JPS6424436A - Prober device - Google Patents

Prober device

Info

Publication number
JPS6424436A
JPS6424436A JP17996487A JP17996487A JPS6424436A JP S6424436 A JPS6424436 A JP S6424436A JP 17996487 A JP17996487 A JP 17996487A JP 17996487 A JP17996487 A JP 17996487A JP S6424436 A JPS6424436 A JP S6424436A
Authority
JP
Japan
Prior art keywords
ink
semiconductor wafer
drying
probe
drying device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17996487A
Other languages
Japanese (ja)
Inventor
Hisahiko Eto
Shin Tozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Device Solutions Corp
Original Assignee
Toshiba Corp
Toshiba Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Microelectronics Corp filed Critical Toshiba Corp
Priority to JP17996487A priority Critical patent/JPS6424436A/en
Publication of JPS6424436A publication Critical patent/JPS6424436A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To contrive accomplishment of manpower saving and shortening of a lead time by a method wherein an independently conducting drying process for drying ink is excluded and a drying device is unnecessitated by having a built-in drying device in a prober device. CONSTITUTION:A drying device 6, constituted by burying a heater 8 in a plate 7, is built-in in a prober device 1. On the drying device 6, ink 5 is dried up by placing an ink-adhered semiconductor wafer 4 on the upper surface of the plate 7. To be more precise, the semiconductor wafer 4 is placed on the upper surface of the stage 2 to be used for measurement, a probe testing of said circuit is conducted. Then, the result of said test is marked by the ink 5 on the surface of the semiconductor wafer 4. After said probe test has been finished, the semiconductor wafer, on which ink 5 is marked, is placed on the upper surface of the drying device 6 which is built-in in the probe device 1, and the ink 5 is dried up. Then, the ink 5 has been dried up, the semiconductor wafer 4 is housed in the housing case 3 of the probe device 1.
JP17996487A 1987-07-21 1987-07-21 Prober device Pending JPS6424436A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17996487A JPS6424436A (en) 1987-07-21 1987-07-21 Prober device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17996487A JPS6424436A (en) 1987-07-21 1987-07-21 Prober device

Publications (1)

Publication Number Publication Date
JPS6424436A true JPS6424436A (en) 1989-01-26

Family

ID=16075053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17996487A Pending JPS6424436A (en) 1987-07-21 1987-07-21 Prober device

Country Status (1)

Country Link
JP (1) JPS6424436A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01157544A (en) * 1987-09-02 1989-06-20 Tokyo Electron Ltd Probing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01157544A (en) * 1987-09-02 1989-06-20 Tokyo Electron Ltd Probing apparatus

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