 of the embodiment, the wire harness 7 with the connector of the embodiment, and the circuit board 80. The region on one end side of the pin terminal 1 provided with the tip covering portion 31 and the circuit board 80 are connected by solder 85. The control unit 8 shown in FIG. 6 includes the connector 6 of the embodiment. The control unit 8 including the wire harness 7 with a connector of the embodiment may refer to the alternate long and short dash line of FIG.

The circuit board 80 includes a plurality of through holes 81. A region on one end side of each pin terminal 1 is inserted into each through hole 81. The region on one end side of the pin terminal 1 and the through hole 81 are conducted by the solder 85. Note that FIG. 6 shows a part of the circuit board 80 cut out. Further, FIG. 6 shows only a cross section of one through hole 81 as a representative.

The circuit board 80 controls the electronic device connected to the connector 74 side of the wire harness 70 by the wire harness 70 connected to the region on the other end side of the pin terminal 1. The circuit board 80 is housed in a case (not shown).

The circuit board 80 may, for example, control at least one of engine fuel injection and engine ignition. The control unit 8 provided with such a circuit board 80 is called an engine control unit. The engine control unit may include a large number, for example 200 or more, and 250 or more pin terminals 1. A control unit 8 other than the engine control unit may also have a large number of pin terminals 1.

(Main effect)
The pin terminal 1 of the embodiment can prevent soldering defects. Further, the pin terminal 1 is excellent in solder wettability and also excellent in insertability into the mating terminal. Such a pin terminal 1 can be manufactured with high productivity if it is manufactured by a multi-stage plating method. Further, the pin terminal 1 typically has a small number of whiskers on the tip covering portion 31. The pin terminal 1 of such an embodiment has the following effects (a) to (c), particularly in an application including a large number of pin terminals 1 described above.
(A) It is possible to prevent short circuits between adjacent pin terminals 1 due to solder icicles.
(B) It is suppressed that the insertion force when connecting to the other end terminal becomes too large.
(C) It is prevented that the adjacent pin terminals 1 are short-circuited by the whisker.

Since the connector 6 of the embodiment, the wire harness 7 with the connector of the embodiment, and the control unit 8 of the embodiment include the pin terminal 1 of the embodiment, it is possible to prevent soldering defects. Further, the connector 6, the wire harness 7 with a connector, and the control unit 8 are excellent in solder wettability and also excellent in insertability into the terminal on the other side. Further, the connector 6, the wire harness 7 with a connector, and the control unit 8 typically have a small number of whiskers on the tip covering portion 31. The connector 6 of the embodiment, the wire harness 7 with the connector of the embodiment, and the control unit 8 of the embodiment are described above when the number of the connectors 6 is large, for example, 200 or more, and 250 or more pin terminals 1. The effects of (a) to (c) are exhibited.

(Manufacturing method of pin terminals)
Hereinafter, an example of a method for manufacturing a pin terminal will be described with reference to FIG. 7 as appropriate.
The pin terminal 1 of the embodiment may be manufactured as follows, for example. First, a plated base material is molded by a so-called pre-plating method. A tin-based layer is formed by plating only in the region on one end side of the obtained plated base material. A tin-based layer is not formed in the region on the other end side of the base material. After this plating, heat treatment is performed under specific conditions.

The above manufacturing method, that is, the multi-stage plating manufacturing method is based on the following findings.
In the pre-plating method, the thickness of the tin-based layer tends to be uniform. However, in the molded product obtained by the pre-plating method, a cut surface is generated by punching. The cut surface is a surface on which the base material is exposed and does not have a tin-based layer. Due to the exposed portion of the base material, the molded product is inferior in solder wettability.

If the tin plating layer is further formed so as to cover only the region on one end side of the base material including the cut surface of the molded body, the solder wettability is improved. However, whiskers are likely to occur on the surface of the tin-plated layer provided directly above the base material.

For example, if a reflow treatment is performed after the second plating applied to the molded product, the generation of whiskers can be reduced. However, the reflow treatment melts the tin-based layer by the pre-plating method existing on the other end side of the base material, particularly the pure tin layer.

Here, conventionally, in the reflow treatment after tin plating, a temperature exceeding the melting point of tin, for example, about 300 ° C. to 400 ° C. is used as described in Patent Document 1. Due to the melting of the pure tin layer described above, on the other end side of the base material, a thick portion, that is, an enlarged portion is locally generated in the tin-based layer, and the insertability into the mating terminal is lowered.

On the other hand, if heat treatment is performed under specific conditions after the second plating, the number of whiskers is effectively reduced at each end of the base material while preventing the above-mentioned melting and reducing the occurrence of enlarged portions. To.

The multi-stage plating method may include, for example, the following steps.
<Molding Step> The plated plate 91 is punched into a predetermined shape to produce a molding material 92 in which a plurality of rod-shaped portions 920 are arranged in parallel. The plated plate 91 includes a tin-based layer made of a metal containing tin.
<Secondary Plating Step> A secondary plating layer 931 is formed in a region on one end side of each rod-shaped portion 920. The secondary plating layer 931 includes a pure tin layer composed of pure tin.
<Heat treatment step> The partial plating material 93 including the secondary plating layer 931 is heat-treated.
The heat treatment temperature is below the melting point of tin. The melting point of tin is about 232 ° C.

Hereinafter, the multi-stage plating manufacturing method will be described for each process.
<Molding process>
The molding step is a step of manufacturing the molding material 92 by a so-called pre-plating method.

《Plated plate》
The plated plate 91 used in the molding process includes a material plate 90 and a primary plating layer (not shown). FIG. 7 shows a long plate material wound into a coil as the material plate 90 and the plated plate 91.

The constituent material of the material plate 90 is pure copper or a copper alloy. For details of pure copper and copper alloy, refer to the above-mentioned (base material) <composition> section.

The primary plating layer is provided on the front and back surfaces of the material plate 90. The primary plating layer may be only a tin-based layer or may include a plating layer other than the tin-based layer. The tin-based layer may include only a pure tin layer, or may include a pure tin layer and an alloy layer. The alloy layer is composed of an alloy containing tin and copper. A part of the pure tin layer can be transformed into an alloy layer by the heat treatment described later. Examples of the plating layer other than the tin-based layer include a base layer 300 provided between the tin-based layer and the material plate 90. For details of the base layer 300, refer to the above-mentioned (plating layer) <composition> section.

The thickness of the tin-based layer in the primary plating layer roughly corresponds to the _{above-mentioned difference (t 1-} t _2). Therefore, the thickness of the tin-based layer in the primary plating layer is adjusted so that the difference (t _{1 to} t _{2) is within a predetermined range.} The thickness of the tin-based layer in the primary plating layer is, for example, 0.20 μm or more and 5.0 μm or less.

When the primary plating layer includes the base layer 300, the primary plating conditions are adjusted so that the thickness of the base layer 300 is, for example, within the above-mentioned predetermined range.

The plated plate 91 may be manufactured by a known manufacturing method. The primary plating layer may be formed by various plating methods, typically an electroplating method.

<< Molding material >>
The molding material 92 includes a plurality of rod-shaped portions 920 and a connecting portion 925.
The plurality of rod-shaped portions 920 are arranged in parallel at predetermined intervals so that the axes of the rod-shaped portions 920 are parallel to each other. At the portion of each rod-shaped portion 920 facing the adjacent rod-shaped portions 920, the material plate 90 is exposed except for the portion where the connecting portion 925 is formed. The front and back surfaces of each rod-shaped portion 920 are provided with a primary plating layer. Typically, in each rod-shaped portion 920, the cross-sectional shape cut by a plane orthogonal to the axis of each rod-shaped portion 920 includes the rectangular shape shown in FIGS. 2 and 3.

The connecting portion 925 connects adjacent rod-shaped portions 920. Typically, the connecting portion 925 is provided at or near the center position in the longitudinal direction of the rod-shaped portion 920.

The molding material 92 may be manufactured by a known press molding method. If the above-mentioned cross-sectional shape is rectangular, the molding material 92 can be easily molded by punching.

<Secondary plating process>
The secondary plating step is a step of partially plating the molding material 92 by the pre-plating method to form the secondary plating layer 931, that is, a step of performing a partial post-plating method.

Specifically, in the molding material 92, the secondary plating layer 931 is formed in the region on one end side of each rod-shaped portion 920. The secondary plating layer 931 is not formed in the region on the other end side of each rod-shaped portion 920. Therefore, in the region on the other end side of each rod-shaped portion 920, the region where the material plate 90 is exposed and the region provided with the primary plating layer exist at different positions in the circumferential direction of each rod-shaped portion 920.

The secondary plating layer 931 is formed so as to cover the entire circumference of each rod-shaped portion 920 in the circumferential direction in the region on one end side of each rod-shaped portion 920. As a result, in the region on one end side of each rod-shaped portion 920, the secondary plating layer 931 is in contact with the first coating portion provided in contact with the exposed region of the material plate 90 and the primary plating layer instead of the material plate 90. It is provided with a second covering portion provided in the above. The first coated portion and the second coated portion exist at different positions in the circumferential direction of each rod-shaped portion 920.

The first coated portion finally constitutes the above-mentioned thin film portion 34. Since the first coating portion includes the secondary plating layer 931 and does not include the primary plating layer, it tends to have the above-mentioned minimum value t ₂ .

The second coated portion finally constitutes the above-mentioned thick film portion 35. Since the second coating portion includes the tin-based layer of the primary plating layer and the pure tin layer in the secondary plating layer 931, it tends to have the _{above-mentioned maximum value t 1.}

The thickness of the pure tin layer in the secondary plating layer 931 typically corresponds to the _{above-mentioned minimum value t 2.} Therefore, the thickness of the pure tin layer in the secondary plating layer 931 is adjusted so that the minimum value t _{2 is within a predetermined range.} The thickness of the pure tin layer in the secondary plating layer 931 is, for example, 0.8 μm or more and 4.0 μm or less.

The secondary plating layer 931 may be formed by various plating methods, typically an electroplating method. Prior to the formation of the secondary plating layer 931, pretreatment such as degreasing and acid cleaning may be performed.

<Heat treatment process>
The heat treatment step is a step of performing a heat treatment for alloying a part of the pure tin layer in the secondary plating layer 931 existing in the region on one end side of the partial plating material 93. By forming a layer made of an alloy containing tin and copper by alloying, it is possible to reduce the generation of whiskers on the surface of the tin-based layer 30. In particular, in this heat treatment, the heat treatment temperature is set to be equal to or lower than the melting point of tin so that the pure tin layer in the primary plating layer existing in the region on the other end side of the partial plating material 93 is hard to be melted.

Quantitatively, the heat treatment temperature is less than 230 ° C. The lower the heat treatment temperature, the easier it is to prevent the above-mentioned melting. Further, after the heat treatment, the layer made of pure tin tends to remain thick. As a result, a tin-based layer 30 having excellent solder wettability can be obtained. The higher the heat treatment temperature, the more the alloying is promoted, and the thicker the layer composed of the alloy is likely to be. As a result, the generation of whiskers is likely to be reduced in the tin-based layer 30. From the viewpoint of preventing melting and good solder wettability, the heat treatment temperature is preferably 225 ° C. or lower and 220 ° C. or lower. From the viewpoint of reducing the generation of whiskers, the heat treatment temperature is preferably 150 ° C. or higher, more preferably 180 ° C. or higher, 190 ° C. or higher, and 200 ° C. or higher.

The heat treatment temperature holding time can be appropriately selected according to the size of the rod-shaped portion 920 and the like. For example, the holding time is 5 seconds or more and 60 seconds or less. When the predetermined holding time has elapsed, the heating is stopped and the heat treatment step is completed.

The heat treatment material 94 obtained through the heat treatment step includes a heat treatment layer 941 manufactured from the secondary plating layer 931 in a region on one end side of the rod-shaped portion 920. The heat treatment layer 941 includes a layer made of the above-mentioned alloy and a layer made of pure tin provided in contact with the alloy layer. That is, the heat treatment layer 941 corresponds to the tin-based layer 30 including the above-mentioned inner layer 301 and outer layer 302. At least a part of the alloy layer is provided in contact with the material plate 90.

<Other processes>
The pin terminal 1 of the embodiment is obtained by cutting the connecting portion 925 with respect to the heat treatment material 94 and separating the adjacent rod-shaped portions 920. The heat treatment layer 941 on one end side of the rod-shaped portion 920 constitutes the tip covering portion 31. In the region on the other end side of the rod-shaped portion 920, the tin-based layer constitutes the rear end covering portion 32, and the region where the material plate 90 is exposed constitutes the exposed region 26 shown in FIG.

[Test Example 1]
Under various manufacturing conditions, pin terminals having a tin-based layer covering at least a part of the surface of the base material were prepared, and the quality of soldering, the thickness of the tin-based layer, the solder wettability, and the number of tin protrusions were examined. It was.

(Samples No. 1 to No. 4, No. 50)
Sample No. 1 to No. 4, No. The pin terminal of 50 is a sample manufactured by using the above-mentioned multi-stage plating method. Three or more samples were prepared for each sample.

To outline the manufacturing process, a plated plate on which a primary plating layer is formed is punched into a predetermined shape to produce a molding material having a plurality of rod-shaped portions and connecting portions. In the molding material, a secondary plating layer is formed in a region on one end side of each rod-shaped portion to be parallel so as to cover the entire circumference of each rod-shaped portion in the circumferential direction. After secondary plating, sample No. Heat treatment is performed except for 1. After the heat treatment, a pin terminal can be obtained by cutting the connecting portion connecting the adjacent rod-shaped portions. Sample No. In No. 1, after the secondary plating, the connecting portion was cut without performing heat treatment.

The plated plate has a tin-based layer on the front and back surfaces of the copper alloy plate, and does not have a layer other than the tin-based layer such as a base layer. The tin-based layer includes an alloy layer containing tin and copper on the copper alloy plate side, and a pure tin layer on the alloy layer.

As the copper alloy plate, a plate composed of brass of JIS alloy number C2600 and a plate composed of phosphor bronze of JIS alloy number C1940 were prepared.

A copper alloy plate having a thickness of 0.64 mm was prepared.

The secondary plating layer is a pure tin layer and does not include layers other than the pure tin layer such as the base layer.

The pin terminal of each sample includes a rod-shaped base material and a tin-based layer covering a predetermined area of the base material, and a part of the base material is exposed. In the cross section obtained by cutting the region on each end side of each pin terminal with a plane orthogonal to the longitudinal direction of the base material, the cross-sectional shape of the base material is square. Here, the length of one side of the square in the cross section is 0.64 mm. This pin terminal is called a 0.64 type.

In the above-mentioned cross section, the outer peripheral surface of the base material includes a first surface, a second surface, a third surface, and a fourth surface constituting each surface of the square.
The first surface is a surface on which a punch is pressed during punching, a so-called sagging surface.
The second surface is the surface facing the first surface, which is the so-called burr surface.
The third and fourth surfaces are surfaces that face each other and are orthogonal to the first and second surfaces. The third and fourth surfaces are cut surfaces produced by punching.

Sample No. 1 to No. 4, No. In the pin terminal of 50, the region on one end side of the base material includes a tin-based layer covering all the circumferential directions of the base material, here, the first surface to the fourth surface. The base material is not exposed on one end side of the base material. The region on the other end side of the base material includes a tin-based layer covering a part of the base material in the circumferential direction, here, the first surface and the second surface. The other part in the circumferential direction of the base material, here, the third surface and the fourth surface, is exposed without a plating layer including a tin-based layer. Both the tin-based layer on one end side and the tin-based layer on the other end side of the base material include an outer layer made of pure tin and an inner layer made of an alloy containing tin and copper.

<Terminal size and base material composition>
Sample No. 1 to No. 4, No. Reference numeral 50 denotes a 0.64 type pin terminal, which was manufactured by using a plated plate in which the copper alloy plate is a phosphor bronze plate. That is, the sample No. 1 to No. 4, No. Each of the 50 substrates is composed of phosphor bronze having a Zn content of 20% by mass or less in the copper alloy.
Sample No. As 3-1 except that the copper alloy plate is a brass plate, the sample No. A product prepared in the same manner as in No. 3 was prepared. That is, the sample No. The base material of 3-1 is composed of brass having a Zn content of more than 20% in the copper alloy.

<Heat treatment conditions>
Sample No. No. 1 is not heat-treated after the secondary plating, and a hyphen "-" is described in the table.
Sample No. 2-No. 4, No. At 50, the heat treatment temperature after the secondary plating is different, and is 200 ° C., 210 ° C., 220 ° C., and 240 ° C., respectively.
The holding time of each heat treatment is 30 seconds.

(Sample No. 101)
Sample No. The pin terminal of 101 is a sample provided with a tin-based layer by a so-called post-plating method. The pin terminal includes a tin-based layer that covers the entire surface of the base material from one end to the other end of the base material. The base material is not exposed at this pin terminal.

Sample No. The pin terminal of 101 and the sample No. described later. The pin terminals of 102 are all 0.64 type pin terminals, and were manufactured by using a plated plate in which the copper alloy plate is a brass plate.

(Sample No. 102)
Sample No. The pin terminal of 102 is a sample provided with a tin-based layer by a so-called pre-plating method. The pin terminal includes a tin-based layer covering the first surface and the second surface of the base material from one end to the other end of the base material. The third and fourth surfaces of the base material are exposed without a tin-based layer from one end to the other end of the base material.

The existence of a tin-based layer covering the base material at the pin terminals of each sample can be confirmed, for example, by taking the above-mentioned cross section and analyzing the cross section in terms of components. For component analysis, for example, the energy dispersive X-ray spectroscope (SEM-EDX) attached to the scanning electron microscope can be used.

(Good or bad soldering)
Sample No. whose base material is phosphor bronze. No. 3 pin terminal and sample No. 3 whose base material is brass. The length (mm) of the solder icicles was examined at the pin terminal of 3-1. Here, after soldering is performed on the region on one end side of the base material where the tin-based layer exists over the entire circumference in the circumferential direction of the base material, the lengths of the solder shavings are measured as follows. The solder used for soldering is a lead-free solder alloy.

The length of the solder icicles was measured by observing the area on one end side of the pin terminal of each sample with a commercially available microscope and using this observation image. The solder icicles are the distance from one end of the pin terminal to the tip of the solder icicles. It can be said that the shorter the length of the solder icicles, the better the soldering.

(Measurement of tin layer thickness)
At the pin terminals of each sample, the thickness of the tin-based layer existing in the region on one end side of the base material was measured. Sample No. prepared by using the pre-plating method. For 102, the thickness of the tin-based layer has not been measured.

Sample No. 1 to No. 4, No. 50, No. In the region on one end side of the base material at the pin terminal of 101, a tin-based layer exists over the entire circumference of the base material in the circumferential direction as described above. In the region on one end side of this base material, a point 1 mm from one end of the pin terminal along the longitudinal direction of the pin terminal is defined as a measurement point for the thickness of the tin-based layer.
Measurement points are set for each of the first to fourth surfaces of the base material.
The measurement points on each surface should be opposite to each other. Specifically, the first surface and the second surface have measurement points at the center position in the width direction of each surface and its vicinity. The third and fourth surfaces have measurement points at the center position in the height direction of each surface and its vicinity.

The thickness of the tin-based layer was measured here using a commercially available fluorescent X-ray film thickness meter. In addition, the thickness of the inner layer, which is the alloy layer, and the thickness of the outer layer, which is the pure tin layer, were measured at each of the above-mentioned measurement points by using the component analysis by the fluorescent X-ray film thickness meter. The thickness of the tin-based layer is the total thickness of the inner layer and the outer layer. The thickness of the tin-based layer may be measured by taking a cross section of the pin terminal and using an image obtained by observing this cross section with an SEM or the like.

Furthermore, sample No. 1 to No. 4, No. In No. 50, the thickness of the tin-based layer was measured even at a position away from one end of the pin terminal. Specifically, in the tin-based layer existing on one end side of the above-mentioned base material, the thickness of the tin-based layer is measured at 3 mm points and 5 mm points along the longitudinal direction of the pin terminals from one end of the pin terminals. It is a place. At each measurement point, the above-mentioned measurement points are taken for each of the four surfaces of the base material. The thickness of the tin-based layer was measured at each measurement point.

The number of samples of each sample was set to 3, and the thickness of the tin-based layer was measured for each sample. Furthermore, the sample No. 1 to No. 4, No. At 50, the thickness of the inner layer and the thickness of the outer layer were measured for each of the three samples. Table 1 shows the average values of the three samples for each of the tin layer thickness, the inner layer thickness, and the outer layer thickness.

Tables 2 and 3 show _{the maximum value t 1} (μm) and the minimum value t ₂ (μm) of the thickness of the tin-based layer at the above-mentioned point 1 mm from the tip. Tables 2 and 3 show the difference between the maximum value t ₁ and the minimum value t ₂ _{(t 1-} _{t 2} ) (μm) and the ratio of the minimum value t ₂ _{to the maximum value t 1} _{(t 2} / t _1). Shown.

Furthermore, the sample No. 1 to No. 4, No. In No. 50, the minimum thickness of the inner layer among the tin-based layers covering the third and fourth surfaces of the base material is set to the thickness t ₃₁ (μm) at a point 1 mm from the tip, and the thickness of the outer layer is set to t 31 (μm). The minimum value of tin is shown in Tables 2 and 3 as the _{thickness t 32 (μm).}

Furthermore, sample No. 1 to No. 4, No. For 50, the difference in the longitudinal thickness of the base material in the tin-based layer was examined. Specifically, in the tin-based layer existing in the region on one end side of the base material, the above-mentioned 1 mm point, 3 mm point, and 5 mm point from one end are set as measurement points for the thickness of the tin-based layer, and each measurement point. In, a measurement point is taken as described above. The difference between the maximum thickness and the minimum thickness is taken for the thickness of the tin-based layer measured at three measurement points on each surface of the base material, for example, the first surface. Of the total of four differences obtained for each surface of the base material, the maximum value is shown in the item "One end side, thickness difference in the longitudinal direction" in Table 2.

(Solder wettability)
At the pin terminals of each sample, the maximum wetting force (mN) of the region on one end side of the base material was measured.
For the measurement of the maximum wetting force, the number of samples of each sample is set to 3, the maximum wetting force is measured for each sample, and the average value of the three measured values is shown in Table 3. Sample No. prepared by using the post-plating method. For 101, the maximum wetting force has not been measured.

The maximum wetting force is measured using a commercially available meniscograph tester.
The test is carried out according to the test procedure of JIS C 60068-2-54: 2009 as described in JIS C 5402-12-7: 2005. The test conditions are set as follows with reference to JIS C 60068-2-54: 2009.

<Test conditions>
The solder used for the test is a lead-free solder alloy.
As the flux used in the test, rosin flux, which is a low activity flux, is used. This rosin flux is an IPA solution in which 25% rosin by mass fraction is dissolved in 75% isopropyl alcohol (IPA) by mass fraction.
The immersion temperature is 245 ° C ± 10 ° C.
The immersion speed is 4 mm / sec ± 2 mm / sec.
The immersion depth is 1.5 mm ± 0.5 mm.
The time from applying the flux to immersing it in the solder is constant.

Set the solder immersion temperature, immersion speed, and immersion depth in the meniscograph tester, perform the test, and obtain a graph of the wet waveform. If a commercially available meniscograph tester is used, the maximum wetting force can be automatically obtained from this graph.

(Number of tin protrusions)
At the pin terminals of each sample, the number of tin protrusions formed on the tin-based layer existing in the region on one end side of the base material was measured.
To measure the number of tin protrusions, the number of samples of each sample is set to 3, and the total number of whiskers, which are needle-shaped protrusions, and nodules, which are spherical protrusions, is measured for each sample, and the three measured values are measured. The averaged values are shown in Table 3. Sample No. 101, No. For 102, the number of tin protrusions has not been measured.

The number of tin protrusions is measured under the following conditions.
The pin terminals of each sample are held in the following hot and humid environment for a predetermined time to prepare a test piece.
The environmental conditions are a temperature of 85 ° C. and a humidity of 85%. The holding time is 60 hours.
In each of the prepared test pieces, the surface of the tin-based layer existing in the region on one end side of the base material is observed with a commercially available three-dimensional laser microscope. The observation region on the surface of the tin-based layer is a portion of the tin-based layer that covers the third or fourth surface of the base material, and is 0. Select from the range from the 5 mm point to the 1.5 mm point.
In this microscopic image, the number of nodules and whiskers is counted.
The observation field of view is a square having a side length of 0.35 mm. The observation magnification is adjusted so that nodules on the order of several μm can be measured.

First, the quality of soldering will be described.
Sample No. whose base material is made of brass. The length of the solder icicles of 3-1 is 0.77 mm. The length of the solder icicles of Sample No. 3 whose base material is phosphor bronze is 0.17 mm, and Sample No. 3 has a length of 0.17 mm. Shorter than 3-1. One of the reasons for this is the sample No. It is considered that the base material of No. 3 has a Zn content of 20% by mass or less, here 0.05% by mass or more and 0.20% by mass or less, which is less than brass having a Zn content of more than 28% by mass. Be done. Sample No. In No. 3, it is considered that the formation of solder icicles was suppressed due to the low Zn content.

Next, the thickness of the tin-based layer will be described.
As shown in Tables 2 and 3, the sample No. 1 to No. 4, No. In all of 50, the difference (t _1- t ₂ ) was 0.20 μm or more, and the sample No. 50 prepared by the post-plating method. It can be seen that it has a larger difference (t _1- t _{2) than 101.} In addition, sample No. 1 to No. 4, No. At 50, the thickness of the tin-based layer existing on the first or second surface of the base material has a maximum value t ₁ , and the thickness of the tin-based layer existing on the third or fourth surface of the base material. It can be seen that stakes the minimum value t _2. That is, the sample No. 1 to No. 4, No. _{It can be said that the pin terminal of 50 has a thin film portion having a minimum value t 2} and a thick film portion having a maximum value t ₁ at different positions in the circumferential direction of the base material in the region on one end side of the base material.

In addition, as shown in Tables 2 and 3, the sample No. 1 to No. 4, No. At 50, the ratio (t ₂ / t ₁ ) was 0.2 or more and less than 0.8, and the sample No. It can be seen that the ratio (t ₂ / t _{1) is smaller than that of 101.} That is, the sample No. 1 to No. 4, No. At 50, it can be said that the difference between _{the maximum value t 1} and the minimum value t ₂ of the tin-based layer is large to some extent in the region on one end side of the pin terminal.

From the above, the sample No. 1 to No. 4, No. In No. 50, in the region on one end side of the base material, there is a tin-based layer that covers all of the circumferential direction of the base material, and the thickness of the tin-based layer is different in the circumferential direction of the base material. It can be said that the difference is large to some extent. These facts are also supported by the micrographs shown in FIGS. 8A-8E.

FIG. 8A shows the sample No. It is an SEM image which observed the cross section by SEM about one of the samples among the pin terminals of 3. The cross section is obtained by cutting a point 3 mm along the longitudinal direction of the pin terminal from one end of the pin terminal in a plane parallel to the axis of the base material in the region on one end side of the base material.

8B-8E show an enlarged area surrounded by a white dashed rectangle in FIG. 8A.
8B to 8E show tin-based layers covering the first surface, the second surface, the third surface, and the fourth surface of the base material in this order. In FIGS. 8B to 8E, the dark gray region is the base material 2, and the black region is the embedded resin. The gray region existing between the base material 2 and the embedded resin is the tin-based layer 30. The region of the tin-based layer 30 on the side closer to the base material 2 is the inner layer 301 made of an alloy containing tin and copper. In the tin-based layer 30, the light gray region in contact with the inner layer 301 is the outer layer 302 made of pure tin. Only FIG. 8B is shown with a reference numeral.

Compare FIGS. 8B and 8C with FIGS. 8D and 8E. From this comparison, the thickness of the tin-based layer covering the first and second surfaces of the base material, the thickness of the inner layer, and the thickness of the outer layer are all tin-based covering the third and fourth surfaces of the base material. It can be seen that it is thicker than the thickness of the layer, the thickness of the inner layer, and the thickness of the outer layer. The matter concerning this difference in thickness is the same when the cutting position is set to a point 1 mm along the longitudinal direction of the pin terminal from one end of the pin terminal. In addition, regarding the matter concerning this difference in thickness, the sample No. 1, No. 2, No. The same applies to 4.

Then, as shown in Table 3, the sample No. 1 to No. In No. 4, the maximum wetting force is 0.25 mN or more, and it can be seen that the solder wetting property is excellent. Sample No. 1 to No. One of the reasons why the maximum wetting force of 4 is high is that it has a tin-based layer that covers the entire circumferential direction of the base material in the region on one end side of the base material. In particular, this tin-based layer contains an outer layer made of pure tin, and the thickness of the outer layer is appropriate. Quantitatively, among the tin-based layers, the thickness t _{32 of the} outer layer provided in the thin film portion is 0.5 μm or more, and here 1.0 μm or more. The thickness of the outer layer provided in the thick film portion is thicker than _{the thickness t 32 of the outer layer of the thin film portion.} That is, it can be said that in the region on one end side of the base material, a pure tin layer having excellent solder wettability is appropriately present over the entire circumference in the circumferential direction of the base material.

On the other hand, sample No. The maximum wetting force of 50 is less than 0.25 mN. Sample No. One of the reasons why the maximum wetting force of 50 is low is that the sample No. The heat treatment temperature of 50 is the sample No. 2-No. It is considered that the temperature is higher than the heat treatment temperature of 4.

On the other hand, sample No. 102 cannot measure the maximum wetting force and is inferior in solder wettability. One of the reasons for this is the sample No. In 102, it is considered that a part of the base material, here, the third surface and the fourth surface of the base material are exposed in the region on one end side of the base material.

Sample No. 1 to No. 4, No. At 50, the whiskers, which are the above-mentioned needle-shaped protrusions, were not observed. In some samples, only nodules, which are spherical protrusions, were observed. Therefore, the number of tin protrusions shown in Table 3 is the number of nodules. As shown in Table 3, the sample No. 2-No. 4, No. At 50, the number of nodules at 0.35 mm × 0.35 mm is 15 or less, and it can be seen that there is no whisker and the number of nodules is small. In particular, sample No. 3, No. 4, No. The number of nodules at 50 is 0, and whiskers and nodules are virtually absent. Sample No. 2-No. 4, No. One of the reasons why the number of whiskers and nodules is small in 50 is as follows. This is because the tin-based layer is provided in contact with the third and fourth surfaces, which are the exposed regions of the base material, but includes the following inner layers. The inner layer is made of an alloy containing tin and copper and has an appropriate thickness. _{Quantitatively, the thickness t 31} of the inner layer in the thin film portion provided in contact with the third and fourth surfaces of the base material is 0.1 μm or more. The thickness of the inner layer provided in the thick film portion is thicker than _{the thickness t 31 of the inner layer of the thin film portion.} That is, it can be said that in the region on one end side of the base material, an alloy layer having an action of suppressing the generation of whiskers and nodules appropriately exists over the entire circumference in the circumferential direction of the base material. Therefore, the sample No. 2-No. 4, No. It can be said that whiskers and nodules are unlikely to occur on the surface of the tin-based layer of No. 50 even if the base layer is not provided.

On the other hand, sample No. In 1, the number of nodules in 0.35 mm × 0.35 mm is more than 15. In addition, sample No. _{In No. 1, the thickness t 31} of the inner layer of the thin film portion is less than 0.1 μm. Sample No. In No. 1, it is considered that the number of nodules increased because _{the thickness t 31 of the inner layer was thin.} One of the reasons for this is the sample No. It is considered that No. 1 is not heat-treated after the secondary plating.

In addition, as shown in the item "One end side, thickness difference in the longitudinal direction" in Table 2, the sample No. 1 to No. In No. 4, the maximum value of the above difference is 1 μm or less. In the region on one end side of the base material, it can be said that the difference in the thickness of the tin-based layer in the longitudinal direction of the base material is small. On the other hand, sample No. At 50, the maximum value of the above difference is as large as more than 3 μm. One of the reasons why the maximum value of the above difference is large is that the sample No. The heat treatment temperature of 50 is the sample No. 2-No. It is considered that the temperature is higher than the heat treatment temperature of 4, and particularly higher than the melting point of tin. It is considered that the heat treatment temperature was higher than the melting point of tin, so that the secondary plating layer was melted during the heat treatment and the thickness of the tin-based layer became non-uniform after the heat treatment.

Also, sample No. 1 to No. 4, No. For the pin terminals of 50, the thickness of the tin-based layer existing on the first surface and the second surface of the base material was examined for the region on the other end side of the base material that was not subjected to the secondary plating. Here, the maximum value of the difference between the maximum thickness and the minimum thickness was examined in the same manner as in the case of evaluating the thickness difference in the longitudinal direction described above. As a result, the sample No. 1 to No. In No. 4, the maximum value of the above difference is less than 0.2 μm, and it can be said that the tin-based layer has a uniform thickness in the longitudinal direction of the base material. Sample No. The maximum value of 50 is 0.2 μm or more, and it can be said that the tin-based layer has an enlarged portion. One of the reasons for this is the sample No. The heat treatment temperature of 50 is the sample No. 2-No. It is higher than the heat treatment temperature of No. 4, and particularly higher than the melting point of tin. It is considered that when the heat treatment temperature was higher than the melting point of tin, the primary plating layer covering the first surface and the second surface was melted during the heat treatment, and the thickness of the tin-based layer became non-uniform after the heat treatment.

From the above, it was shown that when the constituent material of the base material is a copper alloy and the Zn content is 20% by mass or less, the solder icicles are short and soldering defects are reduced.

Further, a tin-based layer covering the entire circumference of the base material in the circumferential direction is provided in the region on one end side of the base material, and pin terminals having different thicknesses of the tin-based layer in the circumferential direction of the base material, particularly the tin-based layer. _{It was shown that when the thickness t 32} of the pure tin layer in the thin film portion provided in the above was 0.5 μm or more, the solder wettability was excellent. _{Furthermore, it was shown that when the thickness t 31} of the alloy layer in the thin film portion was 0.1 μm or more, not only the whiskers but also the number of nodules was small. The solder wettability and the number of tin protrusions will be described in more detail in Test Example 2 described later. The sample No. shown in Table 3 51 and No. 52 will be described in Test Example 2.

In addition, it was shown that the above-mentioned pin terminal having excellent solder wettability is provided with a tin-based layer having a uniform thickness in the longitudinal direction of the base material in the region on the other end side of the base material. Such a pin terminal can be said to be excellent in insertability because the region on the other end side can be easily inserted into the mating terminal.

As described above, the pin terminals having excellent solder wettability and also having excellent insertability into the mating terminal, and the pin terminals having a small number of whiskers, use the above-mentioned multi-stage plating method, in particular, two. It was shown that it is produced by setting the heat treatment temperature after the next plating to be equal to or lower than the melting point of tin. The heat treatment temperature will be described in more detail in Test Example 2 described later.

If the cross-sectional shape of the base material is a rectangle, polygon, circle, etc. other than a square, the measurement points for the thickness of the tin-based layer are taken as follows. When the cross-sectional shape of the base material is a rectangle or polygon other than a square, the measurement point is the center position in the width direction and its vicinity with respect to any one surface of the base material at a point 1 mm from the tip described above. The position facing this measurement point is also used as the measurement point. In addition, the points facing each other in the direction orthogonal to the straight line connecting the two measurement points are also set as the measurement points. When the cross-sectional shape of the base material is circular, the measurement points are a point facing an arbitrary diametrical direction and a point facing the diametrical direction deviated by 90 ° from the diametrical direction at a point 1 mm from the tip described above.

[Test Example 2]
The relationship between the heat treatment temperature after secondary plating, the maximum wetting force of the pin terminals, and the number of tin protrusions was investigated.

Here, in addition to the sample prepared in Test Example 1, the following sample No. 51, No. 52 was made. Sample No. 51, No. 52 is the sample No. With respect to No. 3, except that the heat treatment temperature after the secondary plating was changed to 150 ° C. or 180 ° C., the sample No. It was produced in the same manner as in 3.

Sample No. 51, No. Table 3 shows the heat treatment temperature (° C.) after the secondary plating, the maximum wetting force (mN), and the number of tin protrusions (pieces / (0.35 mm × 0.35 mm)) for 52. In addition, sample No. _{With respect to 51, the maximum value t 1} (μm) and the minimum value t ₂ (μm) of the tin-based layer existing in the region on one end side of the base material, and the thin film portions existing on the third and fourth surfaces of the base material. Table 3 shows the thickness t ₃₁ (μm) of the _{inner layer and the thickness t 32} (μm) of the outer layer. The difference (t _1- t ₂ ) and the ratio (t ₂ / t ₁ ) were obtained, and the results are also shown in Table 3. The method for measuring the maximum wetting force, the number of tin protrusions, and the thickness of the tin-based layer is the same as in Test Example 1.

FIG. 9 is a graph showing the relationship between the heat treatment temperature after secondary plating, the maximum wetting force, and the number of tin protrusions. In this graph, the horizontal axis represents the heat treatment temperature (° C.). The left vertical axis shows the maximum wetting force (mN), and the legend is a circle. The right vertical axis shows the number of tin protrusions (pieces / (0.35 mm × 0.35 mm)), and the legend is a diamond mark.

FIG. 10 is a graph showing the relationship between _{the thickness t 32} of the outer layer of each sample and the maximum wetting force. In this graph, the horizontal axis represents the thickness of the outer layer t ₃₂ (μm). The vertical axis indicates the maximum wetting force (mN).

_{FIG. 11 is a graph showing the relationship between the thickness t 31} of the inner layer of each sample and the number of tin protrusions. In this graph, the horizontal axis represents the inner layer thickness t ₃₁ (μm). The vertical axis shows the number of tin protrusions (pieces / (0.35 mm × 0.35 mm)).

12A to 12D show the sample numbers in order. 1, No. 2, No. 4, It is a microscope observation image used for measuring the number of tin protrusions in the pin terminal of No. 50. The microscopic observation images of FIGS. 12A to 12D are all images observed by the above-mentioned three-dimensional laser microscope, and show a square observation field of view having a side length of 0.35 mm.

As shown in Tables 3 and 9 above, it can be said that the maximum wetting force and the number of tin protrusions are affected by the heat treatment temperature after the secondary plating.

Focus on maximum wetting power.
The maximum wetting force is substantially constant in the range of the heat treatment temperature up to 210 ° C., decreases as the heat treatment temperature rises, and extremely decreases when the heat treatment temperature is 240 ° C.

Further, as shown in FIG. 10, among the tin-based layers existing in the region on one end side of the base material, the thicker _{the thickness t 32 of the outer layer made of pure tin, the thicker the thin film portion provided in contact with the base material.} The maximum wetting power tends to be high. Here, when the thickness t ₃₂ of the outer layer is 1.0 μm or more, the maximum wetting force is 0.3 mN or more, and there are many samples of 0.4 mN or more. If the thickness t _{32 of the} outer layer is 0.5 μm or more, a maximum wetting force of 0.25 mN or more can be expected.

From the above, it can be said that the lower the heat treatment temperature, the more the pure tin layer formed by the secondary plating remains after the heat treatment, and the thickness t _{32 of the} outer layer tends to be thicker, so that the maximum wetting force can be increased. Here, it can be said that the heat treatment temperature is preferably less than 240 ° C., and it can be said that the heat treatment temperature is preferably less than the melting point of tin (about 232 ° C.) from the tendency of the graph shown in FIG. Further, from the viewpoint of improving the maximum wetting force, it can be said that the heat treatment temperature is more preferably 220 ° C. or lower.

Next, we focus on the number of tin protrusions.
Whiskers, which are the above-mentioned needle-shaped protrusions, were not observed in any of the samples, and only nodules, which are spherical protrusions, were observed in some samples. Therefore, the number of tin protrusions shown in FIGS. 9 and 11 is the number of nodules. The number of nodules described below is a number existing in a field of view of 0.35 mm × 0.35 mm.

The number of tin protrusions is large without heat treatment and decreases as the heat treatment temperature rises. As shown in FIG. 12A, the sample No. which has not been heat-treated. In No. 1, although the whiskers, which are the above-mentioned needle-shaped protrusions, do not exist, the number of spherical nodules is large and exceeds 30. The white dashed circle attached to FIG. 12A surrounds a part of the nodules among the plurality of nodules. It should be noted that even if the number of nodules is as large as 30 or more, short circuits between pin terminals due to nodules are unlikely to occur. However, if there are too many nodules, there is a concern that they will grow into whiskers, which are needle-shaped protrusions. Therefore, the number of nodules alone is preferably 40 or less as in this example.

On the other hand, when the heat treatment temperature exceeds 180 ° C., especially when the temperature is 200 ° C. or higher, the number of nodules is 15 or less, and here, 10 or less. In FIG. 12B, the granular portion at the center of the plurality of circular regions is a nodule. In this test, when the heat treatment temperature exceeds 200 ° C., the number of nodules is 0, and whiskers and nodules are substantially absent. In FIGS. 12C and 12D, the above-mentioned circular region is not observed.

Further, as shown in FIG. 11, among the tin-based layers existing in the region on one end side of the base material, the thickness of the inner layer made of an alloy containing tin and copper in the thin film portion provided in contact with the base material. The _{thicker t 31, the} smaller the number of nodules. Here, when the thickness t ₃₁ of the inner layer is 0.1 μm or more, the number of nodules is 30 or less. If the thickness t _{31 of the} inner layer is 0.2 μm or more, the number of nodules is 20 or less. Further, if the thickness t _{31 of the} inner layer is more than 0.2 μm, the number of nodules is 15 or less, and here, 10 or less.

From the above, it can be said that the higher the heat treatment temperature, the more the pure tin layer formed by the secondary plating is alloyed by the heat treatment and the inner layer thickness t ₃₁ tends to be thicker, so that the number of whiskers including nodules decreases. .. Here, it can be said that the heat treatment temperature is preferably more than 180 ° C. and more preferably 200 ° C. or higher.

The present invention is not limited to these examples, but is indicated by the claims and is intended to include all modifications within the meaning and scope equivalent to the claims.

For example, the composition of the base material of Test Examples 1 and 2, the size of the base material, the composition and thickness of the plating layer, the heat treatment conditions, and the like can be appropriately changed.
As a modification of the composition of the plating layer, as the plated plate used in Test Examples 1 and 2, a plate containing a base layer between the tin-based layer and the copper alloy plate can be mentioned. In this case, the region on one end side of the base material includes a base layer under the thick film portion of the tip coating portion. The region on the other end side of the base material includes a base layer under the rear end covering portion which is a tin-based layer.

1 pin terminal 2 base material 21 1st surface, 22 2nd surface, 23 3rd surface, 24 4th surface 26 Exposed area 3 Plating layer 30 Tin-based layer, 31 Tip coating part, 32 Rear end coating part 34 Thin film part, 35 Thick film part 300 Base layer, 301 Inner layer, 302 Outer layer 6 Connector 60 Housing 7 Wire harness with connector 70 Wire harness, 71

Wire

74,75,76 Connector 8 Control unit 80 Circuit board, 81 Through hole, 85 Solder 90 Material Plate, 91 Plated plate, 92 Molding material 93 Partial plating material, 94 Heat treatment material 920 Rod-shaped part, 925 connector 931 Secondary plating layer, 941 Heat treatment layer t ₁ maximum value, t ₂ minimum value, t ₃₁ , t ₃₂ , _t _i, t _o thickness

Claims

A pin terminal including a rod-shaped base material and a plating layer covering a predetermined region of the base material.
The plating layer includes a tin-based layer composed of a metal containing tin.
One end side of the base material is provided with a tip covering portion that covers the entire circumferential region of the base material.
The tin-based layer includes the tip covering portion and contains the tip covering portion.
The tip covering portion includes a thin film portion and a thick film portion at different positions in the circumferential direction of the base material.
The constituent material of the base material is a copper alloy having a Zn content of 20% by mass or less, or pure copper.
Pin terminal.
The tip covering portion includes an outer layer and an inner layer, and has an outer layer and an inner layer.
The constituent material of the outer layer is pure tin.
The pin terminal according to claim 1, wherein the constituent material of the inner layer is an alloy containing tin and copper.
A point 1 mm from one end of the pin terminal along the longitudinal direction of the pin terminal is set as a measurement point, and the difference between the maximum value t 1 and the minimum value t 2 of the thickness of the tip covering portion measured at the measurement point. (t 1 -t 2) the pin terminal according to claim 2 is at least 0.20 [mu] m.
A point 1 mm from one end of the pin terminal along the longitudinal direction of the pin terminal is set as a measurement point, and the ratio of the maximum value t 1 and the minimum value t 2 of the thickness of the tip covering portion measured at the measurement point. The pin terminal according to claim 2 or 3, wherein t 2 / t 1 is 0.2 or more and less than 0.8.
The thin film portion is provided in contact with the base material and has the minimum value t 2 .
The pin terminal according to claim 3 or 4, wherein the thick film portion has the maximum value t 1.
In the cross section of the base material, in which the portion provided with the tip covering portion is cut in a plane orthogonal to the axis thereof.
The shape of the base material is rectangular and
The outer peripheral surfaces of the base material include a first surface and a second surface arranged to face each other, and a third surface and a fourth surface arranged to face each other.
The portion of the tip covering portion that covers at least one of the first surface and the second surface has the maximum value t 1 .
The pin terminal according to any one of claims 3 to 5, wherein the portion of the tip covering portion that covers at least one of the third surface and the fourth surface is the pin terminal having the minimum value t 2.
The plating layer includes a base layer between a portion of the tip covering portion that covers the first surface and the second surface and the base material.
The portion of the tip covering portion that covers the third surface and the fourth surface is provided in contact with the base material.
The pin terminal according to claim 6, wherein the constituent material of the base layer is pure nickel or a nickel alloy.
On the first surface, the second surface, the third surface, and the fourth surface, a point 1 mm, a point 3 mm, and a point 5 mm along the longitudinal direction of the pin terminal from one end of the pin terminal. 6 or 7 where the difference between the maximum thickness and the minimum thickness is taken at the three measurement points, and the maximum value of the difference is 1.0 μm or less. Pin terminal described in.
The thickness of the outer layer in the thin film portion is 0.5 μm or more.
The pin terminal according to any one of claims 2 to 8, wherein the thickness of the inner layer in the thin film portion is 0.1 μm or more.
The number of whiskers existing on the surface of the thin film portion is 15 or less in a square field of view having a side length of 0.35 mm.
The pin terminal according to any one of claims 1 to 9, wherein the maximum wetting force of the tip coating portion measured by a meniscograph tester is 0.25 mN or more.
The other end side of the base material is provided with a rear end covering portion and an exposed region at different positions in the circumferential direction of the base material.
The tin-based layer includes the rear end covering portion.
The rear end covering portion covers a part of the circumferential direction on the other end side of the base material.
The pin terminal according to any one of claims 1 to 10, wherein the plating layer is not provided in the exposed region and the base material is exposed.
The pin terminal according to any one of claims 1 to 11 is provided.
connector.
The connector according to claim 12 and a wire harness are provided.
The wire harness is connected to the region on the other end side of the pin terminal.
Wire harness with connector.
The connector according to claim 12 or the wire harness with a connector according to claim 13 and a circuit board are provided.
The circuit board and the region on one end side of the pin terminal are connected by solder.
control unit.
The control unit according to claim 14, wherein the circuit board controls at least one of engine fuel injection and engine ignition.