JPS642391A - Formation of pattern of thick-film circuit - Google Patents

Formation of pattern of thick-film circuit

Info

Publication number
JPS642391A
JPS642391A JP62158239A JP15823987A JPS642391A JP S642391 A JPS642391 A JP S642391A JP 62158239 A JP62158239 A JP 62158239A JP 15823987 A JP15823987 A JP 15823987A JP S642391 A JPS642391 A JP S642391A
Authority
JP
Japan
Prior art keywords
substrate
pattern
displacement
nozzle
film circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62158239A
Other languages
Japanese (ja)
Other versions
JPH012391A (en
Inventor
Yukio Maeda
Keiji Saeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62-158239A priority Critical patent/JPH012391A/en
Priority claimed from JP62-158239A external-priority patent/JPH012391A/en
Publication of JPS642391A publication Critical patent/JPS642391A/en
Publication of JPH012391A publication Critical patent/JPH012391A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

PURPOSE:To draw a fixed thick-film circuit pattern at all times by previously measuring displacement to a reference plane of a substrate along a path to be drawn on the substrate and controlling a nozzle so that a space between the substrate and the nozzle is kept constant on the basis of the result of the measurement. CONSTITUTION:When a think-film circuit pattern 8 is formed onto a ceramic substrate, a ceramic substrate 4a is positioned and sucked under a vacuum onto a first substrate stage 3a first, and an X-Y table 2 is NC-controlled and displacement to a reference plane of a position to be pattern-drawn is measured while laser beams 9 from a laser type gap measuring instrument 5 are moved along a virtual pattern 10. The displacement of face reference points 7a-7c is measured previously by the measuring instrument 5 at that time, and a plane passing through the three points is used as the reference plane and the displacement of the virtual pattern 10 is indexed. The beforehand measured substrate 4a is shifted to a second stage and positioned and sucked at the same reference position, and Z-axis adjustment and drawing are started so that a gap between a nozzle 6 and the substrate 4b is kept constant on the basis of the result of the measurement of the pattern 10.
JP62-158239A 1987-06-25 Thick film circuit pattern formation method Pending JPH012391A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62-158239A JPH012391A (en) 1987-06-25 Thick film circuit pattern formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62-158239A JPH012391A (en) 1987-06-25 Thick film circuit pattern formation method

Publications (2)

Publication Number Publication Date
JPS642391A true JPS642391A (en) 1989-01-06
JPH012391A JPH012391A (en) 1989-01-06

Family

ID=

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101829847A (en) * 2010-05-28 2010-09-15 北京工业大学 Light path adjusting bracket of excimer laser micromachining system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101829847A (en) * 2010-05-28 2010-09-15 北京工业大学 Light path adjusting bracket of excimer laser micromachining system

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