JPS647629A - Input system of coordinate data of wire bonder - Google Patents

Input system of coordinate data of wire bonder

Info

Publication number
JPS647629A
JPS647629A JP16310787A JP16310787A JPS647629A JP S647629 A JPS647629 A JP S647629A JP 16310787 A JP16310787 A JP 16310787A JP 16310787 A JP16310787 A JP 16310787A JP S647629 A JPS647629 A JP S647629A
Authority
JP
Japan
Prior art keywords
coordinate data
input
image
displayed
coordinates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16310787A
Other languages
Japanese (ja)
Inventor
Hiroyuki Hirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP16310787A priority Critical patent/JPS647629A/en
Publication of JPS647629A publication Critical patent/JPS647629A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To input the coordinate data of a pad to be bonded easily and positively by a simple means by photographing a circuit substrate by a TV camera arranged related to the coordinates of an XY table, bringing a light pen into contact at a position to be bonded in an image displayed to a receiver and inputting the coordinate data. CONSTITUTION:A circuit substrate 1 on which an electronic part set onto an XY table 2 is loaded is image-sensed by a TV camera 10 disposed related to the coordinates of the XY table 2, and an image output by the image sensing is displayed onto a receiver 11. A light pen is brought into contact at a position to be bonded in the displayed image, and the coordinate data of a wire bonder 8 are input. Consequently, teaching in which a specified region in the circuit substrate, on which the electronic part is loaded, the coordinates of a plurality of pads on the same surface displayed to the receiver, are not input easily can be conducted, and the coordinate data are input extremely easily. That is, required coordinate data can be input accurately and surely without requiring complicate operation.
JP16310787A 1987-06-30 1987-06-30 Input system of coordinate data of wire bonder Pending JPS647629A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16310787A JPS647629A (en) 1987-06-30 1987-06-30 Input system of coordinate data of wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16310787A JPS647629A (en) 1987-06-30 1987-06-30 Input system of coordinate data of wire bonder

Publications (1)

Publication Number Publication Date
JPS647629A true JPS647629A (en) 1989-01-11

Family

ID=15767301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16310787A Pending JPS647629A (en) 1987-06-30 1987-06-30 Input system of coordinate data of wire bonder

Country Status (1)

Country Link
JP (1) JPS647629A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions
KR100321173B1 (en) * 1999-10-25 2002-03-18 박종섭 Method for estimating and automatically training bonding position of wire bonding device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions
KR100321173B1 (en) * 1999-10-25 2002-03-18 박종섭 Method for estimating and automatically training bonding position of wire bonding device

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