JPS6424244A - Method for opening window in photoresist - Google Patents
Method for opening window in photoresistInfo
- Publication number
- JPS6424244A JPS6424244A JP18135787A JP18135787A JPS6424244A JP S6424244 A JPS6424244 A JP S6424244A JP 18135787 A JP18135787 A JP 18135787A JP 18135787 A JP18135787 A JP 18135787A JP S6424244 A JPS6424244 A JP S6424244A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- patterning
- diluent
- executed
- lower layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
Abstract
PURPOSE:To attain an accurate patterning by executing the patterning on a lower layer which is a polymethylmetacrylate layer by using a reacting ion etching method in which a gas mixed oxygen with diluent is set as a reaction gas. CONSTITUTION:The polymethylmetacrylate layer 2 is set as the lower layer and a novolack system photoresist layer 3 is set as an upper layer so as to form two-layer film. And the patterning is executed by exposing and developing the upper layer 3 and the patterning is executed to the lower layer 2 by using the reacting ion etching method in which the gas mixed the oxygen with the diluent is set as the reaction gas. Nitrogen, chlorine, bromine, nitric oxide and argon, etc., can be used as the diluent, but it is desirable to select them according to a base part. Thus, the patterning can be executed in an accurate shape even if the base part has level difference.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18135787A JPS6424244A (en) | 1987-07-21 | 1987-07-21 | Method for opening window in photoresist |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18135787A JPS6424244A (en) | 1987-07-21 | 1987-07-21 | Method for opening window in photoresist |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6424244A true JPS6424244A (en) | 1989-01-26 |
Family
ID=16099304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18135787A Pending JPS6424244A (en) | 1987-07-21 | 1987-07-21 | Method for opening window in photoresist |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6424244A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03183644A (en) * | 1989-10-04 | 1991-08-09 | Ppg Ind Inc | Strand for weaving glass fiber and its improvement |
US5910453A (en) * | 1996-01-16 | 1999-06-08 | Advanced Micro Devices, Inc. | Deep UV anti-reflection coating etch |
WO2015073064A1 (en) * | 2013-06-21 | 2015-05-21 | Eastman Kodak Company | Patterning for selective area deposition |
-
1987
- 1987-07-21 JP JP18135787A patent/JPS6424244A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03183644A (en) * | 1989-10-04 | 1991-08-09 | Ppg Ind Inc | Strand for weaving glass fiber and its improvement |
US5910453A (en) * | 1996-01-16 | 1999-06-08 | Advanced Micro Devices, Inc. | Deep UV anti-reflection coating etch |
WO2015073064A1 (en) * | 2013-06-21 | 2015-05-21 | Eastman Kodak Company | Patterning for selective area deposition |
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