JPS642391A - Formation of pattern of thick-film circuit - Google Patents
Formation of pattern of thick-film circuitInfo
- Publication number
- JPS642391A JPS642391A JP62158239A JP15823987A JPS642391A JP S642391 A JPS642391 A JP S642391A JP 62158239 A JP62158239 A JP 62158239A JP 15823987 A JP15823987 A JP 15823987A JP S642391 A JPS642391 A JP S642391A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- pattern
- displacement
- nozzle
- film circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
PURPOSE:To draw a fixed thick-film circuit pattern at all times by previously measuring displacement to a reference plane of a substrate along a path to be drawn on the substrate and controlling a nozzle so that a space between the substrate and the nozzle is kept constant on the basis of the result of the measurement. CONSTITUTION:When a think-film circuit pattern 8 is formed onto a ceramic substrate, a ceramic substrate 4a is positioned and sucked under a vacuum onto a first substrate stage 3a first, and an X-Y table 2 is NC-controlled and displacement to a reference plane of a position to be pattern-drawn is measured while laser beams 9 from a laser type gap measuring instrument 5 are moved along a virtual pattern 10. The displacement of face reference points 7a-7c is measured previously by the measuring instrument 5 at that time, and a plane passing through the three points is used as the reference plane and the displacement of the virtual pattern 10 is indexed. The beforehand measured substrate 4a is shifted to a second stage and positioned and sucked at the same reference position, and Z-axis adjustment and drawing are started so that a gap between a nozzle 6 and the substrate 4b is kept constant on the basis of the result of the measurement of the pattern 10.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-158239A JPH012391A (en) | 1987-06-25 | Thick film circuit pattern formation method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-158239A JPH012391A (en) | 1987-06-25 | Thick film circuit pattern formation method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS642391A true JPS642391A (en) | 1989-01-06 |
JPH012391A JPH012391A (en) | 1989-01-06 |
Family
ID=
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101829847A (en) * | 2010-05-28 | 2010-09-15 | 北京工业大学 | Light path adjusting bracket of excimer laser micromachining system |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101829847A (en) * | 2010-05-28 | 2010-09-15 | 北京工业大学 | Light path adjusting bracket of excimer laser micromachining system |
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