CN101923642A - Image sensing device applicable to plane type housing design - Google Patents
Image sensing device applicable to plane type housing design Download PDFInfo
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- CN101923642A CN101923642A CN2009101459644A CN200910145964A CN101923642A CN 101923642 A CN101923642 A CN 101923642A CN 2009101459644 A CN2009101459644 A CN 2009101459644A CN 200910145964 A CN200910145964 A CN 200910145964A CN 101923642 A CN101923642 A CN 101923642A
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- image sensing
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- type housing
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Abstract
The invention discloses an imaging sensing device applicable to plane type housing design, at least comprising a carrier plate and an image sensing structure, wherein the carrier plate is provided with multiple carrier plate input pads and multiple carrier plate output pads, the carrier plate input pads and the carrier plate output pads are respectively and electrically connected together; the image sensing structure is provided with multiple signal input pads and multiple signal output pads, the signal input pads and the signal output pads are respectively and electrically connected together; the signal output pads are respectively and electrically connected with the carrier plate input pads; the image sensing structure at least comprises an image sensing chip, and the image sensing chip is provided with multiple image sensing units and a processing circuit; the signal input pads and the image sensing units are electrically connected to the processing circuit; the image sensing unit senses the image of an object and outputs multiple sensing signals; and the processing circuit processes the sensing signals into multiple processed signals which are transmitted to the carrier plate output pads by the signal input pads, the signal output pads and the carrier plate input pads. By utilizing the device of the invention, the finger of a user can smoothly slide on the image sensing device, and the whole electronic equipment has a beautiful structure.
Description
Technical field
The present invention relates to a kind of image sensering device, relate in particular to a kind of image sensering device that is applicable to the plane type housing design.
Background technology
Traditional image sensering device is the fingerprint sensing apparatus for example, all is to utilize the mode of routing to encapsulate.Therefore, the exposed face of the packaged product that comes out is not a whole plane.The product of this non-whole plane be attached to such as be on the electronic equipments such as notebook computer, personal digital assistant, mobile phone after, can on electronic equipment, forming concave configuration, can cause product appearance plain.Particularly when fingerprint acquisition apparatus is the slide fingerprint sensing apparatus, user's finger also can't slippage successfully in the concave configuration of this small size, thereby causes contact to be difficult for and cause the shortcoming of sensing poor effect.
Therefore, providing a kind of image sensering device that is applicable to the plane type housing design, is the solution that institute of the present invention desire realizes to reach beautiful appearance and to contact real easily.
Summary of the invention
An object of the present invention is to provide a kind of image sensering device that is applicable to plane type housing design, it can be fixed to electronic equipment easily, and makes this electronic equipment have complete flat surface and effect attractive in appearance and wieldy is arranged.
For reaching above-mentioned purpose, the invention provides a kind of image sensering device that is applicable to the plane type housing design, it comprises a support plate and an image sensing structure at least.Support plate has a plurality of support plate input pads and a plurality of support plate output pad, and these support plate input pads are electrically connected to these support plate output pads respectively.The image sensing structure has a plurality of signal input pads and a plurality of signal output pad.Described these signal input pads are electrically connected to described these signal output pads respectively.Described these signal output pads are electrically connected to described these support plate input pads respectively.The image sensing structure comprises an image sensing wafer at least, and it has a plurality of image sensing elements and a treatment circuit.Described these signal input pads and described these image sensing elements are electrically connected to treatment circuit.The image of described these image sensing element sensing one objects and export a plurality of sensing signals.Treatment circuit is processed into described these sensing signals the signal of a plurality of processing.The described signal that these were handled transfers to described these support plate output pads by described these signal input pads, described these signal output pads and described these support plate input pads.
Aforesaid image sensering device can also comprise a base plate, and it is positioned at the below of support plate, and base plate has a plurality of base plate input pads, and it is electrically connected to described a plurality of support plate output pad respectively.
By this, the entire image sensing apparatus encapsulates product later at last, and its thickness can be greater than 1mm, so can make things convenient for and firmly be installed on the electronic equipment with plane casing.
For the present invention's foregoing can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 shows the synoptic diagram according to the image sensering device of first embodiment of the invention;
Fig. 2 shows the synoptic diagram according to the image sensering device of second embodiment of the invention;
Fig. 3 shows the synoptic diagram according to the image sensering device of third embodiment of the invention;
Fig. 4 shows according to image sensering device of the present invention and is installed in synoptic diagram on the casing of electronic equipment.
Drawing reference numeral
F: the finger 1,1 ', 1 ": image sensering device
10: support plate 10A: front
10B: the back side 12: support plate input pad
14: support plate output pad 20: image sensing structure
20A: upper surface 20B: lower surface
22: signal input pad 24: signal output pad
30: image sensing wafer 30A: upper surface
30B: lower surface 30S: side
32: image sensing element 34: treatment circuit
36: vertical connector 38: chip bonding pads
40: intermediate plate 40A: upper surface
40B: lower surface 40S: side
42: middle weld pad 46: lead
50: base plate 52: the base plate input pad
100: casing 110: opening
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
Fig. 1 shows the synoptic diagram according to the image sensering device of first embodiment of the invention.As shown in Figure 1, the image sensering device 1 of present embodiment is applicable to the plane type housing design, and comprises a support plate 10 and an image sensing structure 20 at least.Image sensering device 1 can be that fingerprint sensing apparatus, stria vascularis road feel are surveyed device or other biological signal sensing device etc.Fingerprint acquisition apparatus can be a kind of slide fingerprint sensing apparatus, and its sensing slides through the lines of the object on it, for example is the fingerprint of finger, the blood vessel lines of finger etc.
In addition, image sensering device 1 can also comprise a base plate 50, is positioned at the below of support plate 10, and base plate 50 has a plurality of base plate input pads 52, and it is electrically connected to described these support plate output pads 14 respectively.
In present embodiment, described these signal input pads 22 are electrically connected to described these signal output pads 24 by many vertical connectors 36 respectively, and described these vertical connectors 36 run through a upper surface 20A and a lower surface 20B of image sensing structure 20.That is these vertical connectors 36 run through a upper surface 30A and a lower surface 30B of image sensing wafer 30.In present embodiment, described sensing wafer is a kind of semiconductor material, particularly silicon (Si) material.
Fig. 2 show image sensering device 1 according to second embodiment of the invention ' synoptic diagram.As shown in Figure 2, present embodiment is similar to first embodiment, and difference is that image sensing structure 20 also comprises an intermediate plate 40, and intermediate plate 40 is located between image sensing wafer 30 and the support plate 10.The material of intermediate plate 40 can be semiconductor or insulating material, is glass material in the present embodiment.
In present embodiment, described these signal input pads 22 are electrically connected to described these signal output pads 24 by many vertical connectors 36, a plurality of chip bonding pads 38, a plurality of middle weld pads 42 and many leads 46 respectively, and described these vertical connectors 36 run through the upper surface 30A and the lower surface 30B of image sensing wafer 30, and described these leads 46 are arranged between image sensing wafer 30 and the intermediate plate 40, and extend to a lower surface 40B of intermediate plate 40 along a side 40S of intermediate plate 40.In present embodiment, described these lead 46 parts are located on the upper surface 40A of intermediate plate 40, and side 40S is an inclined-plane.Support plate 10, image sensing wafer 30 and intermediate plate 40 have area identical in fact.This area is the area perpendicular to the plane that stacks direction of support plate 10 and image sensing structure 20.
In another example, chip bonding pads 38 can not exist with middle weld pad 42.In in the case, the top (horizontal component) of the lead 46 between image sensing wafer 30 and intermediate plate 40 is to utilize plated film and photoetching technique (photolithography) and be formed on the back side 30B of image sensing wafer 30, and is electrically connected with vertical connector 36.Therefore, signal input pad 22 is electrically connected to signal output pad 24 by vertical connector 36 and many leads 46 respectively, and vertical connector 36 runs through the upper surface 30A and the lower surface 30B of image sensing wafer 30.
Perhaps, chip bonding pads 38 can be integrated when welding with middle weld pad 42.Perhaps, chip bonding pads 38 can be integrated with vertical connector 36 or lead 46 when welding with middle weld pad 42.Therefore, described these signal input pads 22 can be electrically connected to described these signal output pads 24 by many vertical connectors 36 and many leads 46 respectively.
In addition, the image sensering device 1 of second embodiment ' can also also comprise a base plate 50 is positioned at side under the support plate 10, and base plate 50 has a plurality of base plate input pads 52, and it is electrically connected to described these support plate output pads 14 respectively.
Fig. 3 shows the image sensering device 1 according to third embodiment of the invention " synoptic diagram.As shown in Figure 3, present embodiment is similar to second embodiment, and difference is that described these signal input pads 22 are electrically connected to described these signal output pads 24 by many leads 46 respectively.Described these leads 46 are from the upper surface 30A of image sensing wafer 30, extend to a lower surface 40B of intermediate plate 40 along a side 40S of side 30S of image sensing wafer 30 and intermediate plate 40.Therefore, the side 40S of intermediate plate 40 and the side 30S of image sensing wafer 30 are the inclined-plane, and can be arranged on the same plane.In addition, support plate 10, image sensing wafer 30 and intermediate plate 40 have area identical in fact.Similarly, " can also comprise a base plate 50, be positioned at the below of support plate 10, base plate 50 has a plurality of base plate input pads 52 to image sensering device 1, and it is electrically connected to described these support plate output pads 14 respectively.
Fig. 4 shows according to image sensering device 1 of the present invention and is installed in synoptic diagram on the casing 100 of electronic equipment.As shown in Figure 4, the thickness of support plate 10 and image sensing structure 20 can roughly equal the thickness of casing 100.The area of support plate 10 and image sensing structure 20 equals the area of the opening 110 of casing 100 in fact.Thus, base plate 50 can be smooth in the inside surface of casing 100, and can firmly be fixed on casing 100, and make the exposed surface that contacts with finger F of whole casing 100 and image sensering device 1 present whole plane structure.
By this, the entire image sensing apparatus encapsulates product later at last, and its thickness can be greater than 1mm, so can make things convenient for and firmly be installed on the electronic equipment with plane casing.Thus, the user can successfully slide, and it is pointed on image sensering device, and whole electric equipment can have structure attractive in appearance.
The specific embodiment that is proposed in the detailed description of preferred embodiment is only in order to convenient explanation technology contents of the present invention, but not with narrow sense of the present invention be limited to the foregoing description, in the situation that does not exceed spirit of the present invention and claims scope, the many variations of being done is implemented, and all belongs to scope of the present invention.
Claims (16)
1. image sensering device that is applicable to plane type housing design comprises at least:
One support plate, it has a plurality of support plate input pads and a plurality of support plate output pad, and described a plurality of support plate input pads are electrically connected to described a plurality of support plate output pad respectively; And
One image sensing structure, it has a plurality of signal input pads and a plurality of signal output pad, described a plurality of signal input pad is electrically connected to described a plurality of signal output pad respectively, described a plurality of signal output pad is electrically connected to described a plurality of support plate input pad respectively, described image sensing structure comprises an image sensing wafer at least, it has a plurality of image sensing elements and a treatment circuit, described a plurality of signal input pad and described a plurality of image sensing element are electrically connected to described treatment circuit, the image of described a plurality of image sensing element sensing one objects and export a plurality of sensing signals, described treatment circuit is processed into the signal of a plurality of processing with described a plurality of sensing signals, and the signal of described a plurality of processing is by described a plurality of signal input pads, described a plurality of signal output pad and described a plurality of support plate input pad and transfer to described a plurality of support plate output pad.
2. the image sensering device that is applicable to the plane type housing design as claimed in claim 1 also comprises:
One base plate is positioned at the below of described support plate, and described base plate has a plurality of base plate input pads, and it is electrically connected to described a plurality of support plate output pad respectively.
3. the image sensering device that is applicable to the plane type housing design as claimed in claim 1, wherein said a plurality of signal input pad is electrically connected to described a plurality of signal output pad by many vertical connectors respectively, and described a plurality of vertical connector runs through a upper surface and a lower surface of described image sensing structure.
4. the image sensering device that is applicable to the plane type housing design as claimed in claim 1, wherein said image sensing structure also comprises an intermediate plate, and described intermediate plate is located between described image sensing wafer and the described support plate.
5. the image sensering device that is applicable to the plane type housing design as claimed in claim 4, wherein said a plurality of signal input pad is electrically connected to described a plurality of signal output pad by many vertical connectors, a plurality of chip bonding pads, a plurality of middle weld pads and many leads respectively, and described a plurality of vertical connector runs through a upper surface and a lower surface of described image sensing wafer, and described a plurality of lead is arranged between image sensing wafer and the intermediate plate, and extends to a lower surface of described intermediate plate along a side of described intermediate plate.
6. the image sensering device that is applicable to the plane type housing design as claimed in claim 4, wherein said a plurality of signal input pad is electrically connected to described a plurality of signal output pad by many vertical connectors and many leads respectively, and described a plurality of vertical connector runs through a upper surface and a lower surface of described image sensing wafer, and described a plurality of lead is arranged between image sensing wafer and the intermediate plate, and extends to a lower surface of described intermediate plate along a side of described intermediate plate.
7. the image sensering device that is applicable to the plane type housing design as claimed in claim 6, wherein said side is an inclined-plane.
8. the image sensering device that is applicable to the plane type housing design as claimed in claim 6, wherein said support plate, described image sensing wafer and described intermediate plate have area identical.
9. the image sensering device that is applicable to the plane type housing design as claimed in claim 6 also comprises:
One base plate is positioned at the below of described support plate, and described base plate has a plurality of base plate input pads, and it is electrically connected to described a plurality of support plate output pad respectively.
10. the image sensering device that is applicable to the plane type housing design as claimed in claim 4, wherein said a plurality of signal input pad is electrically connected to described a plurality of signal output pad by many leads respectively, described a plurality of lead is from a upper surface of described image sensing wafer, along a side of described image sensing wafer and a side of described intermediate plate extend to a lower surface of described intermediate plate.
11. the image sensering device that is applicable to the plane type housing design as claimed in claim 10, the described side of wherein said intermediate plate and the described side of described image sensing wafer are the inclined-plane.
12. the image sensering device that is applicable to the plane type housing design as claimed in claim 10, wherein said support plate, described image sensing wafer and described intermediate plate have area identical.
13. the image sensering device that is applicable to the plane type housing design as claimed in claim 10 also comprises:
One base plate is positioned at the below of described support plate, and described base plate has a plurality of base plate input pads, and it is electrically connected to described a plurality of support plate output pad respectively.
14. the image sensering device that is applicable to the plane type housing design as claimed in claim 4, the material of wherein said intermediate plate comprises glass.
15. the image sensering device that is applicable to the plane type housing design as claimed in claim 1, wherein said support plate is the printed circuit board (PCB) with multiple layer metal layer.
16. the image sensering device that is applicable to the plane type housing design as claimed in claim 1, it is a kind of slide fingerprint sensing apparatus, and its sensing slides through the fingerprint of the described object that belongs to a finger on it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101459644A CN101923642A (en) | 2009-06-15 | 2009-06-15 | Image sensing device applicable to plane type housing design |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101459644A CN101923642A (en) | 2009-06-15 | 2009-06-15 | Image sensing device applicable to plane type housing design |
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| Publication Number | Publication Date |
|---|---|
| CN101923642A true CN101923642A (en) | 2010-12-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101459644A Pending CN101923642A (en) | 2009-06-15 | 2009-06-15 | Image sensing device applicable to plane type housing design |
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| Country | Link |
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| CN (1) | CN101923642A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105989356A (en) * | 2015-03-20 | 2016-10-05 | 茂丞科技股份有限公司 | Suspension capacitance type fingerprint sensor and manufacturing method thereof |
-
2009
- 2009-06-15 CN CN2009101459644A patent/CN101923642A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105989356A (en) * | 2015-03-20 | 2016-10-05 | 茂丞科技股份有限公司 | Suspension capacitance type fingerprint sensor and manufacturing method thereof |
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Application publication date: 20101222 |