CN102469687B - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN102469687B CN102469687B CN201010542664.2A CN201010542664A CN102469687B CN 102469687 B CN102469687 B CN 102469687B CN 201010542664 A CN201010542664 A CN 201010542664A CN 102469687 B CN102469687 B CN 102469687B
- Authority
- CN
- China
- Prior art keywords
- electrical contact
- processing unit
- electrically connected
- circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Abstract
The invention relates to a circuit board which comprises a first circuit area, a first processing unit and a conductive pattern, wherein the first circuit area is provided with a plurality of first electric connecting points; the first processing unit is provided with a spherical array packaged substrate, is arranged in the first circuit area and is electrically connected with the first electric connecting points; the spherical array packaged substrate is provided with a plurality of welded tin spheres and a bypass circuit; and the conductive pattern is electrically connected with the first electric connecting points. In the circuit board provided by the invention, the first circuit area is served as a reserved area, and the corresponding first processing unit is arranged in the first circuit area according to the consideration for the design and the requirement for the products, so that a sharing effect is achieved, a manufacturing process is simplified and the quality for transmitting a signal is increased.
Description
Technical field
The present invention is about a kind of circuit board.
Background technology
Along with scientific and technological development, electronic product supplier is there's no one who doesn't or isn't to develop omnibearing a series of product, to meet the user demand that client is different.Wherein, in order to separate different consumption markets, in the electronic product of high-order by increasing the signal process chip of high-order, so that consumer to be provided better result of use.
For different products, generally speaking, supplier uses different circuit board, and to design respectively the machine of high-order and common machine, but this kind of practice not only wasted development resources, also exists assembly to get the raw materials ready and the problem of stock control.To this, there is dealer to propose the another kind of practice, it is the daughter board that designs in addition high-order signal process chip for the machine of high-order, then sees through board to board connector connection daughter board and circuit board, shares and reach circuit board.But, in the time that high-precision board to board connector is set, will easily produce the pollution of scaling powder, cause loose contact and make the transmission that signal between daughter board and circuit board cannot be correct.
Therefore, how to provide a kind of circuit board, can reach shared effect, simplify processing procedure simultaneously, and promote signal transmit time quality, become one of important topic.
Summary of the invention
The object of this invention is to provide and a kind ofly can reach shared effect, simplify processing procedure simultaneously, and the circuit board of quality when promoting signal and transmitting.
The present invention can realize by the following technical solutions.
A kind of circuit board of the present invention, comprises one first circuit region, one first processing unit and a conductive pattern.The first circuit region has multiple the first electrical contacts.The first processing unit has a ball array base plate for packaging, and is arranged on the first circuit region, and is electrically connected with described the first electrical contact.Ball array base plate for packaging has multiple welding tin balls and a bypass resistance.Conductive pattern and described the first electrical contact are electrically connected.
In one embodiment of the invention, circuit board also comprises a second circuit district and one second processing unit.Second circuit district has multiple the second electrical contacts, and wherein said the second electrical contact and described the first electrical contact are electrically connected.The second processing unit is arranged on second circuit district, and is electrically connected with described the second electrical contact.
In one embodiment of the invention, circuit board also comprises a linkage unit, is electrically connected with conductive pattern.
In addition, a kind of circuit board of the present invention, comprises one first circuit region, one first processing unit and a conductive pattern.The first circuit region has multiple the first electrical contacts.The first processing unit has a ball array base plate for packaging, and is arranged on the first circuit region, and is electrically connected with described the first electrical contact.Ball array base plate for packaging has multiple welding tin balls and a signal processing components.Conductive pattern and described the first electrical contact are electrically connected.
In one embodiment of the invention, circuit board also comprises a second circuit district and one second processing unit.Second circuit district has multiple the second electrical contacts, and wherein said the second electrical contact and described the first electrical contact are electrically connected.The second processing unit is arranged on second circuit district, and is electrically connected with described the second electrical contact.
In one embodiment of the invention, the quantity of the described welding tin ball of ball array base plate for packaging is less than the quantity of described first electrical contact of the first circuit region.
In one embodiment of the invention, circuit board also comprises a linkage unit, is electrically connected with conductive pattern.
By technique scheme, circuit board of the present invention at least has following advantages:
Because passing through the first circuit region as a reserved area according to a kind of circuit board of the present invention, and according to the consideration of design and the demand of product, at the first circuit region, the first corresponding processing unit is set.Thereby realize can reach shared effect, simplify processing procedure simultaneously, and promote signal transmit time quality.
Accompanying drawing explanation
Fig. 1 is a kind of circuit board according to the preferred embodiment of the present invention;
Fig. 2 is a kind of circuit board according to the preferred embodiment of the present invention;
Fig. 3 is a kind of circuit board according to the preferred embodiment of the present invention; And
Fig. 4 is a kind of circuit board according to the preferred embodiment of the present invention.
Main element symbol description:
1,2,3,4: circuit board
11,31: the first circuit regions
111,311: the first electrical contacts
12,32: the first processing units
121,321: ball array base plate for packaging
13,33: conductive pattern
21,41: second circuit district
211,411: the second electrical contacts
22,42: the second processing units
23,43: linkage unit
C1: bypass resistance
C2: signal processing components
S: welding tin ball
Embodiment
Hereinafter with reference to correlative type, a kind of circuit board according to the preferred embodiment of the present invention is described, wherein identical element is illustrated the reference element symbol with identical.
Please refer to shown in Fig. 1, it is a kind of circuit board 1 of the preferred embodiment of the present invention.Circuit board 1 comprises one first circuit region 11, the first processing unit 12 and a conductive pattern 13.Circuit board 1 is installed in an electronic installation.Wherein, the electronic installation of indication herein, for example, be computer system, audio-visual playback equipment, portable electronic product or checkout equipment.The present invention is the range of application of limiting circuit plate 1 not.In addition, on the implementation, circuit board 1 can be selected according to demand a single sided board, a double sided board or a multi-layer sheet.
The first 11 of circuit regions are on a surface of circuit board 1, and have multiple the first electrical contacts 111.On the implementation, the first electrical contact 111 is a solder bump.The first processing unit 12 has ball array encapsulation (ball grid array, a BGA) substrate 121.Wherein, a surface of ball array base plate for packaging 121 arranges the welding tin ball S of ball array, and the specification of welding tin ball S and size and the first electrical contact 111 arrange in pairs or groups mutually, and another surface of ball array base plate for packaging 121 arranges a bypass resistance C1.The first processing unit 12 is arranged on the first circuit region 11, and is electrically connected through welding tin ball S and first electrical contact 111 of ball array base plate for packaging 121.The first electrical contact 111 of conductive pattern 13 and the first circuit region 11 is electrically connected.
Then, please refer to shown in Fig. 2, it is a kind of circuit board 2 of the preferred embodiment of the present invention.Circuit board 2 is with the difference of circuit board 1, and circuit board 2 also has a second circuit district 21, one second processing unit 22 and a linkage unit 23.
In the present embodiment, second circuit district 21 has multiple the second electrical contacts 211, and the first electrical contact 111 of the second electrical contact 211 and the first circuit region 11 is electrically connected.The second processing unit 22 is arranged on second circuit district 21, and is electrically connected with the second electrical contact 211.Wherein, the second processing unit 22 is a video signal processor.
In practice, when circuit board 1 or circuit board 2 are during as the mainboard of the electronic installation of a common machine, the first circuit region 11 arranges the first processing unit 12, and sees through the bypass resistance of the first processing unit 12, directly transmitting signals is to remaining assembly, to carry out follow-up processing.When circuit board 1 or circuit board 2 are during as the mainboard of the electronic installation of a high-order machine, the first 11 of circuit regions arrange a high-order processing unit, so that better treatment efficiency to be provided.
By above-mentioned hardware structure, the present invention can, by the first circuit region is set, with bypass resistance or the various processing unit of arranging in pairs or groups, and then reaches circuit board and share.In addition,, because the present invention adopts BGA solder technology to connect processing unit and circuit board, therefore, can promote the quality that signal transmits.
Then, please refer to shown in Fig. 3 its a kind of circuit board 3 that is the preferred embodiment of the present invention.Circuit board 3 comprises one first circuit region 31, one first processing unit 32 and a conductive pattern 33.The first 31 of circuit regions are on a surface of circuit board 3, and have multiple the first electrical contacts 311.On the implementation, the first electrical contact 311 is a solder bump.
The first processing unit 32 has a ball array base plate for packaging 321.Wherein, a surface of ball array base plate for packaging 321 arranges the welding tin ball S of ball array, and another surface arranges a signal processing components C2.The first processing unit 32 is arranged on the first circuit region 31, and is electrically connected through welding tin ball S and first electrical contact 311 of ball array base plate for packaging 321.The first electrical contact 311 of conductive pattern 33 and the first circuit region 31 is electrically connected.
On the implementation, due to the degree of support difference of specific function, thereby signal processing unit has multiple different size or encapsulation.In order to reach the shared demand of circuit board, the first circuit region 31 of circuit board 3, using the pin position of larger-size processing unit as benchmark, carries out the configuration of the first electrical contact 311.Therefore, the ball array base plate for packaging 321 of the first processing unit 32 can be according to the first electrical contact 311, design corresponding welding tin ball S and wiring, and then make can arrange on ball array base plate for packaging 321 the signal processing components C2 of multiple different specification size.
In the present embodiment, the first processing unit 32 is assemblies that a size is less than the first circuit region 31, and the quantity of the welding tin ball S of ball array base plate for packaging 321 is less than the quantity of the first electrical contact 311 of the first circuit region 31.By aforesaid hardware structure, the present invention can pass through the setting of the first circuit region, the first processing unit 32 of the multiple different specification size of arranging in pairs or groups, and then reach circuit board and share.
Then, please refer to shown in Fig. 4, it is a kind of circuit board 4 of the preferred embodiment of the present invention.Circuit board 4 is with the difference of circuit board 3, and circuit board 4 also has a second circuit district 41, one second processing unit 42 and a linkage unit 43.
In the present embodiment, second circuit district 41 has multiple the second electrical contacts 411, and the first electrical contact 311 of the second electrical contact 411 and the first circuit region 31
Be electrically connected.The second processing unit 42 is arranged on second circuit district 41, and is electrically connected with the second electrical contact 411.
Linkage unit 43 is electrically connected with conductive pattern 33.On the implementation, linkage unit 43 is an edge and connector (edge card connector), a golden finger connecting interface (golden finger connectinginterface), a board to board connector (board-to-board connector) or a flexible flat cable (flexible flat cable) connector.
In sum, because of according to a kind of circuit board of the present invention, as a reserved area, and according to the consideration of design and the demand of product, at the first circuit region, the first corresponding processing unit is set by the first circuit region.Thereby realize can reach shared effect, simplify processing procedure simultaneously, and promote signal transmit time quality.
The above is only illustrative, and non-limiting.Anyly do not depart from spirit of the present invention and category, and equivalent modifications or change that it is carried out all should be included in claim limited range.
Claims (6)
1. a circuit board, is characterized in that, comprising:
One first circuit region, has multiple the first electrical contacts;
One first processing unit, has a ball array base plate for packaging, and is arranged on described the first circuit region, and is electrically connected with described the first electrical contact;
One conductive pattern, is electrically connected with described the first electrical contact;
One second circuit district, has multiple the second electrical contacts, and described the second electrical contact and described the first electrical contact are electrically connected; And
One second processing unit, is arranged on described second circuit district, and is electrically connected with described the second electrical contact,
Wherein said ball array base plate for packaging has multiple welding tin balls and a bypass resistance, described the second processing unit is electrically connected to the described bypass resistance of described the first processing unit via described the second electrical contact and described the first electrical contact, and a signal from described the second processing unit transmits by described bypass resistance.
2. a circuit board, is characterized in that, comprising:
One first circuit region, has multiple the first electrical contacts;
One first processing unit, has a ball array base plate for packaging, and is arranged on described the first circuit region, and is electrically connected with described the first electrical contact;
One conductive pattern, is electrically connected with described the first electrical contact;
One second circuit district, has multiple the second electrical contacts, and described the second electrical contact and described the first electrical contact are electrically connected; And
One second processing unit, is arranged on described second circuit district, and is electrically connected with described the second electrical contact,
Wherein said ball array base plate for packaging has multiple welding tin balls and a signal processing components, described the second processing unit is electrically connected to described signal processing components via described the second electrical contact and described the first electrical contact, and described signal processing components and described the second processing unit are connected to each other.
3. circuit board according to claim 2, is characterized in that, the quantity of the described welding tin ball of wherein said ball array base plate for packaging is less than the quantity of described first electrical contact of described the first circuit region.
4. circuit board according to claim 1, is characterized in that, wherein said the second processing unit is a video signal processor.
5. circuit board according to claim 1 and 2, is characterized in that, also comprises:
One linkage unit, is electrically connected with described conductive pattern.
6. circuit board according to claim 5, is characterized in that, wherein said linkage unit is an edge and connector, a golden finger connecting interface, a board to board connector or a flexible flat cable connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010542664.2A CN102469687B (en) | 2010-11-12 | 2010-11-12 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010542664.2A CN102469687B (en) | 2010-11-12 | 2010-11-12 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102469687A CN102469687A (en) | 2012-05-23 |
| CN102469687B true CN102469687B (en) | 2014-06-18 |
Family
ID=46072648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010542664.2A Expired - Fee Related CN102469687B (en) | 2010-11-12 | 2010-11-12 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102469687B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108227859B (en) * | 2018-01-03 | 2022-03-25 | 联想(北京)有限公司 | Servo mainboard and server |
| CN213846965U (en) * | 2020-10-16 | 2021-07-30 | Oppo广东移动通信有限公司 | Earphone set |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2512114Y (en) * | 2001-10-31 | 2002-09-18 | 威盛电子股份有限公司 | Duplicated piled reversing welding-ball matrix package body |
-
2010
- 2010-11-12 CN CN201010542664.2A patent/CN102469687B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2512114Y (en) * | 2001-10-31 | 2002-09-18 | 威盛电子股份有限公司 | Duplicated piled reversing welding-ball matrix package body |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102469687A (en) | 2012-05-23 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140618 Termination date: 20201112 |