JPS6424083A - Aln substrate and surface treatment thereof - Google Patents

Aln substrate and surface treatment thereof

Info

Publication number
JPS6424083A
JPS6424083A JP62180483A JP18048387A JPS6424083A JP S6424083 A JPS6424083 A JP S6424083A JP 62180483 A JP62180483 A JP 62180483A JP 18048387 A JP18048387 A JP 18048387A JP S6424083 A JPS6424083 A JP S6424083A
Authority
JP
Japan
Prior art keywords
substrate
aln substrate
surface treatment
aln
al2o3
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62180483A
Other languages
Japanese (ja)
Other versions
JPH07115976B2 (en
Inventor
Hideaki Yoshida
Yoshio Kuromitsu
Tadaharu Tanaka
Kenji Morinaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP62180483A priority Critical patent/JPH07115976B2/en
Publication of JPS6424083A publication Critical patent/JPS6424083A/en
Publication of JPH07115976B2 publication Critical patent/JPH07115976B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Products (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To produce an AlN substrate having improved peeling strength by heating a single AlN substrate in a specified atmosphere to form an Al2O3 layer of a specified thickness on the surface of the substrate. CONSTITUTION:A single AlN substrate is heated at 1,000-1,500 deg.C in an atmosphere contg. oxygen under >=1X10<-2>atm. partial pressure PO2 and steam under <=1X10<-3>atm. partial pressure PH2O to form an Al2O3 layer of 5-100mum thickness on the surface of the substrate. Thus, an AlN substrate having peeling strength comparable to or higher than that of a single Al2O3 substrate is obtd.
JP62180483A 1987-07-20 1987-07-20 Method for manufacturing aluminum oxide layer coated AlN substrate Expired - Lifetime JPH07115976B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62180483A JPH07115976B2 (en) 1987-07-20 1987-07-20 Method for manufacturing aluminum oxide layer coated AlN substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62180483A JPH07115976B2 (en) 1987-07-20 1987-07-20 Method for manufacturing aluminum oxide layer coated AlN substrate

Publications (2)

Publication Number Publication Date
JPS6424083A true JPS6424083A (en) 1989-01-26
JPH07115976B2 JPH07115976B2 (en) 1995-12-13

Family

ID=16084014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62180483A Expired - Lifetime JPH07115976B2 (en) 1987-07-20 1987-07-20 Method for manufacturing aluminum oxide layer coated AlN substrate

Country Status (1)

Country Link
JP (1) JPH07115976B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004162147A (en) * 2002-11-15 2004-06-10 Plasma Giken Kogyo Kk Aluminum nitride sintered body having thermal-sprayed coating
JP2008066628A (en) * 2006-09-11 2008-03-21 Tohoku Univ Method for manufacturing metallized ceramic substrate
JPWO2007034955A1 (en) * 2005-09-26 2009-04-02 株式会社トクヤマ Ceramic sintered body for mounting light-emitting elements

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6246986A (en) * 1985-08-22 1987-02-28 住友電気工業株式会社 Aluminum nitride substrate and manufacture

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6246986A (en) * 1985-08-22 1987-02-28 住友電気工業株式会社 Aluminum nitride substrate and manufacture

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004162147A (en) * 2002-11-15 2004-06-10 Plasma Giken Kogyo Kk Aluminum nitride sintered body having thermal-sprayed coating
JPWO2007034955A1 (en) * 2005-09-26 2009-04-02 株式会社トクヤマ Ceramic sintered body for mounting light-emitting elements
JP2008066628A (en) * 2006-09-11 2008-03-21 Tohoku Univ Method for manufacturing metallized ceramic substrate

Also Published As

Publication number Publication date
JPH07115976B2 (en) 1995-12-13

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