JPS57143837A - Positioning of bonder - Google Patents

Positioning of bonder

Info

Publication number
JPS57143837A
JPS57143837A JP2903881A JP2903881A JPS57143837A JP S57143837 A JPS57143837 A JP S57143837A JP 2903881 A JP2903881 A JP 2903881A JP 2903881 A JP2903881 A JP 2903881A JP S57143837 A JPS57143837 A JP S57143837A
Authority
JP
Japan
Prior art keywords
chip
circuit board
prism
mirror
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2903881A
Other languages
Japanese (ja)
Other versions
JPS6226177B2 (en
Inventor
Etsuji Minami
Hirotaka Toki
Hiroyuki Ikenaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2903881A priority Critical patent/JPS57143837A/en
Publication of JPS57143837A publication Critical patent/JPS57143837A/en
Publication of JPS6226177B2 publication Critical patent/JPS6226177B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

PURPOSE:To adjust the position irrespective of the material of a circuit board and with high accuracy and high workability by providing a beam-splitter type prism which has a semi- transparent mirror and a mirror between an electronic circuit component and the circuit board. CONSTITUTION:A certain distance is provided between an integrated circuit chip 1 and a circuit board 2 and a cuvic-shape beam-splitter type prism 7 is provided to the space between them. One surface alphabeta of the prism 7 is a mirror and a diagonal surface alphagamma is a semi-transparent mirror. The image of point A of the IC chip 1 and the image of point A' of the circuit board 2 are simultaneously introduced into a TV camera 6 through this prism 7 and are picked up. An operator moves the chip 1 or the board 2 to adjust the position by observing bonding pads of the IC chip and wiring pattern on the board 2 which are displayed on the screen of a TV monitor.
JP2903881A 1981-02-27 1981-02-27 Positioning of bonder Granted JPS57143837A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2903881A JPS57143837A (en) 1981-02-27 1981-02-27 Positioning of bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2903881A JPS57143837A (en) 1981-02-27 1981-02-27 Positioning of bonder

Publications (2)

Publication Number Publication Date
JPS57143837A true JPS57143837A (en) 1982-09-06
JPS6226177B2 JPS6226177B2 (en) 1987-06-08

Family

ID=12265225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2903881A Granted JPS57143837A (en) 1981-02-27 1981-02-27 Positioning of bonder

Country Status (1)

Country Link
JP (1) JPS57143837A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182718A (en) * 1982-04-20 1983-10-25 Datsuku Eng Kk Positioning device
JPS59218516A (en) * 1983-05-25 1984-12-08 Nichiden Mach Ltd Positioning device having coaxial direct illuminator
JPH0260033A (en) * 1988-08-24 1990-02-28 Hitachi Ltd Magnet device for color cathode-ray tube
JPH0260030A (en) * 1988-08-24 1990-02-28 Hitachi Ltd Magnet device for color cathode-ray tube
JPH0260034A (en) * 1988-08-24 1990-02-28 Hitachi Ltd Color cathode-ray tube with deflection yoke
JPH06232214A (en) * 1993-02-03 1994-08-19 Torai Tec:Kk Flip chip bonding device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53140049U (en) * 1977-04-13 1978-11-06
JPS5552229A (en) * 1978-10-11 1980-04-16 Nec Corp Manufacture of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53140049U (en) * 1977-04-13 1978-11-06
JPS5552229A (en) * 1978-10-11 1980-04-16 Nec Corp Manufacture of semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182718A (en) * 1982-04-20 1983-10-25 Datsuku Eng Kk Positioning device
JPS59218516A (en) * 1983-05-25 1984-12-08 Nichiden Mach Ltd Positioning device having coaxial direct illuminator
JPH0260033A (en) * 1988-08-24 1990-02-28 Hitachi Ltd Magnet device for color cathode-ray tube
JPH0260030A (en) * 1988-08-24 1990-02-28 Hitachi Ltd Magnet device for color cathode-ray tube
JPH0260034A (en) * 1988-08-24 1990-02-28 Hitachi Ltd Color cathode-ray tube with deflection yoke
JPH06232214A (en) * 1993-02-03 1994-08-19 Torai Tec:Kk Flip chip bonding device

Also Published As

Publication number Publication date
JPS6226177B2 (en) 1987-06-08

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