CN213068951U - Radio frequency chip control panel and radio frequency chip test system - Google Patents
Radio frequency chip control panel and radio frequency chip test system Download PDFInfo
- Publication number
- CN213068951U CN213068951U CN202022020289.7U CN202022020289U CN213068951U CN 213068951 U CN213068951 U CN 213068951U CN 202022020289 U CN202022020289 U CN 202022020289U CN 213068951 U CN213068951 U CN 213068951U
- Authority
- CN
- China
- Prior art keywords
- chip
- radio frequency
- control
- frequency chip
- control board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The embodiment of the utility model provides a radio frequency chip control panel and radio frequency chip test system relates to test technical field. The embodiment of the utility model provides a radio frequency chip control panel and radio frequency chip test system, including control chip, double socket and control panel body, wherein, double socket and control chip set up on the control panel body, and double socket integration has radio frequency chip's pin and control chip's pin, and control chip is connected with radio frequency chip through double socket to test radio frequency chip. According to the arrangement, the radio frequency chip can be tested through the radio frequency chip control board, the process is simple, and the testing speed and the testing efficiency of the radio frequency chip are improved.
Description
Technical Field
The utility model relates to a test technical field particularly, relates to a radio frequency chip control panel and radio frequency chip test system.
Background
An accurate radio frequency chip index can enable the design of the phased array antenna to be twice with half the effort, and the performance and the index of the manufactured phased array antenna can meet the performance and the index during the design. Because the phased array antenna has a large number of channels, and thus the phased array antenna has a large number of radio frequency chips, the test of the radio frequency chips is very complicated and the workload is huge, and therefore, a test means and a test method capable of testing relevant indexes of the radio frequency chips quickly, efficiently, accurately and reliably are needed.
Currently, when testing a radio frequency chip, most of the radio frequency chips are soldered on a Printed Circuit Board (PCB), and then the PCB is placed on a probe station of the test chip; and the tester leads all the pins of the radio frequency chip and the power supply out of the edge of the PCB, connects the pins of the radio frequency chip with a conversion interface of external test equipment through wires, and connects the pins of the power supply with the external power supply so as to test. However, this method has low reliability, complex process, and low testing efficiency.
SUMMERY OF THE UTILITY MODEL
Based on the research, the utility model provides a radio frequency chip control panel and radio frequency chip test system to improve above-mentioned problem.
The embodiment of the utility model is realized like this:
in a first aspect, an embodiment of the present invention provides a radio frequency chip control panel for testing a radio frequency chip, where the radio frequency chip control panel includes a control chip, a double-row socket, and a control panel body;
the double-row socket and the control chip are arranged on the control panel body;
the double-row socket is integrated with a pin of a radio frequency chip and a pin of the control chip;
the control chip is connected with the radio frequency chip through the double-row socket so as to test the radio frequency chip.
In an optional embodiment, the radio frequency chip control board further includes a power module, and the power module is disposed on the control board body and electrically connected to the control chip;
the power supply module is used for converting the voltage of the power supply and supplying power to the control chip through the converted power supply.
In an optional embodiment, the radio frequency chip control board further includes a power interface; the power interface is arranged on the control panel body and is electrically connected with the power module;
the power interface is used for connecting an external power supply so that the external power supply provides power for the power module through the power interface.
In an optional embodiment, the radio frequency chip control board further includes a debugging interface, and the debugging interface is disposed on the control board body and electrically connected to the control chip.
In an optional embodiment, the radio frequency chip control board further includes a serial interface; the serial interface is arranged on the control panel body and is electrically connected with the control chip.
In an alternative embodiment, the dual row socket is disposed at an inner corner of the control board body, or near a side of the control board body.
In an optional embodiment, the dual-row socket and the control chip are respectively disposed on different surfaces of the control board body, and a surface on which the dual-row socket is disposed is opposite to a surface on which the control chip is disposed.
In an optional embodiment, the control chip is a programmable logic gate array chip.
In a second aspect, an embodiment of the present invention provides a radio frequency chip test system, including any one of terminal device and the foregoing embodiments, the radio frequency chip control board, the terminal device and the radio frequency chip control board are connected.
In an optional embodiment, the rf chip testing system further includes a plurality of rf chip testing boards, and the rf chip is disposed on the rf chip testing board and connected to the rf chip control board through the rf chip testing board.
The embodiment of the utility model provides a radio frequency chip control panel and radio frequency chip test system, including control chip, double socket and control panel body, wherein, double socket and control chip set up on the control panel body, and double socket integration has radio frequency chip's pin and control chip's pin, and control chip is connected with radio frequency chip through double socket to test radio frequency chip. According to the arrangement, the radio frequency chip can be tested through the radio frequency chip control board, the process is simple, and the testing speed and the testing efficiency of the radio frequency chip are improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a prior art rf chip testing system.
Fig. 2 is a schematic structural diagram of a radio frequency chip control board according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a connection between a radio frequency chip control board and a radio frequency chip according to an embodiment of the present invention.
Fig. 4 is another schematic structural diagram of a radio frequency chip control board according to an embodiment of the present invention.
Fig. 5 is a schematic diagram illustrating a test of a radio frequency chip according to an embodiment of the present invention.
100-radio frequency chip control panel; 10-a control chip; 20-double row socket; 30-control panel body; 40-a power supply module; 50-a power interface; 60-debugging interface; 70-a serial interface; 200-radio frequency chip test board.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1, currently, when testing a radio frequency chip, a radio frequency chip is mostly soldered on a Printed Circuit Board (PCB), and then the PCB is placed on a probe station of the test chip, a tester draws out all pins of the radio frequency chip and pins of a power supply to a PCB edge, and connects the pins of the radio frequency chip with an external test equipment conversion interface through wires, and connects the pins of the power supply with the external power supply for testing.
However, in the method of connecting the pin of the radio frequency chip to the external test equipment and connecting the pin of the power supply to the external power supply through the wire to perform the test, since the signal transmission adopts a single-ended long wire, if the wire is too long, the quality of the control signal is affected, so that the chip control is unstable, and the test reliability is not high. In the testing process, each chip needs to be reconnected with the corresponding wire, so that the process is complicated, the error is easy to occur, and the radio frequency chip cannot be tested quickly and efficiently.
Based on the research, the embodiment of the utility model provides a radio frequency chip control panel and radio frequency chip test system is through integrated control chip and double socket on the control panel body for control chip is connected with radio frequency chip through double socket, thereby realizes radio frequency chip's test, and the process is simple, convenient and fast, and efficiency of software testing is high.
Referring to fig. 2, an embodiment of the present invention provides a radio frequency chip control board 100, which includes a control chip 10, a dual-row socket 20 and a control board body 30.
The dual row socket 20 and the control chip 10 are disposed on the control board body 30.
The dual row socket 20 integrates pins of the rf chip and pins of the control chip 10.
The control chip 10 is connected with the rf chip through the dual socket 20 to test the rf chip.
Optionally, in this embodiment, the dual row socket 20 may be a 2.54mm × 5 dual row socket, wherein pins of the rf chip that need to be controlled and powered are integrated in a female socket of the 2.54mm × 5 dual row socket, and control pins of the control chip 10 are integrated in a male socket of the 2.54mm × 5 dual row socket 20.
Alternatively, the pins integrated in the dual row socket 20 may be specifically defined and controlled according to the pins required by the tested rf chip.
The embodiment of the utility model provides a radio frequency chip control panel, through setting up double socket and control chip on the control panel body, at double socket integrated control chip and radio frequency chip's pin, so, when the test, only need be connected the pin of chip in radio frequency chip's pin and the double socket, can be connected radio frequency chip and control chip to accomplish the test, compare in prior art through the mode that the pin of line with radio frequency chip links to each other with outside test equipment in order to test, the embodiment of the utility model provides a radio frequency chip control panel, test operation is more simple, and has improved radio frequency chip's test speed and efficiency.
And the embodiment of the utility model provides a radio frequency chip control panel realizes being connected of radio frequency chip and control chip through double socket, has avoided because the line is too long, influences the problem of control signal's quality, has guaranteed the reliability of test, and every radio frequency chip of testing, only need with radio frequency chip with double socket connection can, need not the reconnection line, the process is simple, efficient.
As an optional implementation manner, in order to facilitate the testing of the rf chip, as shown in fig. 3, the embodiment of the present invention can weld the rf chip on the rf chip testing board 200, and connect the pin of the rf chip with the pin of the rf chip on the testing board 200, and when testing, only the pin of the rf chip testing board 200 and the chip pin in the double-row socket 20 need to be connected, so as to achieve the electrical connection between the rf chip testing board 200 and the control chip 10, and thereby achieve the electrical connection between the rf chip and the control chip 10. Moreover, after a radio frequency chip is tested, the radio frequency chip testing board 200 is only required to be taken down from the double-row socket 20, the next radio frequency chip testing board 200 welded with the radio frequency chip is replaced, and the next radio frequency chip testing board 200 welded with the radio frequency chip is connected with the double-row socket 20, so that the radio frequency chip on the next radio frequency chip testing board 200 can be tested, the process is simple, and the testing efficiency is high.
In order to reduce the influence on the testing process of the rf chip probe station, the size of the rf chip control board 100 needs to be reduced, and therefore, in the embodiment of the present invention, as shown in fig. 2, the dual-row socket 20 is disposed at the inner angle of the control board body 30, or close to the side of the control board body 30.
The embodiment of the utility model provides a radio frequency chip control panel through setting up double socket in the interior angle department of control panel body, perhaps is close to the side setting in control panel body, is about to double socket and sets up in the edge or the marginal one corner of control panel body, and the radio frequency chip control panel of not only being convenient for is connected with radio frequency chip, can reduce the area occupancy of double socket on the control panel body again, improves the utilization ratio of control panel body area.
In order to further improve the utilization ratio of the control panel body 30, in the embodiment of the present invention, the radio frequency chip control panel adopts a double-sided layout in the layout process.
Alternatively, the dual row socket 20 and the control chip 10 are respectively disposed on different surfaces of the control board body 30, and the surface on which the dual row socket 20 is disposed is opposite to the surface on which the control chip 10 is disposed.
In this embodiment, the dual row socket 20 and the control chip 10 are respectively disposed on different surfaces of the control board body 30, which means that the dual row socket 20 and the control chip 10 are respectively disposed on different bottom surfaces of the control board body 30. For example, if the control chip 10 is disposed on the upper surface of the control board body 30, i.e., on the upper bottom surface of the control board body 30, the dual socket 20 is disposed on the bottom surface of the control board body 30, i.e., on the lower bottom surface of the control board body 30. For another example, if the control chip 10 is disposed on the bottom surface of the control board body 30, that is, on the bottom surface of the control board body 30, the dual socket 20 is disposed on the top surface of the control board body 30, that is, on the top bottom surface of the control board body 30.
The embodiment of the utility model provides a radio frequency chip control panel through the mode that adopts two-sided overall arrangement, sets up control chip and double socket respectively in the different surfaces of control panel body, has improved the utilization ratio of control panel body greatly, can make the control panel body reach the small area state of ideal.
Because in practical application, still be provided with other electronic device on the control panel body 30, for example, electronic device such as power converter, sensor, in order to improve the stability of control panel body 30 and improve the utilization ratio of control panel body 30, in the embodiment of the utility model provides an, set up in control panel body 30 and highly be higher than setting up in control panel body 30 and the device that is located same surface with control chip 10 with the device that double socket 20 is located same surface.
In view of the fact that in practical applications, the height of the control chip 10 is lower than that of the dual row socket 20, in the embodiment of the present invention, the higher device among all the devices and the dual row socket 20 are disposed on the same surface, and the lower device among all the devices and the control chip 10 are disposed on the same surface.
Alternatively, the device having a height greater than or equal to the dual row socket 20 may be disposed on the same surface as the dual row socket 20, and the device having a height less than the dual row socket 20 may be disposed on the same surface as the control chip 10. Alternatively, the device having a height equal to or greater than the height of the control chip 10 may be disposed on the same surface as the dual row socket 20, and the device having a height smaller than the height of the control chip 10 may be disposed on the same surface as the control chip 10. With this arrangement, the height of the device disposed on the control board body 30 and located on the same surface as the dual row socket 20 can be higher than that of the device disposed on the control board body 30 and located on the same surface as the control chip 10.
For example, the dual socket 20 is disposed on the bottom surface of the control board body 30, and the control chip 10 is disposed on the top surface of the control board body 30, so that the height of the electronic device disposed on the bottom surface is higher than that of the electronic device disposed on the top surface.
Optionally, the embodiment of the utility model provides an in, can set up electron device according to actual need on the control panel body, for example, can set up electron device such as temperature sensor, vibration sensor, resistance, pilot lamp on the control panel body, concrete electron device, the embodiment of the utility model provides a do not do concrete setting.
The embodiment of the utility model provides a radio frequency chip control panel, through the mode that adopts two-sided overall arrangement, set up control chip and double socket respectively in the different surfaces of control panel body, and make set up in the control panel body and be located the device on same surface with double socket highly be higher than set up in the control panel body and be located the device on same surface with control chip, furthest's the area of control panel body has been utilized on the one hand, thereby make the control panel body reach the small area state of ideal, on the other hand, can make the device overall arrangement on the control panel body more reasonable, the stability of control panel body has been improved.
Because in practical application, when testing, the control chip 10 needs a power supply, and please refer to fig. 2 and fig. 4 in combination, the embodiment of the present invention provides a radio frequency chip control board 100 further including a power module 40, wherein the power module 40 is disposed on the control board body 30 and electrically connected to the control chip 10.
The power module 40 is used for converting the voltage of the power supply and supplying power to the control chip 10 through the converted power supply.
Optionally, in the embodiment of the present invention, the power module 40 may be a Direct Current converter (DCDC), and the voltage of the input power is converted according to the voltage value required by the control chip 10 through the power module 40, so that the voltage of the input power meets the requirement of the control chip 10.
In order to facilitate connection of an external power source, optionally, please refer to fig. 2 and fig. 4 in combination, in the embodiment of the present invention, the rf chip control board 100 further includes a power interface 50; the power interface 50 is disposed on the control panel body 30 and electrically connected to the power module 40.
The power interface 50 is used to connect an external power source so that the external power source supplies power to the power module 40 through the power interface 50.
During testing, an external power supply is connected to the power interface 50, and the external power supply can be input to the power module 40 through the power interface 50 and then voltage conversion is performed through the power module 40, so that the voltage requirement of the control chip 10 is met.
Optionally, in this embodiment, the power interface 50 may also be an adapter input port for connecting with an adapter, wherein the adapter may be a 5V or 12V adapter.
In order to realize the test of the radio frequency chip by the control chip 10, please refer to fig. 2 and fig. 4 in combination, in the embodiment of the present invention, the radio frequency chip control board 100 further includes a serial interface 70, and the serial interface 70 is disposed on the control board body 30 and electrically connected to the control chip 10.
Optionally, in the embodiment of the utility model provides an, serial interface 70 can be 232 serial ports for be connected with terminal equipment, terminal equipment issues test instruction to control chip 10 in through serial interface 70, after control chip 10 received test instruction, solve test instruction, and after resolving, according to the instruction after resolving, realize and the corresponding function and the operation of the instruction after resolving through double socket 20 control radio frequency chip, thereby obtain radio frequency chip's corresponding index, as shown in fig. 5.
Alternatively, the terminal device may be, but is not limited to, a Personal Computer (PC), a tablet PC, a Personal Digital Assistant (PDA), a Mobile Internet Device (MID), and the like. The embodiment of the utility model provides an in, the storage has the test instruction who is used for testing the radio frequency chip among the terminal equipment.
In order to improve the accuracy of the test, the embodiment of the present invention provides a radio frequency chip control panel 100, which further includes a debugging interface 60, wherein the debugging interface 60 is disposed on the control panel body 30 and electrically connected to the control chip 10.
Wherein, after the server issued test instruction to control chip 10, in order to guarantee the accuracy of test, still need debug the test instruction who issues control chip 10, consequently, the embodiment of the utility model provides a radio frequency chip control panel 100 is provided with debugging interface 60, debugs the test instruction in control chip 10 through debugging interface 60 to guarantee the accuracy of test.
Optionally, in the embodiment of the present invention, the control chip 10 is a programmable gate array chip (FPGA).
The embodiment of the utility model provides a radio frequency chip control panel, through the cooperation of control chip, power module and double socket, tests the radio frequency chip, need not to connect equipment such as computer power through the external connection, the process is simple, and efficiency of software testing is high.
Based on the same inventive concept, an embodiment of the present invention provides a radio frequency chip test system, which includes a terminal device and the radio frequency chip control board 100 described in any of the foregoing embodiments, wherein the terminal device is connected to the radio frequency chip control board 100.
The terminal device stores a test instruction, and the terminal device can be connected with the control chip 10 on the radio frequency chip control board 100 through the serial interface 70 on the radio frequency chip control board 100, and after the connection, the test instruction is sent to the control chip 10 through the serial interface 70.
In an optional embodiment, the rf chip testing system further includes an rf chip testing board 200, and the rf chip is disposed on the rf chip testing board 200 and connected to the rf chip control board 100 through the rf chip testing board 200.
The radio frequency chip is welded on the radio frequency chip test board 200, and the pin of the radio frequency chip is connected with the lead wire on the radio frequency chip test board 200, when testing, the electrical connection between the radio frequency chip test board 200 and the control chip 10 can be realized only by connecting the lead wire of the radio frequency chip test board 200 with the chip pin in the double-row socket 20, so that the electrical connection between the radio frequency chip and the control chip 10 is realized.
It can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working process of the radio frequency chip test system described above may refer to the corresponding process in the radio frequency chip control board, and will not be described in detail herein.
To sum up, the embodiment of the utility model provides a radio frequency chip control panel and radio frequency chip test system, including control chip, double socket and control panel body, wherein, double socket and control chip set up on the control panel body, and double socket integration has radio frequency chip's pin and control chip's pin, and control chip is connected with radio frequency chip through double socket to test radio frequency chip. According to the arrangement, the radio frequency chip can be tested through the radio frequency chip control board, the process is simple, and the testing speed and the testing efficiency of the radio frequency chip are improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A radio frequency chip control board is characterized by being used for testing a radio frequency chip and comprising a control chip, double rows of sockets and a control board body;
the double-row socket and the control chip are arranged on the control panel body;
the double-row socket is integrated with a pin of a radio frequency chip and a pin of the control chip;
the control chip is connected with the radio frequency chip through the double-row socket so as to test the radio frequency chip.
2. The radio frequency chip control board according to claim 1, further comprising a power module disposed on the control board body and electrically connected to the control chip;
the power supply module is used for converting the voltage of the power supply and supplying power to the control chip through the converted power supply.
3. The radio frequency chip control board according to claim 2, wherein the radio frequency chip control board further comprises a power interface; the power interface is arranged on the control panel body and is electrically connected with the power module;
the power interface is used for connecting an external power supply so that the external power supply provides power for the power module through the power interface.
4. The RF chip control board according to claim 1, further comprising a debug interface, wherein the debug interface is disposed on the control board body and electrically connected to the control chip.
5. The radio frequency chip control board according to claim 1, wherein the radio frequency chip control board further comprises a serial interface; the serial interface is arranged on the control panel body and is electrically connected with the control chip.
6. The rf chip control board according to claim 1, wherein the dual row socket is disposed at an inner corner of the control board body or close to a side of the control board body.
7. The rf chip control board according to claim 1, wherein the dual socket and the control chip are respectively disposed on different surfaces of the control board body, and a surface on which the dual socket is disposed is opposite to a surface on which the control chip is disposed.
8. The RF chip control board according to claim 1, wherein the control chip is a programmable logic gate array chip.
9. A radio frequency chip test system, comprising a terminal device and the radio frequency chip control board of any one of claims 1 to 8, wherein the terminal device is connected with the radio frequency chip control board.
10. The RF chip test system according to claim 9, further comprising an RF chip test board;
the radio frequency chip is arranged on the radio frequency chip test board and is connected with the radio frequency chip control board through the radio frequency chip test board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022020289.7U CN213068951U (en) | 2020-09-15 | 2020-09-15 | Radio frequency chip control panel and radio frequency chip test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022020289.7U CN213068951U (en) | 2020-09-15 | 2020-09-15 | Radio frequency chip control panel and radio frequency chip test system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213068951U true CN213068951U (en) | 2021-04-27 |
Family
ID=75558625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022020289.7U Active CN213068951U (en) | 2020-09-15 | 2020-09-15 | Radio frequency chip control panel and radio frequency chip test system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213068951U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113903675A (en) * | 2021-12-09 | 2022-01-07 | 江山季丰电子科技有限公司 | Radio frequency bare chip test system and test method |
| WO2023221265A1 (en) * | 2022-05-20 | 2023-11-23 | 成都天锐星通科技有限公司 | Testing system architecture for phased array chip |
-
2020
- 2020-09-15 CN CN202022020289.7U patent/CN213068951U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113903675A (en) * | 2021-12-09 | 2022-01-07 | 江山季丰电子科技有限公司 | Radio frequency bare chip test system and test method |
| CN113903675B (en) * | 2021-12-09 | 2022-02-18 | 江山季丰电子科技有限公司 | Radio frequency bare chip test system and test method |
| WO2023221265A1 (en) * | 2022-05-20 | 2023-11-23 | 成都天锐星通科技有限公司 | Testing system architecture for phased array chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN213068951U (en) | Radio frequency chip control panel and radio frequency chip test system | |
| CN107192881B (en) | Antenna resistance testing tool and testing method thereof | |
| CN214041466U (en) | Universal aging motherboard, adapter plate and testing device | |
| CN101902040A (en) | Power supplier and connector combination thereof | |
| CN107449967B (en) | Antenna resistance testing tool and testing method thereof | |
| CN211856799U (en) | Tester for IC carrier plate after ball mounting | |
| CN212965292U (en) | Portable plug testing device | |
| CN217643852U (en) | PCB board | |
| CN101251550A (en) | Multiplicity type contact test tablet | |
| TWM642961U (en) | Adapter device for converting OSM module standard to COMe module standard | |
| CN215525909U (en) | Voltage detection device for electric core of energy storage system | |
| CN212626423U (en) | Adapter plate for debugging and integrated circuit module debugging system | |
| CN212138008U (en) | Mini-PCIe module pinboard | |
| CN2884613Y (en) | Electrical connector | |
| CN111161788A (en) | Aging testing device of memory | |
| CN210665906U (en) | Simulation test device for verifying dynamic response of power conversion module | |
| CN219997124U (en) | Clamping fixture | |
| CN215340176U (en) | Tool jig for glucometer | |
| CN216121103U (en) | Switching device and interface debugging equipment | |
| CN210665802U (en) | Universal dual in-line device test adapter | |
| CN218975982U (en) | LCD display screen debugging rotating plate | |
| CN212809195U (en) | Switching board card, mainboard and terminal equipment | |
| TWM643352U (en) | Adaptor for converting OSM module standard into SMARC module standard | |
| CN216561762U (en) | Debugging circuit, debugging device and electronic equipment | |
| CN218122028U (en) | Positioning fixture for testing circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |