TWM642961U - Adapter device for converting OSM module standard to COMe module standard - Google Patents

Abstract

This creation provides an adapter device for converting the OSM module standard into the COM e (COM Express) module standard, which includes: an adapter board, the adapter board is provided with an adapter board electrical conducting part; an OSM Module, the OSM module is electrically connected to the adapter board, the OSM module includes an OSM module substrate, the OSM module substrate is provided with electronic components of the OSM structure; a COM e operation module The carrier board is provided with an electrical connection portion of the carrier board opposite to the electrical connection portion of the adapter board, the electrical connection portion of the carrier board is used to electrically connect with the electrical connection portion of the adapter board, and the The COM e operation module carrier board and the adapter board have the same standardized module interface; in this way, it can convert the latest standard OSM module to another common COM e standardized module interface requirement in the market to achieve the best Excellent compatible operation, timeliness and economic benefits; and at the same time, it can take advantage of the interface of the OSM module to meet the specifications of power usage, and through the OSM module to quickly update the computing core, and at the same time meet the existing different standardized module markets needs.

Description

Transition device for converting OSM module standard to COM e module standard

This creation is about an embedded module standard, especially a transfer structure using the OSM module standard, providing a transfer structure between standardized module interfaces, making it compatible with previous different module standards.

According to the current computer architecture system module standards, the Embedded Computer Module (COM) technology is commonly used. The Embedded Computer Module is a complete embedded computer built on a single circuit board, centered on a microprocessor and memory, and Provides an industrial row of connectors that allow it to be connected to a carrier board that provides power and I/O connectors to peripherals. Embedded computer modules are usually compactly designed and highly integrated, so that the embedded computer modules can take into account the effective density of the design arrangement and reduce the cost. The embedded computer modules of the existing system module standards include the COM e module standard, and are widely used in automotive entertainment systems, industrial control, logistics management, medical treatment, instrument operation, medical devices, human-machine interface (HMI) and things Smart factories, renewable energy, smart cities, smart transportation, etc. under the Internet of Things (IoT) operation.

In order to further consider the robustness and expansion capabilities of such embedded computer modules, the SGeT Association (Standardization Group for Embedded Technologies) has defined a new system module standard called "Open Standard Module (OSM)", and uses The OSM module standard also has: a solderable system module, and LGA design and surface mount technology to increase robustness.

The OSM module standard enables the industry to begin to produce postage stamp-sized embedded computer modules to replace credit card-sized modules. The main features of the OSM module standard include:

Fully machined during welding, assembly and testing.

Comes in a pre-tinned LGA package that can be soldered directly without a connector.

Pre-defined soft and hard interfaces.

Open source software and hardware.

Furthermore, the OSM module standard has different sizes (zero, S, M, L), and these different appearance specifications can be the basis for mutual development, and these specifications can also allow module manufacturers to adopt different sizes according to requirements. height and can optionally be extended with "PCB Spacers". For example: S-size to L-size modules all provide video interfaces, supporting up to 1x RGB and 4-channel DSI. The M module can additionally support 2 times eDP/eDP++, and the L module can add 2 times the LVDS interface for graphics. Therefore, the maximum configuration can provide up to six video outputs in parallel. All modules from sizes S to L further provide a 4-channel Camera Serial Interface (CSI). L-size modules provide up to 10 PCIe lanes for fast connection to peripheral devices; M-size modules provide 2x PCIe x1, and S-size modules provide 1x PCIe x1. Due to the extremely small footprint, Module Zero does not have any of the I/Os mentioned above, but does provide all the interfaces listed in the OSM Module Standard Adapter Specification, which deploys up to 5x Ethernet for communication between systems road. All modules have a dedicated communication area, providing 18 pins for antenna signals of different wireless technologies and 19 pins for manufacturer-specific signals.

In response to the advantages of the miniaturized module structure of the OSM module standard, the preparation of individual module inventory and the selection of computing units, which were complicated in the past, can be replaced quickly through OSM modules, and meet the market demand of the original COM e . And because the OSM module standard is not compatible with the COM e module standard, resulting in the inability to be compatible with the connection operation process in time or the lack of economic benefits, it is necessary to make a research and development breakthrough.

Therefore, in view of the unsatisfactory fact that the OSM module standard is not compatible with the common modular module standard in the general market, the author started to develop and conceive its solution, hoping to develop an OSM module standard Converting to the adapter device of the COM e module standard to promote the development of this industry, and after a long time of conception, this creation came into being.

The purpose of this creation is to provide the latest standard OSM module, which can be converted to another common COM e standardized module interface requirement in the market, so as to achieve the best compatible operation timeliness and economics economic beneficiaries.

Another purpose of this creation is to provide users who can use the advantages of the interface of the OSM module, design to meet the specifications of power usage, and quickly update the computing core through the OSM module, and at the same time meet the needs of the original different standardized module markets .

In order to achieve the above purpose, the technical means adopted in this work include: an adapter board, which is provided with an electrical connection part of the adapter board; an OSM module, which is electrically connected to the On the adapter board, the OSM module includes an OSM substrate, on which the electronic components of the OSM structure are arranged; a COM e operation module carrier board, which is provided with an electrical connection relative to the adapter board The electrical connection part of the carrier board, the electrical connection part of the carrier board is used to electrically connect with the electrical connection part of the adapter board, and the COM e operation module carrier board and the adapter board have the same Standardized module interface.

In this embodiment, the COM e operating module carrier board is a COM e standardized module interface carrier board (circuit board).

In this embodiment, the OSM module substrate has a substrate surface and a substrate bottom surface, the bottom surface of the substrate is provided with a plurality of electrical contacts/slots, and the adapter board is provided with a plurality of electrical contacts corresponding to the bottom surface of the substrate. sockets/contacts.

In this embodiment, the electrical connection portion of the carrier board and the electrical connection portion of the adapter board are golden fingers and board-to-board connectors.

In this embodiment, the electronic components of the COM e module are arranged on the carrier board of the COM e operation module.

In order to enable your review committee to have a better understanding and understanding of the technology, method characteristics and achieved effects of this creation, I would like to provide a better embodiment diagram and a detailed description, as follows:

10: OSM module

20: Adapter board

30: COM e operation module carrier board

11: OSM module substrate

111: substrate surface

110: Substrate bottom surface

12: Electrical contacts (or slots)

121, 122, 123: module setting area

13: The first type of embedded module components

14: The second type of embedded module components

15: The third type of embedded module components

21: Adapter board electrical connection part

31: Carrier board electrical connection part

Figure 1 is a schematic diagram of the bottom surface of the substrate of this creation.

Figure 2 is a schematic diagram of this creation.

The diagrams disclosed in this creation are the preferred embodiments of the conversion device for converting the OSM module standard to the COM e module standard in this creation. These diagrams are all schematic diagrams for the convenience of description, and they are only explained in a schematic way The basic structure of this creation, and the composition drawing shown is not limited to the same shape and size ratio as the actual implementation, and the shape and size ratio of the actual implementation is a selective design.

Please refer to Fig. 1, 2, in order to explain the embodiment of the switch device that this creation a kind of OSM module standard is converted into COM e module standard, as shown in the figure, present embodiment comprises an OSM module 10, switch Board 20 and COM e operation module carrier board 30.

The OSM module 10 includes an OSM module substrate 11, the OSM module substrate (circuit board) 11 has a substrate surface 111 and a substrate bottom surface 110, the substrate surface 111 is provided with relevant electronic components of the relevant OSM architecture, such as a CPU /MPU, storage or other electronic components, etc., the bottom surface 110 of the substrate is provided with a plurality of electrical contacts (or slots) 12, and the plurality of electrical contacts 12 are formed with module installation areas 121, 122, 123, the The module setting areas 121, 122, 123 can form embedded module components of different sizes. The type module element 13 has a size type module with a length B (such as 30mm) and a width B (such as 30mm); the module setting area 121, 122 can be provided with a moderately rectangular second-type embedded module element 14, the The second type of embedded module element 14 has a size type module with a length A (such as 45mm) and a width B (such as 30mm); Type module element 15, this third type embedded module element 15 has the size type module of length A (such as 45mm) and width A (such as 45mm). The first type embedded module component 13 , the second type embedded module component 14 and the third type embedded module component 15 are electronic component modules standardized by OSM.

The adapter plate 20 is used to install the OSM module 10, that is, the OSM module 10 is electrically connected to the adapter plate 20, and the adapter plate 20 is a COM e module standard adapter Board/circuit board, the adapter board 20 and the COM e operation module carrier board 30 have the same standardized module interface Surface; the plurality of electrical contact points (or contact slots) 12 of the adapter board 20 opposite to the bottom surface 110 of the substrate are provided with a plurality of electrical contact slots (or contact points; not shown) corresponding to conduction. Furthermore, one side of the adapter board 20 is provided with an adapter board electrical connection part 21, and the electrical connection part 21 can be a golden finger, a board-to-board connector or other electrical connection elements, Not limited.

The COM e operation module carrier board 30 is a carrier board (circuit board) of a COM e standardized module interface. The COM e operation module carrier board 30 is provided with relevant COM e electronic components. The COM e operation One side of the module carrier board 30 is provided with a carrier board electrical connection part 31 opposite to the transfer board electrical connection part 21 of the adapter board 20, and the carrier board electrical connection part 31 can be a golden finger. , board-to-board connector or other electrical conduction elements (not limited), the electrical conduction portion 31 of the carrier board is used to conduct electrical conduction with the electrical conduction portion 21 of the adapter board, so that the OSM The module 10 can be compatible with the standardized module interface of the COM e operating module carrier board 30 through the transfer of the adapter board 20 .

In the aforementioned configuration, the COM e operating module carrier board 30 can be a COM e standardized module carrier board (circuit board). The location of the adapter board electrical connection portion 21 on the adapter board 20 and the carrier board electrical connection portion 31 on the COM e operation module carrier board 30 are not limited.

The adapter device for converting the OSM module standard to the COM e module standard in this creation can make the latest standard OSM module convert to the COM e interface requirements of different standardized modules common in the market, so as to meet the requirements of the COM e interface. The best compatible operation timeliness and economic benefits; at the same time, this creation can take advantage of the interface of the OSM module to meet the 230 pins of the COM e module to meet the power usage specifications, and quickly through the OSM module Computing cores are updated, and at the same time meet the needs of the original different standardized module markets.

To sum up, this creation is indeed a very excellent creative idea, and I have filed a patent application for the creation according to law; but the content of the above description is only a better embodiment of this creation, and all the technical means of this creation are extended Changes should fall within the scope of the patent application for this creation.

10: OSM module

11: OSM module substrate

20: Adapter board

21: Adapter board electrical connection part

30: COM e operation module carrier board

31: Carrier board electrical connection part

Claims (4)

An OSM module standard is converted into a COM e module standard conversion device, which includes: an adapter board, the adapter board is a COM e standardized module interface circuit board, and the adapter board is provided with a switch Connecting board electrical connection part; an OSM module, the OSM module is electrically connected to the adapter board, the OSM module includes an OSM module substrate, and the OSM module substrate is provided with an OSM framework Electronic components; a COM e operation module carrier board, which is a carrier board (circuit board) of a COM e standardized module interface, which is provided with an electrical conductor of the carrier board opposite to the electrical conductor part of the adapter board Connecting portion, the electrical conducting portion of the carrier board is used to electrically connect with the electrical conducting portion of the adapter board, and the COM e operation module carrier board and the adapter board have the same standardized module interface. If the OSM module standard in item 1 of the patent application is converted to the COM e module standard, the OSM module substrate has a substrate surface and a substrate bottom surface, and the substrate bottom surface is provided with a plurality of electrical contacts/connections slots, and the adapter board is provided with a plurality of electrical slots/contacts corresponding to the bottom surface of the substrate. If the OSM module standard in item 2 of the scope of the patent application is converted to the COM e module standard, the electrical connection part of the carrier board and the electrical connection part of the adapter board are golden fingers, board-to-board Connector. For example, an adapter device for converting the OSM module standard into the COM e module standard in item 1 of the scope of the patent application, wherein the COM e operation module carrier board is equipped with the electronic components of the COM e module.

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