JPS642440Y2 - - Google Patents
Info
- Publication number
- JPS642440Y2 JPS642440Y2 JP1981160265U JP16026581U JPS642440Y2 JP S642440 Y2 JPS642440 Y2 JP S642440Y2 JP 1981160265 U JP1981160265 U JP 1981160265U JP 16026581 U JP16026581 U JP 16026581U JP S642440 Y2 JPS642440 Y2 JP S642440Y2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- semiconductor device
- external lead
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000012212 insulator Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981160265U JPS5866640U (ja) | 1981-10-29 | 1981-10-29 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981160265U JPS5866640U (ja) | 1981-10-29 | 1981-10-29 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5866640U JPS5866640U (ja) | 1983-05-06 |
| JPS642440Y2 true JPS642440Y2 (US20100223739A1-20100909-C00005.png) | 1989-01-20 |
Family
ID=29952680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981160265U Granted JPS5866640U (ja) | 1981-10-29 | 1981-10-29 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5866640U (US20100223739A1-20100909-C00005.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0734457B2 (ja) * | 1988-04-05 | 1995-04-12 | 株式会社東芝 | 半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5384556A (en) * | 1976-12-29 | 1978-07-26 | Fujitsu Ltd | Semiconductor device |
-
1981
- 1981-10-29 JP JP1981160265U patent/JPS5866640U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5384556A (en) * | 1976-12-29 | 1978-07-26 | Fujitsu Ltd | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5866640U (ja) | 1983-05-06 |
