JPS56144673A - Telecamera - Google Patents

Telecamera

Info

Publication number
JPS56144673A
JPS56144673A JP4678780A JP4678780A JPS56144673A JP S56144673 A JPS56144673 A JP S56144673A JP 4678780 A JP4678780 A JP 4678780A JP 4678780 A JP4678780 A JP 4678780A JP S56144673 A JPS56144673 A JP S56144673A
Authority
JP
Japan
Prior art keywords
printed circuit
sent
circuit part
signal
via flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4678780A
Other languages
Japanese (ja)
Inventor
Toshimoto Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Denshi KK
Original Assignee
Hitachi Denshi KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Denshi KK filed Critical Hitachi Denshi KK
Priority to JP4678780A priority Critical patent/JPS56144673A/en
Publication of JPS56144673A publication Critical patent/JPS56144673A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)

Abstract

PURPOSE:To realize high-density package while improving reliability and operability, by making printed substrates in one body in making part of each printed substrate flexible. CONSTITUTION:An external signal is sent from input signal plug 2 on the back surface of telecamera housing 1 to driving signal unit 4 via flexible printed circuit part (a) of printed circuit substrate 3. A driving signal is sent to solid image pickup element 5 via flexible printed circuit part (b), and through lens 6, a picture image-formed on solid image pickup element 5 is converted into an electric signal, which is sent to video amplification unit 7 via flexible printed circuit part (c). A video signal amplified and shaped is sent out from output signal plug 8 via lfexible printed circuit part (d).
JP4678780A 1980-04-11 1980-04-11 Telecamera Pending JPS56144673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4678780A JPS56144673A (en) 1980-04-11 1980-04-11 Telecamera

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4678780A JPS56144673A (en) 1980-04-11 1980-04-11 Telecamera

Publications (1)

Publication Number Publication Date
JPS56144673A true JPS56144673A (en) 1981-11-11

Family

ID=12757034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4678780A Pending JPS56144673A (en) 1980-04-11 1980-04-11 Telecamera

Country Status (1)

Country Link
JP (1) JPS56144673A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60221719A (en) * 1984-03-29 1985-11-06 Olympus Optical Co Ltd Endoscope incorporating solid-state image pickup element
JPH01198182A (en) * 1988-02-02 1989-08-09 Olympus Optical Co Ltd Image pickup device
JPH0471078U (en) * 1990-10-31 1992-06-23
KR100467841B1 (en) * 2002-06-21 2005-01-24 삼성전기주식회사 Camera module installed in portable phone and method for making the same
WO2013147191A1 (en) * 2012-03-30 2013-10-03 株式会社フジクラ Image pickup module
JP2016140107A (en) * 2016-03-31 2016-08-04 株式会社フジクラ Imaging module, imaging module with lens, and endoscope
JP2016171576A (en) * 2016-03-31 2016-09-23 株式会社フジクラ Manufacturing method of imaging module and flexible wiring board molding equipment
EP3206386A1 (en) * 2013-02-15 2017-08-16 Richard Wolf GmbH Assembly for a video endoscope

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5388157A (en) * 1977-01-13 1978-08-03 Matsushita Electric Ind Co Ltd Printed circuit board
JPS54129362A (en) * 1978-03-29 1979-10-06 Sony Corp Method of producing circuit device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5388157A (en) * 1977-01-13 1978-08-03 Matsushita Electric Ind Co Ltd Printed circuit board
JPS54129362A (en) * 1978-03-29 1979-10-06 Sony Corp Method of producing circuit device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60221719A (en) * 1984-03-29 1985-11-06 Olympus Optical Co Ltd Endoscope incorporating solid-state image pickup element
JPH01198182A (en) * 1988-02-02 1989-08-09 Olympus Optical Co Ltd Image pickup device
JPH0471078U (en) * 1990-10-31 1992-06-23
KR100467841B1 (en) * 2002-06-21 2005-01-24 삼성전기주식회사 Camera module installed in portable phone and method for making the same
WO2013147191A1 (en) * 2012-03-30 2013-10-03 株式会社フジクラ Image pickup module
JP2013214815A (en) * 2012-03-30 2013-10-17 Fujikura Ltd Imaging module, imaging module with lens, endoscope, manufacturing method of imaging module, and flexible wiring board molding device
CN103535020A (en) * 2012-03-30 2014-01-22 株式会社藤仓 Image pickup module
US9814371B2 (en) 2012-03-30 2017-11-14 Fujikura Ltd. Imaging module, lens-attached imaging module, endoscope, method of manufacturing imaging module, and flexible wiring substrate formation apparatus
EP3206386A1 (en) * 2013-02-15 2017-08-16 Richard Wolf GmbH Assembly for a video endoscope
US10025088B2 (en) 2013-02-15 2018-07-17 Richard Wolf Gmbh Assembly for a video endoscope
JP2016140107A (en) * 2016-03-31 2016-08-04 株式会社フジクラ Imaging module, imaging module with lens, and endoscope
JP2016171576A (en) * 2016-03-31 2016-09-23 株式会社フジクラ Manufacturing method of imaging module and flexible wiring board molding equipment

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