JP2016171576A - Manufacturing method of imaging module and flexible wiring board molding equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide technology for easily keeping a shape of a tip part of a flexible wiring board on which a solid state imaging device is mounted to be stable and for efficiently manufacturing an imaging module in which an electric cable and the solid state imaging device are electrically connected by using the flexible wiring board at a low cost.SOLUTION: A manufacturing method of an imaging module comprises: a device mounting process for mounting a solid state imaging device in a device mounting section 32 in a center of a slender flexible wiring board 30 in a longitudinal direction; a bend-forming process for bending parts on both sides to a back side opposite to a solid state imaging device-side via the device mounting section 32 of the flexible wiring board and forming extending sections 34a and 35a and connection piece parts 34b and 35b which extend from the extending sections; a bonding fixing process for charging an inner side surrounded by the extending sections and the device mounting section with resin and bonding and fixing the extending sections; and a cable connection process for connecting the electric cable to a terminal section on an outer face side of the respective connection piece parts.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an imaging module having a configuration in which a solid-state imaging device is electrically connected to an electric cable via a flexible wiring board, a method for manufacturing an imaging module configured using the imaging module, and a flexible wiring board molding apparatus.

As a conventional electronic endoscope, a configuration in which an image pickup module in which an image pickup unit having a solid-state image pickup device (hereinafter also simply referred to as an image pickup device) is assembled at the tip of an electric cable is accommodated in the insertion portion is employed.
As an image pickup unit of the image pickup module, a flexible wiring board (hereinafter referred to as FPC) on which an image pickup element is mounted and an objective lens unit are housed in a cylindrical metal frame member, and the image pickup element is connected to the electric cable via the FPC. The structure electrically connected to is widely adopted (for example, Patent Documents 1 and 2). The FPC has a cable connecting piece portion which is attached to a conductor of an electric cable by soldering a terminal portion and is arranged substantially along the axis of the metal frame member. The image pickup element is formed on the FPC by being bent so as to be perpendicular to the axis of the metal frame member, and mounted on the element mounting portion disposed on the front side (the side opposite to the electric cable) of the cable connection piece.

In the image pickup unit, in order to realize good image pickup, the image pickup element needs to be arranged in an appropriate direction with respect to the optical axis of the objective lens unit fixed inside the tip of the metal cylinder member.
However, the technologies disclosed in Patent Documents 1 and 2 described above have a configuration in which an imaging element is mounted on an element mounting portion that protrudes in a cantilever manner by bending an FPC, and the shape of the front end portion (near the element mounting portion) of the FPC is Due to the instability, it has been difficult to fix the element mounting portion and the imaging element in an appropriate direction with respect to the optical axis of the objective lens unit.

Also, as an imaging unit, a configuration is proposed in which a block is bonded and fixed to the inside of an FPC bent into a U-shape as in Patent Document 3. With this configuration, the shape of the front end portion of the FPC can be kept stable.
However, this configuration requires a block machined with high accuracy, and it is necessary to accurately fix the FPC to the block. In addition, in the configuration in which the conductor of the electric cable is soldered to the portions arranged on both sides via the FPC block, it is not easy to reduce the size including the soldered portion and the covering covering the conductor, and the imaging unit is reduced in diameter. This was disadvantageous in terms of reducing the diameter of the endoscope tube.
In recent years, for example, as disclosed in Patent Document 4 (for example, Claim 1), an imaging unit (video camera head of Patent Document 1) having an outer diameter of about 1.1 mm has also been proposed. . In the imaging unit having such an outer diameter, the influence of the thickness of the electric cable soldered to the FPC and the size of the soldered portion on the outer diameter of the entire imaging unit is increased.

JP 2009-260553 A JP 2008-227733 A Japanese Unexamined Patent Publication No. 2011-217887 US Patent Application Publication No. 2011/0063428

  In view of the above problems, the present invention can easily realize the stable mounting of the element mounting portion of the flexible wiring board and its vicinity, can be efficiently manufactured at low cost, and can be easily reduced in diameter. The object is to provide a module manufacturing method and a flexible wiring board forming apparatus.

In order to solve the above problems, the present invention provides the following configuration.
According to a first aspect of the present invention, there is provided an element mounting step of mounting a solid-state imaging device on an element mounting portion at a longitudinal center of an elongated flexible wiring board, and the elements on both sides of the flexible wiring board via the element mounting section. Bending with respect to the mounting part, two extending parts extending from the element mounting part to the back side opposite to the mounting surface on which the solid-state imaging device is mounted, and 2 extending from each extending part The resin is filled in the inner region surrounded by the bending process for forming two connecting pieces, the two extending parts formed in this bending process and the element mounting part, and the two extending parts A method of manufacturing an imaging module, comprising: an adhesive fixing step for bonding and fixing a cable; and a cable connecting step for connecting an electric cable to a terminal portion provided on each of the outer surfaces of the two connection piece portions formed in the bending molding step. Offer To.
According to a second aspect of the present invention, a pin is projected on a flexible wiring board mounting table on which a flexible wiring board is mounted, and a lifting table that can be raised and lowered with respect to the flexible wiring board mounting table. A lifting platform with a pin formed with a flat mounting portion contact surface with which an element mounting portion at the center in the longitudinal direction of the flexible wiring substrate contacts, and a slide along the upper surface of the flexible wiring substrate mounting table A pair of movable pressing members provided with variable separation distances by movement, and the pin-equipped lift platform has an initial position where the top surface of the lift platform substantially coincides with the top surface of the flexible wiring board mounting table by the lift. A flexible wiring board molding apparatus is provided that is movable from the initial position to a lower retreat position.
According to a third aspect of the present invention, a pin is projected on a flexible wiring board mounting table on which a flexible wiring board is mounted, and a lifting table that can be moved up and down with respect to the flexible wiring board mounting table. A lifting platform with a pin formed with a flat mounting portion contact surface with which an element mounting portion at the center in the longitudinal direction of the flexible wiring substrate contacts, and a slide along the upper surface of the flexible wiring substrate mounting table A pair of movable pressing members provided with variable separation distances by movement, and the pin-equipped lift platform has an initial position where the top surface of the lift platform substantially coincides with the top surface of the flexible wiring board mounting table by the lift. Using the flexible printed circuit board molding apparatus that is movable from the initial position to the lower retracted position, the pin mounting portion contact surface of the lifting platform with the pin disposed at the initial position The element mounting part of the flexible wiring board is brought into contact, and both parts are bent with respect to the element mounting part via the element mounting part of the flexible wiring board and extended from the element mounting part to the rear side opposite to the mounting surface. The flexible printed circuit board mounting step in which the rear piece is placed in the gap between the pair of movable pressing members in the open state, and then the pair of movable pressing members are brought close to each other to form a pair of rear pieces of the flexible wiring board A bending process for forming the two extending portions and the two connecting pieces extending from each extending portion by bringing the portions close to each other, and then lowering the lifting platform with pins from the initial position to the retracted position, The pin is removed from the space surrounded by the mounting portion and the extending portions on both sides of the mounting portion, and the bonding and fixing step of filling the space with resin and solidifying, and the outside of the two connecting pieces formed in the bending step Providing a cable connecting step for connecting the electrical cable to the terminal portions that are respectively provided on the side, the element mounting step of mounting the solid-state imaging device in the element mounting portion of the flexible wiring board, a manufacturing method of the imaging module having.

According to the present invention, the flexible wiring board is bent on both sides of the element mounting portion and has two extending portions extending so as to be closer to each other as the distance from the element mounting portion increases. Shape stability can be easily secured. Therefore, when the flexible wiring board having the solid-state image sensor mounted on the element mounting portion is accommodated in the metal frame member and the imaging module is assembled, the orientation and position of the solid-state image sensor and the element mounting portion in the metal frame member are adjusted. It can be done easily and accurately. Further, the imaging module according to the present invention does not require a member such as a block described in Patent Document 3 for attaching a flexible wiring board and maintaining its shape, and can be manufactured efficiently at low cost.
Moreover, according to this invention, it becomes the structure which connects an electric cable to the connection piece part each extended from two extension parts. If it is this structure, the distance between the connection piece parts of both sides will be made small compared with the distance between extension parts, and the dimension containing the cable connection part which connected the electric cable to the connection piece part will be reduced in size. In the case where the solid-state imaging device and the flexible wiring board of the imaging module are accommodated in the metal frame member, the metal frame member can be easily reduced in diameter.

It is sectional drawing which shows the structure of the imaging tip unit of the imaging module of one Embodiment which concerns on this invention, and the imaging module with a lens comprised using it. It is a figure which shows an example of the flexible wiring board used for the imaging module of FIG. 1, and is a top view which shows the state before the bending (before bending). (A)-(g) is a figure which respectively shows the cross-section of the AG part of the flexible wiring board of FIG. It is a figure which shows the cross-section of the bending part vicinity of the flexible wiring board of the imaging module of FIG. It is a figure explaining a part of process of assembling the imaging module of FIG. 1, Comprising: (a) is the process of extrapolating an insulation tube from the rear side to the extension tail part of a flexible wiring board, (b) is FIG. The step of adhering and integrating the insulating tube containing the extended tail in the step of () with the flexible wiring board with the resin filled inside and cured. It is sectional drawing which shows the state which extrapolated the insulation tube in the extension tail part of the flexible wiring board. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure explaining the flexible wiring board shaping | molding apparatus of 1 Embodiment which concerns on this invention, Comprising: (a) is a top view, (b) is a side view. It is a figure explaining 1 process of the manufacturing method of the imaging module using the flexible wiring board shaping | molding apparatus of Fig.7 (a), (b), Comprising: A flexible wiring board is mounted on a raising / lowering stand and a flexible wiring board mounting base. The state which completed the board | substrate mounting process to set is shown. It is a figure explaining 1 process of the manufacturing method of the imaging module using the flexible wiring board shaping | molding apparatus of Fig.7 (a), (b), Comprising: After FIG. 8, the element mounting part of a flexible wiring board and its both sides It is a figure explaining the process of filling resin into the space enclosed by the extension part. 1 is a cross-sectional view illustrating an imaging module according to an embodiment of the present invention, in which a front end of an insulating tube is separated from an extension part of a flexible wiring board to a rear side and arranged at a position separated from an inner conductor connection part to a front side. FIG. 1 is a cross-sectional view illustrating an imaging module according to an embodiment of the present invention, in which a front end of an insulating tube is aligned with an internal conductor connection portion of a connection piece portion of a flexible wiring board, and a part of the internal conductor connection portion is exposed. FIG. It is an imaging module of one embodiment concerning the present invention, and is a side view showing an imaging module of composition which does not have an insulating tube. It is a figure which shows an example of the cross-section of the electric cable of the imaging module of FIG. It is an expanded sectional view which shows the structure of the element mounting part vicinity of the flexible wiring board of the imaging module of FIG. It is a figure which shows the insulation tube of another aspect, Comprising: It is a figure which shows the insulation tube of a half structure. 1 is a side cross-sectional view illustrating an imaging module according to an embodiment of the present invention, which is configured by extrapolating an insulating tube to each of two rear piece portions of a flexible wiring board, and bonding and integrating them. It is a figure explaining the endoscope of one embodiment concerning the present invention, and is an expansion perspective view showing the tube tip part. (A)-(c) is a figure which shows the example of the cross-sectional shape (cross-sectional shape perpendicular | vertical to a pin axis line) of the pin of the flexible wiring board shaping | molding apparatus of Fig.7 (a), (b).

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows an imaging module 10 according to an embodiment of the present invention and a tip part (front end part) structure of an imaging module 11 with a lens assembled using the imaging module 10.

As shown in FIGS. 1 and 5B, the imaging module 10 includes a solid-state imaging device 22 (hereinafter simply referred to as an imaging unit 21) having an imaging unit 21 at the tip of a conductor (an inner conductor 2a and an outer conductor 2b described later) of the electric cable 1. A flexible wiring board 30 (flexible printed circuit board) on which an image pickup device is mounted is electrically connected and attached. As the image pickup element 22, for example, a CMOS (complementary metal oxide semiconductor) can be suitably used.
The imaging module 10 includes a front end unit portion 110 in which the imaging element 22 is mounted on a flexible wiring board 30. The imaging module 10 has a configuration in which the imaging element 22 is electrically connected to the electric cable 1 via the flexible wiring board 30.

  As shown in FIG. 5B, the flexible wiring board 30 is bent at both sides of the element mounting portion 32 where the imaging element 22 is mounted on the front mounting surface 32a, and extends from the element mounting portion 32 to the rear side. Two rear pieces 34, 35. Hereinafter, one of the two rear pieces 34 and 35 is also referred to as a first rear piece 34 and the other is also referred to as a second rear piece 35.

As shown in FIG. 2, the flexible wiring board 30 is formed in an elongated shape having an element mounting portion 32 at the center in the longitudinal direction, bent at both sides of the element mounting portion 32, and then from both sides of the element mounting portion 32. Two rear pieces 34 and 35 extending to the side are formed.
The flexible wiring board 30 is a one-side wiring type flexible wiring board. The wiring is provided on the outer surface side of the bent flexible wiring board 30.

  Pad-like terminal portions 34c, 34d, 35c, and 35d are provided on outer surfaces 34b and 35b (outer surfaces) opposite to the opposing surfaces 34a and 35a of the two rear piece portions 34 and 35 that face each other. . The flexible wiring board 30 is provided at the front end of the electric cable 1 by electrically connecting the built-in electric cable 2 led to the front end of the electric cable 1 to the terminal portions of the rear piece portions 34 and 35 on both sides.

As shown in FIGS. 1 and 13, the built-in electric cable 2 is a coaxial cable (electric cable). The electric cable 1 is a cable unit in which a plurality (four in the illustrated example) of built-in electric cables 2 are collectively covered with a jacket 3.
The built-in electric cable 2 includes an internal conductor 2a, a primary coating layer 2c that covers the internal conductor 2a, an external conductor 2b that is formed in a net shape by thin metal wires and is provided around the primary coating layer 2c, and the external conductor 2b. And a secondary coating layer 2d for coating.

  As shown in FIGS. 1 and 2, the inner conductor terminal for electrically connecting the inner conductor 2 a exposed at the tip of the built-in electric cable 2 to the outer surfaces 34 a and 35 a of the two rear pieces 34 and 35. Portions 34c and 35c and external conductor terminal portions 34d and 35d for electrically connecting the external conductor 2b of the built-in electric cable 2 are provided, respectively.

  The first rear piece portion 34 is provided with two inner conductor terminal portions 34c and two outer conductor terminal portions 35d. Two built-in electric cables 2 in which the inner conductor 2a is soldered to the inner conductor terminal portion 34c and the outer conductor 2b is soldered to the outer conductor terminal portion 34d are connected to the first rear piece 34. Yes.

  On the other hand, the second rear piece portion 35 is provided with two inner conductor terminal portions 35c and one outer conductor terminal portion 35d that is much larger in size than the inner conductor terminal portion 35c. . Two internal electric cables 2 in which the inner conductor 2a is soldered to the inner conductor terminal portion 35c and the outer conductor 2b is soldered to the outer conductor terminal portion 35d are connected to the second rear piece portion 35. Yes.

As shown in FIGS. 1 and 2, the imaging unit 21 is electrically connected to the wiring 36 (see FIG. 2) of the flexible wiring board 30 through an electrical circuit formed on the imaging element 22.
The imaging element 22 has a solder bump, a stud bump, or a plating bump 22a (hereinafter referred to as a bump 22a) electrically connected to the electrical circuit of the imaging element 22 on the back surface opposite to the surface on which the imaging unit 21 is mounted. (See FIG. 1). The imaging element 22 is a flip-chip method, and a bump 22a is bonded to a terminal portion 36a (see FIG. 14; hereinafter also referred to as a mounting portion terminal portion) formed on the mounting surface 32a of the element mounting portion 32 of the flexible wiring board 30. It is fixed and electrically connected to the wiring 36 and mounted on the element mounting portion 32 of the flexible wiring board 30.

  As shown in FIG. 14, the electric circuit of the image sensor 22 is formed in, for example, a through hole 22 b that penetrates the plate thickness of the image sensor 22 and electrically connected to the wirings 22 c and 22 d on both the front and back surfaces of the image sensor 22. A through-wiring 22e (through-hole wiring) connected to may be included.

As shown in FIG. 2, the mounting portion terminal portion 36 a of the flexible wiring board 30 is connected to the wiring portions 36 of the flexible wiring substrate 30. The terminal portions 34 c, 34 d, 35 c, and 35 d are formed integrally with the wiring 36. And are electrically connected.
Therefore, in the imaging module 10 illustrated in FIG. 1, FIG. 5A, and the like, the imaging unit 21 includes the internal conductor of the built-in electrical cable 2 via the electrical circuit of the imaging element 22 and the wiring 36 of the flexible wiring board 30. 2a and the external conductor 2b are electrically connected.

As shown in FIGS. 5B and 6, the imaging module 10 solders the inner conductor 2 a and the outer conductor 2 b to the two rear pieces 34 and 35 and the terminal portions of the rear pieces 34 and 35. And an electrically insulating tube 25 (insulating tube) that accommodates and covers the front end of the electrically connected built-in electric cable 2.
The insulating tube 25 is a resin tube made of a resin such as a silicone resin.
The insulating tube 25 made of silicone resin is preferable in that it can be smoothly slid with respect to the internal electric cable 2 and the flexible wiring board 30 with low friction.

Each of the rear piece portions 34 and 35 of the flexible wiring board 30 has an internal conductor connection portion 37a (cable connection portion) in which the internal conductor 2a of the built-in electric cable 2 is soldered to the internal conductor terminal portions 34c and 35c, respectively. External conductor connection portions 37b (cable connection portions) are formed by soldering the external conductor 2b of the built-in electric cable 2 to the external conductor terminal portions 34d and 35d. The insulating tube 25 covers the inner conductor connecting portion 37a and the outer conductor connecting portion 37b of each of the rear piece portions 34 and 35.
The insulating tube 25 is fixed and integrated with the flexible wiring board 30 and the built-in electric cable 2 inside the insulating tube 25 by a resin 26 filled and cured inside.

As shown in FIG. 1, the imaging module with a lens 11 includes, for example, a cylindrical metal sleeve-like metal together with a cover member 23 and a lens unit 24 (objective lens unit) fixed to the imaging element 22 of the front end unit portion 110. The imaging tip unit 12 is housed in the frame member 41.
The cover member 23 is a transparent plate-like member that covers the light receiving surface 21 a (see FIG. 2) of the imaging unit 21 of the front end unit unit 110.

  The lens unit 24 incorporates an objective lens (not shown) in a cylindrical barrel 24a. The lens unit 24 is provided by aligning the optical axis with the light receiving surface 21 a of the imaging unit 21 and fixing one end in the axial direction of the lens barrel 24 a to the cover member 23. The lens unit 24 forms an image on the light receiving surface 21a of the imaging element 12 with light guided from the front side of the imaging tip unit 12 through the lens in the lens barrel 24a.

In addition, the imaging front end unit 12 has a configuration in which the front end unit portion 110 and the front end portion of the built-in electric cable 2 connected to the two rear piece portions 34 and 35 of the flexible wiring board 30 are also accommodated in the metal frame member 41. It has become.
In the imaging module 11 with a lens illustrated in FIG. 1, the tip of the electric cable 1 (the tip of the portion covered with the jacket 3) is disposed outside the metal frame member 41. The built-in electric cable 2 extending from the front end of the outer cover 3 of the electric cable 1 is drawn into the metal frame member 41 from the rear end opposite to the front end portion of the metal frame member 41 that houses the lens unit 24.

The metal frame member 41 is bonded and fixed to the insulating tube 25 of the imaging module 10 by a resin 27 filled inside and cured.
The insulating tube 25 of the imaging module 10 is short-circuited when the inner conductor connecting portion 37 a and the outer conductor connecting portion 37 b formed on each of the two rear pieces 34 and 35 of the flexible wiring board 30 are in contact with the metal frame member 41. To prevent.

The flexible wiring board 30 of the imaging module 10 will be further described.
As shown in FIG. 1, the two rear piece portions 34 and 35 of the flexible wiring board 30 are extended portions 34e and 35e inclined at an acute angle with respect to the element mounting portion 32, and the rear side from the extended portion 34e. And connecting piece portions 34f and 35f extending in the direction. The extending portions 34 e and 35 e are inclined at an acute angle with respect to the mounting portion back surface 32 b opposite to the mounting surface 32 a of the element mounting portion 32. The extension portions 34e and 35e of the two rear piece portions 34 and 35 of the flexible wiring board 30 are mutually connected from the both sides in the substrate longitudinal direction (vertical direction in FIG. 1) of the element mounting portion 32 toward the rear side of the element mounting portion 32. approach.

  The flexible wiring board 30 of the illustrated example has an extended tail portion 38 in which the connecting pieces 34f and 35f of the two rear pieces 34 and 35 are aligned in the longitudinal direction and the opposing surfaces 34a and 35a are brought into contact with each other. . The two rear piece portions 34 and 35 are an inner triangular space 31 (hereinafter referred to as a gap between the extension portions) surrounded by the element mounting portion 32, the extension portions 34e and 35e on both sides, and the extension tail portion 38. Are also bonded and fixed to each other by a resin 39 filled and cured.

  In the flexible wiring board 30, the resin 39 is allowed to enter at least the front end portion (the end portion on the element mounting portion 32 side) between the connection piece portions 34 f and 35 f constituting the extended tail portion 38, thereby connecting the connection piece portions 34 f and 35 f. They are bonded and fixed together. In this configuration, the rear piece portions 34 and 35 are more reliably bonded and fixed, and the shape stability of the flexible wiring board 30 is also increased.

In the flexible wiring board 30, the rear piece portions 34 and 35 are bonded to each other between the portion where the extending portions 34e and 35e are bonded and fixed to each other and the portion where the connection piece portions 34f and 35f are bonded and fixed to each other. A configuration in which a flexible portion is secured without being fixed can also be adopted. In this configuration, for example, the portions separated from the extending portions 34e and 35e of the connecting piece portions 34f and 35f are bonded and fixed to each other, and the extending portions 34e and 35e are bonded and fixed to each other, and the connecting piece portion 34f , 35f are secured to each other by securing a flexible portion without bonding the rear piece portions 34, 35 to each other.
In this configuration, after the assembly of the front end unit portion 110, between the portion where the extended portions 34e and 35e are bonded and fixed to each other and the portion where the connection piece portions 34f and 35f are bonded and fixed to each other. There is an advantage that the optical axis of the imaging unit 21 on the imaging element 22 can be adjusted by deforming the flexible part.

In the flexible wiring board 30, the resin 39 that is filled and cured in the gaps 31 between the extension parts constrains the shape of the portion located around the gaps 31 between the extension parts, and is less likely to be deformed. Is secured. When the flexible wiring board 30 is used, the shape of the front end portion composed of the element mounting portion 32 and the extending portions 34e and 35e on both sides thereof can be stably maintained by the resin 39 that is embedded and cured in the gaps 31 between the extending portions.
For this reason, in the imaging module 10, when the front end unit 110 is accommodated in the metal frame member 41 and the imaging tip unit 12 (see FIG. 1) is assembled, the positions of the imaging unit 21 and the lens unit 24 relative to the metal frame member 41, The orientation can be adjusted easily and accurately.

  The flexible wiring board 30 has two extending portions 34e and 35e that are bent with respect to the element mounting portion 32 on both sides of the element mounting portion 32 and extend closer to each other as the distance from the element mounting portion 32 increases. A space 31 in which the resin 39 is filled is secured between the extending portions 34e and 35e. The flexible wiring board 30 has two extending portions 34e and 35e that extend closer to each other as the distance from the element mounting portion 32 increases. High shape stability can be ensured as compared with a configuration that projects in a cantilevered manner. Further, when the flexible wiring board 30 is used, the extended portions 34e and 35e are bonded and fixed to each other by the resin 39 filled and cured in the gaps 31 between the extended portions, thereby ensuring higher shape stability.

The imaging module 10 in the illustrated example has a configuration in which the conductor of the built-in electric cable 2 is soldered and connected to the terminal portion on the outer surface side (outer side surfaces 34b and 35b side) of the connecting piece portions 34f and 35f joined to each other. Therefore, the dimension in the width direction of the front end unit portion 110, which is the distance direction between the bent portions 30d on both sides of the element mounting portion 32, can be suppressed.
Therefore, the imaging module 10 effectively contributes to reducing the diameter of the imaging tip unit 12 assembled by inserting and fixing the front end unit portion 110 to the metal frame member 41. In addition, as shown in FIG. 17, the imaging module 10 effectively contributes to a reduction in the diameter of an endoscope 70 in which the lens-equipped imaging module 11 is accommodated in the lumen 72 of the insertion portion 71.
The endoscope 70 shown in FIG. 17 has a lumen 74 (second lumen) that houses an optical fiber 73 for illumination (for light guide) in addition to a lumen 72 (first lumen) that houses the imaging module 11 with a lens. In the insertion portion 71.
In addition, this inventor is using the 0.75 mm square flat image pick-up element 22, the silicone insulating tube 25 with an outer diameter of 1.05 mm, and the cylindrical metal frame member 41 with an outer diameter of 1.2 mm, and an imaging module with a lens. 11 was prototyped. Further, the outer diameter of the insertion portion of the endoscope manufactured using this imaging module with a lens 11 was 5 mm.

Further, in the imaging module 10, the extension gaps 31 can be formed without using a member (shape maintaining member) for attaching and maintaining the shape of the flexible wiring board, such as the block described in Patent Document 3. The filled resin 39 can ensure sufficient shape stability at the front end portion of the flexible wiring board 30. Since the imaging module 10 does not require a shape maintaining member, it can be efficiently manufactured at low cost.
Assembling (manufacturing) the imaging module 10 can be performed efficiently by using, for example, a flexible wiring board molding apparatus 50 (hereinafter also referred to as a board molding apparatus) shown in FIGS.

A substrate forming apparatus 50 shown in FIGS. 7A and 7B includes a flexible wiring substrate mounting table 51 (hereinafter also referred to as a substrate mounting table) on which the flexible wiring substrate 30 is mounted, and the substrate mounting table 51. And a lifting platform 54 with pins from which pins 53 protrude.
The substrate forming apparatus 50 has a pair of movable pressing members 55a and 55b provided on the substrate mounting table 51 so as to be opened and closed by sliding movement along the upper surface 51a.

The lifting platform 52 of the lifting platform 54 with pins of the substrate forming apparatus 50 illustrated in FIGS. 7A and 7B is formed on the inner surface of the lifting platform guide groove 51 b that is recessed from the side surface of the substrate mounting table 51 and extends in the vertical direction. Guided and raised or lowered manually or by switch operation.
The pin-equipped lift 54 has an initial position 541 (a position indicated by a solid line in FIG. 7B) where the upper surface 52 a of the lift base 52 substantially coincides with the substrate mounting table upper surface 51 a, and the initial position 541. It is possible to move to a retracted position 542 (a position indicated by an imaginary line in FIG. 7B) shifted downward. The retreat position 542 is such that the upper end of the pin 53 of the lifting platform 54 with the pin is positioned flush with the substrate mounting table upper surface 51a or below the substrate mounting table upper surface 51a (lower side in FIG. 7B), and the pin 53 is mounted on the substrate. This is a position that does not protrude above the mounting table upper surface 51a.
The initial position 541 is the rising limit position of the lifting platform 54 with the pin, and the retreat position 542 is the lowering limit position of the lifting platform 54 with the pin.

  The pair of movable pressing members 55a and 55b can move from an open position shown by a solid line in FIG. 7A to a closed position where they are closed together by sliding movement along the upper surface 51a of the substrate mounting table 51. The pair of movable pressing members 55a and 55b can sandwich the pair of rear piece portions 34 and 35 of the flexible wiring board 30 by moving from the open position to the closed position (closing operation). Further, the pair of movable pressing members 55a and 55b is set so that a position where the pair of rear piece portions 34 and 35 of the flexible wiring board 30 are sandwiched is set as a closed position, and the distance from the closed position is reduced. May be regulated.

  The closing operation of the pair of movable pressing members 55a and 55b and the movement from the closed state that sandwiches the pair of rear piece portions 34 and 35 of the flexible wiring board 30 to the opening position (opening operation) are performed manually or automatically by a switch operation. Done. In addition, the pair of movable pressing members 55a and 55b perform their opening and closing operations in conjunction with each other. The pair of movable pressing members 55a and 55b are simultaneously moved in directions opposite to each other in the opening operation and the closing operation.

As shown in FIG. 7 (a), in the illustrated substrate forming apparatus 50, the movable pressing members 55a and 55b in the open position are provided via a lifting guide groove 51b that opens to the outer peripheral portion of the substrate mounting table upper surface 51a. It is provided so as to project from the substrate mounting table 51 on both sides in the groove width direction onto the lifting table upper surface 52a.
The separation distance between the pair of movable pressing members 55a and 55b in the open position matches the spacing direction of the rear piece portions 34 and 35 on the mounting portion back surface 32b of the element mounting portion 32 of the flexible wiring board 30 illustrated in FIG. Are approximately the same as the extending direction dimension. As shown in FIG. 7A, the rear piece portions 34 and 35 of the flexible wiring board 30 are arranged in the gap 55c between the pair of movable pressing members 55a and 55b, respectively, in the interval direction between the pair of movable pressing members 55a and 55b. Can be inserted easily in a vertical direction.
The extending direction of the mounting portion back surface 32b coincides with the longitudinal direction (substrate longitudinal direction) of the flexible wiring board 30 before bending (bending) shown in FIG.

In the present specification, in the illustrated substrate forming apparatus 50, the interval direction between the pair of movable pressing members 55a and 55b is the width direction (vertical direction in FIG. 7A), and perpendicular to the width direction along the substrate mounting table upper surface 51a. Is treated as the front-rear direction (the left-right direction in FIGS. 7A and 7B). Further, in this specification, the substrate forming apparatus 50 in the illustrated example will be described with the left side of FIGS. 7A and 7B as the front and the right side as the rear.
The pin 53 of the lift platform 54 with the pin is located at a position spaced forward from the gap 55c between the pair of movable pressing members 55a and 55b in the front-rear direction of the apparatus. The pin 53 is located on the opposite side of the central portion of the substrate mounting table upper surface 51a from the gap 55c between the pair of movable pressing members 55a and 55b.

A flat mounting portion abutting surface 53a with which the element mounting portion 32 of the flexible wiring board 30 abuts on the back surface side (front side) of the pin 53 opposite to the gap 55c between the pair of movable pressing members 55a and 55b. Is formed.
The mounting portion contact surface 53a is formed perpendicular to the front-rear direction of the apparatus.
The mounting portion abutting surface 53a is a spacing direction of the rear piece portions 34 and 35 on the mounting portion back surface 32b of the element mounting portion 32 of the flexible wiring substrate 30 illustrated in FIG. 1 and the like (coincides with the substrate longitudinal direction of the flexible wiring substrate 30). Are aligned with the same dimension in the extending direction.
Further, the mounting portion abutting surface 53 a is formed over the entire front side of the portion of the pin 53 located on the lifting platform 52.

Further, the pin 53 has a cross section (a cross section perpendicular to the axial direction of the pin 53) in which the dimension in the width direction decreases from the mounting portion contact surface 53a to the rear side of the device (right side of FIGS. 7A and 7B). ) It is formed in a tapered shape.
The pin 53 shown in FIGS. 7A and 18A (indicated by reference numeral 53A in the figure) has a semicircular cross-sectional shape perpendicular to the axial direction. The peripheral surface of the pin 53A is a curved surface in which the entire rear side of the apparatus from the mounting portion contact surface 53a is curved with an axis parallel to the axis of the pin 53A.
The pin 53 is not limited to this. For example, as shown in FIG. 18B, the pin 53 has a cross-sectional shape perpendicular to the axial direction that is tapered from the mounting portion contact surface 53a toward the rear of the device ( A pin 53B) and a pin 53C extending in a cross-sectional shape in which the rear end portion of the pin 53B is curved can also be employed.

This board forming apparatus 50 is formed by bending the band-shaped flexible wiring board 30 shown in FIG. 2 (bending forming process) and bonding and fixing the two rear piece portions 34 and 35 formed by this bending (bonding fixing process). And can be suitably used.
Here, an example of the manufacturing method of the imaging module 10 including the process using the board | substrate shaping | molding apparatus 50 is demonstrated.

First, the image sensor 22 is mounted on the element mounting portion 32 of the strip-shaped flexible wiring board 30 shown in FIG. 2 (element mounting process).
Next, a substrate mounting step is performed in which the flexible wiring board 30 is mounted on the substrate mounting table 51 and on the lifting table upper surface 52a of the lifting platform 54 with the pin disposed at the initial position with respect to the substrate mounting table 51. FIG. The state shown in This substrate placing step is performed in a state where the pair of movable pressing members 55a and 55b are arranged at the open position.

As shown in FIG. 8, in this substrate mounting process, the element mounting portion 32 (specifically, the mounting portion rear surface 32a) of the flexible wiring board 30 is used as the mounting portion contact surface of the pin 53 of the lifting platform 54 with the pin. It abuts on 53a.
Further, in this substrate mounting process, both side portions (rear piece forming portions 340 and 350) are bent (bent) with respect to the element mounting portion 32 via the element mounting portion 32 in the substrate longitudinal direction of the flexible wiring substrate 30. The rear pieces 34 and 35 thus formed are inserted into the gap 55c between the pair of movable pressing members 55a and 55b. The pair of rear piece portions 34 and 35 are inserted into the gap 55c in a direction perpendicular to the interval direction of the pair of movable pressing members 55a and 55b, respectively.

As shown in FIG. 2, notches 33 are formed on both sides in the width direction (substrate width direction) orthogonal to the longitudinal direction of the flexible wiring board 30 on both sides in the extending direction of the element mounting portion 32 of the flexible wiring board 30. Yes. As shown in FIG. 8, in the substrate mounting process, the rear piece forming portions 340 and 350 on both sides are connected to the elements via the element mounting portions 32 in the substrate longitudinal direction of the flexible wiring board 30 using the notches 33. The rear piece portions 34 and 35 can be easily formed by bending (bending) the mounting portion 32.
In addition, the deformation of the element mounting portion 32 is restricted by the imaging element 22 that is disposed over substantially the entire mounting surface 32a that is the front surface thereof and integrated with the mounting surface 32a. This also effectively contributes to making it easier to bend the rear piece forming portions 340 and 350 with respect to the element mounting portion 32.

As shown in FIG. 2, in the flexible wiring substrate 30, the region where the notch 33 is formed in the longitudinal direction of the substrate is an easily deformable portion 30 c that is narrower than both sides of the region.
The flexible wiring board 30 is configured such that an easily deformable portion 30 c exists between the element mounting portion 32 and the rear piece forming portions 340 and 350 on both sides thereof.
As shown in FIGS. 1 and 7A, when the flexible wiring board 30 is formed with the rear piece portions 34 and 35 bent with respect to the element mounting portion 32, the easily deformable portion 30c is bent. 30d. In FIG. 1, the rear piece portions 34, 35 of the flexible wiring board 30 specifically extend from the bent portions 30 d on both sides of the element mounting portion 32 to the rear side of the element mounting portion 32.

Note that the notches 33 are not necessarily formed on both sides of the flexible wiring board 30 in the board width direction. As the flexible wiring board 30, a configuration in which the notch 33 is formed only on one side in the board width direction on both sides in the extending direction of the element mounting part 32 can also be adopted.
As shown in FIGS. 1 and 7A, the bent portions 30 d on both sides of the element mounting portion 32 protrude from the range facing the image sensor 22 in the element mounting portion 32. The bending portions 30d on both sides of the element mounting portion 32 in the illustrated example are easily deformable portions 30c that project from the range facing the image sensor 22 of the element mounting portion 32 on which the image sensor 22 is mounted (projection range of the image sensor) to both sides. It is formed by bending. The configuration in which the easily deformable portion 30c protrudes from the element mounting portion 32 and does not overlap the range facing the imaging element 22 of the element mounting portion 32 is a work for bending the easily deformable portion 30c to form the bent portion 30d. The imaging element 22 does not become an obstacle, and the bent portion 30d can be formed smoothly.

As shown in FIGS. 2 to 4, the flexible wiring substrate 30 includes rear piece forming portions 340 and 350 among the wirings 36 formed on one side of the insulating base material 30 a that is formed in a film shape. Almost all of the portion located at is covered with an electrically insulating coating resin layer 30b (covering layer, for example, a solder resist) laminated on the insulating base 30a.
The covering resin layer 30b is laminated on the surface (wiring forming surface) of the insulating base material 30a on the wiring 36 side over substantially the entire rear piece forming portion 340, 350 of the flexible wiring substrate 30. Almost all of the rear piece forming portions 340 and 350 of the flexible wiring board 30 are covered portions having a structure in which the covering resin layer 30b is laminated on one side of the insulating base material 30a. On the other hand, the element mounting part 32 and the easily deformable part 30c are not provided with the coating resin layer 30b, but are a wiring exposed part 30e where the wiring 36 is exposed (see FIG. 2 and the like). Therefore, the easily deformable portion 30c is easier to bend than the rear piece forming portions 340 and 350.

Further, as shown in FIGS. 2 and 3A to 3G, the rear piece portion forming portions 340 and 350 are opposite to the element mounting portion 32 from the central portion in the extending direction (substrate longitudinal direction). The portions on the side are the reinforcing portions 34g and 35g in which the sheet-like reinforcing material 30g is adhered and integrated on the surface opposite to the wiring forming surface of the insulating base material 30a via the adhesive layer 30f. The sheet-like reinforcing material 30g is not attached to the element mounting part 32 side, the easily deformable part 30c, and the element mounting part 32 from the reinforcing parts 34g and 35g of the rear piece forming parts 340 and 350. The terminal portions 34c, 34d, 35c, and 35d are disposed on the reinforcing portions 34g and 35g.
The non-reinforcing extending portions 34h and 35h on the element mounting portion 32 side from the reinforcing portions 34g and 35g of the rear piece forming portions 340 and 350 of the flexible wiring board 30 are easier to bend than the reinforcing portions 34g and 35g, and the easily deformable portion 30c. Is easier to bend than the unreinforced extending portions 34h, 35h of the rear piece forming portions 340, 350.

  The reinforcing portions 34g and 35g are portions constituting the connecting piece portions 34f and 35f (see FIGS. 1 and 7A) of the rear piece portions 34 and 35 of the flexible wiring board 30 bent and formed as shown in FIG. Used as Further, the extended portions 34e and 35e of the flexible wiring board 30 bent and formed as shown in FIG. 1 are formed by unreinforced extended portions 34h and 35h.

Further, as shown in FIG. 2, the reinforcing portions 34g and 35g of the two rear piece forming portions 340 and 350 of the flexible wiring board 30 are respectively connected to the unreinforced extending portions 34h and the rear piece forming portions 340 and 350, respectively. It is formed wider than 35h. Even in this configuration, the two rear piece forming portions 340 and 350 of the flexible wiring board 30 are easier to bend in the unreinforced extending portions 34h and 35h than in the reinforcing portions 34g and 35g.
The end portions on the reinforcing portions 34g and 35g side of the non-reinforcing extending portions 34h and 35h of the rear piece forming portions 340 and 350 are formed in a taper shape whose width dimension increases along the reinforcing portions 34g and 35g side. It is a tapered part.

  In FIG. 2, the coating resin layer 30b is formed avoiding the terminal portions 34c, 34d, 35c, and 35d of the rear piece forming portions 340 and 350. Therefore, the terminal portions 34c, 34d, 35c, and 35d are not covered with the coating resin layer 30b, and the surface (terminal surface) opposite to the insulating base material 30a is the coating resin for the rear piece forming portions 340 and 350. It is exposed on the surface on the layer 30b side.

As shown in FIG. 3A, the terminal portions 34c, 34d, 35c, and 35d in the illustrated example are on the surface opposite to the insulating base material 30a of the pad portion 36d formed integrally with the wiring 36. The terminal part protective plating 36e such as gold is formed. The terminal surfaces of the terminal portions 34c, 34d, 35c, 35d opposite to the insulating base material 30a are formed by terminal portion protective plating 36e. As the metal material for forming the terminal portion protective plating 36e, a material having excellent solder adherence, such as the gold described above, is employed.
However, as the terminal portions 34c, 34d, 35c, and 35d, it is possible to adopt a configuration including only the pad portion 36d without forming the terminal portion protective plating 36e.

Also, as shown in FIGS. 2 to 4, the portion of the wiring 36 of the flexible wiring board 30 that is located at the end portion on the element mounting portion 32 side of the wiring exposed portion 30 e and the rear piece forming portions 340 and 350 is: A wiring portion 36c with protective plating is covered with a protective plating 36b formed on the surface thereof.
As the flexible wiring board 30, for example, one having a configuration in which a protective plating 36 b made of a metal material having excellent extensibility such as gold plating is formed on a copper wiring 36 (copper wiring).
With this configuration, the wiring 36 is less likely to cause disconnection or the like of portions located at the easily deformable portion 30c and the bent portion 30d. Therefore, the easily deformable portion 30c and the bent portion 30d of the flexible wiring board 30 are configured to be easier to bend than the unreinforced extending portions 34h and 35h, but are less likely to cause the disconnection of the wiring 36.

When the substrate mounting process is completed, the pair of movable pressing members 55a and 55b in the open position are closed and the rear piece portions 34 and 35 are bent with respect to the element mounting portion 32, and the rear piece portions 34 and 35 are formed. A bending process for forming the extending portions 34e and 35e is performed.
Here, in order to obtain the flexible wiring board 30 having the shape shown in FIGS. 1 and 5A, the pair of rear piece portions 34 and 35 of the flexible wiring board 30 are sandwiched between the pair of movable pressing members 55a and 55b. The pair of movable pressing members 55a and 55b are aligned with the reinforcing portions 34g and 35g side end portions of the unreinforced portions 34h and 35h of the rear piece portions 34 and 35, respectively, so that the pair of rear piece portions 34 and 35 are aligned. Is inserted. The pair of movable pressing members 55a and 55b are aligned so as not to sandwich the reinforcing portions 34g and 35g.
Thereby, the rear piece parts 34 and 35 of the flexible wiring board 30 are in a state in which the opposing surfaces 34a and 35a are joined to each other. At this time, the flexible wiring board 30 extends to the rear piece portions 34 and 35 depending on the relationship between the width direction dimension of the mounting portion contact surface 53a of the pin 53 and the separation distance between the pair of movable pressing members 55a and 55b. Outlet portions 34e and 35e and connection piece portions 34f and 35f are formed.

Further, a triangular gap 31 between the extended portions is formed at the front end portion of the flexible wiring substrate 30 (bending molded substrate) that has been bent.
The pins 53 of the substrate molding apparatus 50 are inserted into the gaps 31 between the extension portions of the flexible wiring substrate 30 (bending molded substrate).

As shown in FIGS. 2 and 6, the reinforcing portion 34 g of the first rear piece portion 34 of the flexible wiring board 30 has a width dimension W <b> 1 compared to the width dimension W <b> 2 of the reinforcing portion 35 g of the second rear piece portion 35. It is formed slightly smaller.
With this configuration, for example, as shown in FIG. 6, the flexible wiring board 30 is configured such that the reinforcing portion 34 g of the first rear piece portion 34 is replaced with the second rear piece with respect to the reinforcing portion 35 g of the second rear piece portion 35. It is easy to align and join so as not to protrude from the reinforcing portion 35g of the portion 35 in the width direction. This is effective in reliably preventing an unnecessary increase in the dimension in the width direction (upper and lower in FIG. 6) of the extending tail portion 38, and contributes effectively to reducing the diameter of the imaging tip unit 12 of the imaging module 11 with a lens. To do.

When the bending process is completed, as shown in FIG. 9, the pair of rear piece portions 34 and 35 of the flexible wiring board 30 (bending molded board) is sandwiched between the pair of movable pressing members 55a and 55b. The lift 54 with pins is lowered from the initial position and moved to the retracted position, and the pins 53 are removed from the gaps 31 between the extended portions of the flexible wiring board 30 (pin removal step).
Next, a resin 39 is filled in the gap 31 between the extended portions of the flexible wiring board 30, the resin 39 is cured, and the rear piece portions 34 and 35 are bonded and fixed (adhesive fixing step).

As shown in FIG. 9, the filling of the resin 39 into the gap 31 between the extension portions of the flexible wiring board 30 uses, for example, an injector 59 having a nozzle portion 59 a in which the tip can be inserted into the gap 31 between the extension portions. Therefore, it can be performed efficiently.
As resin 39, what has sclerosis | hardenability and what can adhere and fix back piece parts 34 and 35 mutually by hardening is employ | adopted. Examples of the resin 39 include a dry curing type, a multiple liquid reaction type such as a two liquid reaction type, a moisture curing type, a photocuring type such as an ultraviolet curing type, and a heat curing type that cures by heating. Can be mentioned.
Moreover, as resin 39, a thing with a viscosity of 4000-7000 cps can be used suitably.
An example of a suitable resin 39 is a thermosetting epoxy resin.

When the bonding and fixing step is completed, the pair of movable pressing members 55a and 55b of the substrate forming apparatus 50 are opened by an opening operation, and the terminal portions 34c and 34d of the flexible wiring board 30 (bend-formed substrate) taken out from the substrate forming apparatus 50, A cable connecting step of soldering the conductors (inner conductor 2a, outer conductor 2b) of the built-in electric cable 2 to 35c and 35d is performed.
Next, as shown in FIG. 5A, the insulating tube 25 that has been extrapolated in advance to the electric cable 1 (or the built-in electric cable 2 that has been extended from the outer end of the outer sheath) is attached to the flexible wiring board 30. On the other hand, it moves toward the front side (element mounting portion 32 side). As a result, as shown in FIGS. 5B and 6, the entire extended tail portion 38 of the flexible wiring board 30 (bend-formed board) is arranged inside the insulating tube 25, and the front end portion of the built-in electric cable 2 and the conductor connection portion. It is accommodated together with (inner conductor connection part 37a, outer conductor connection part 37b). And as shown in FIG.5 (b), the resin 26 is inject | poured inside the insulation tube 25, it fills and it hardens | cures, and the insulation tube 25 is adhesively fixed to the flexible wiring board 30 and the front-end | tip part of the built-in electric cable 2, Integrate.

The entire extended tail portion 38, the tip of the built-in electric cable 2 and the conductor connecting portion are accommodated inside the insulating tube 25, and the insulating tube 25 is accommodated inside by the resin 26 filled and cured inside the insulating tube 25. Hereinafter, the process of bonding and integrating with the accommodation (such as the flexible wiring board 30) is also referred to as a tube bonding process.
Moreover, in the manufacturing method (assembly method) of the imaging module 10, the process of fixing the lens unit 24 to the imaging element 22 to which the cover member 23 is attached in advance is also performed. The implementation timing of the process of attaching the lens unit 24 may be any time as long as it is after the completion of the element mounting process for mounting the imaging element 22 mounted on the element mounting portion 32 of the flexible wiring board 30, and is not particularly limited.
The assembly of the imaging module 10 is completed by completing the process of attaching the lens unit 24 and the tube bonding process.

As a manufacturing method (assembly method) of the imaging module 10, the imaging element 22 is mounted on the element mounting portion 32 after the completion of the substrate mounting process, instead of performing the element mounting process before the substrate mounting process. You may make it perform an element mounting process.
The implementation timing of the element mounting process in the manufacturing method of the imaging module 10 may be before the process of attaching the cover member 23 and the lens unit 24, and there is no particular limitation other than that.

In the method for manufacturing the imaging module 10 according to the embodiment of the present invention, the shape stability of the flexible wiring board 30 can be secured without using a shape maintaining member as in Patent Document 3. Moreover, in this manufacturing method, when using a shape maintenance member, the effort of positioning a flexible wiring board with respect to a shape maintenance member is unnecessary.
For this reason, in this manufacturing method, it is possible to easily obtain the flexible wiring board 30 (bend-formed board) having high shape stability in the element mounting portion 32 and the vicinity thereof (the front end portion of the flexible wiring board 30) at low cost. it can.

The insulating tube is not limited to a cylindrical one (see FIG. 6). For example, as shown in FIG. 15, a half structure that is assembled by joining and integrating a pair of tube divided bodies 25a and 25b. (Insulating tube 25A) can also be employed.
As the pair of tube divided bodies 25a and 25b, resin-made materials such as polyimide can be used in the same manner as the insulating tube 25 described above. The insulating tube 25A having a halved structure is assembled into a cylindrical shape by integrating the tube divided bodies 25a and 25b by, for example, adhesive fixing using an adhesive, heat welding, or the like.

  When the insulating tube 25A having the half structure is used, in the operation of accommodating the extended tail portion 38 of the flexible wiring board 30 inside thereof, the insulating tube 25A is formed with respect to the flexible wiring board 30 like the insulating tube 25 which is a cylindrical integrally formed product. There is no need to slide from the rear side to the front side. When this insulating tube 25A is used, it can be assembled by joining and integrating the pair of tube divided bodies 25a and 25b to each other, so that the conductor connecting portion (internal conductor connecting portion 37a, There is an advantage that it is possible to avoid the occurrence of troubles such as contact with the outer conductor connecting portion 37b) and tearing.

The imaging module 10 illustrated in FIG. 1 has a configuration in which the entire extended tail portion 38 of the flexible wiring board 30 is accommodated in the insulating tube 25 and bonded and integrated with the resin 26.
The imaging module according to the embodiment of the present invention is not limited to this.
For example, as shown in FIGS. 10 and 11, the position of the insulating tube 25 in the front-rear direction (the left-right direction in FIGS. 10 and 11) with respect to the flexible wiring substrate 30 (bending molded substrate) can be changed.

10 and 11, the extending tail portion 38 is accommodated in the insulating tube 25 that is arranged to be separated from the extending portion 35 e of the rear piece portions 34 and 35 to the rear side.
The front end of the insulating tube 25 of the imaging module 10 </ b> A in FIG. 10 is disposed in front of the inner conductor connecting portion 37 a of the rear piece portions 34 and 35.
The insulating tube 25 of the imaging module 10B of FIG. 11 covers a part of the inner conductor connecting portion 37a of the rear piece portions 34 and 35, and the flexible wiring board 30 at the front end at a position that does not cover the front side of the covered portions. The position in the front-rear direction is adjusted and arranged.
Note that the imaging modules 10A and 10B in FIGS. 10 and 11 are different from the imaging module 10 in FIG. 1 only in the installation position of the insulating tube 25 in the front-rear direction with respect to the flexible wiring board 30.

  Moreover, as an imaging module of the embodiment according to the present invention, as shown in FIG. 12, a configuration (imaging module 10C) in which an insulating tube is omitted can be employed.

  An endoscope according to an embodiment of the present invention includes an imaging module according to an embodiment of the present invention housed in a sleeve-shaped metal frame member together with a lens unit fixed to an imaging element. If it is an imaging module of embodiment concerning an invention, there will be no limitation in particular. As the imaging module housed in the metal frame member of the endoscope, the imaging modules 10A, 10B, and 10C disclosed in FIGS. 11 to 12 can be employed in addition to the imaging module 10 illustrated in FIG.

The imaging module 10D shown in FIG. 16 is characterized in that the insulating tube 28 is extrapolated and integrated with each of the two rear pieces 34 and 35 of the flexible wiring board 30 (bend-formed board). This is different from the imaging module 10 illustrated in FIG.
Each insulating tube 28 is made of the built-in electric cable 2 in which a conductor is soldered to the terminal portions of the flexible wiring board 30 (bending molded board) and the rear piece portions 34 and 35 by the resin 26 filled and cured inside. It is integrated by bonding and fixing to the tip.

  The two rear pieces 34 and 35 of the flexible wiring board 30 of the imaging module 10D are extended at an acute angle with respect to the element mounting part 32 from both sides of the element mounting part 32 (an acute angle with respect to the mounting part back surface 32b). It has the protrusion parts 34e and 35e, and the connection piece parts 34f and 35f extended to the back side from this extension part 34e. However, the flexible wiring board 30 of the imaging module 10D has a configuration in which the connection piece portions 34f and 35f of the two rear piece portions 34 and 35 are not directly joined to each other. Reference numeral 30A is added to the flexible wiring board 30 (bending-formed board) of the imaging module 10D.

The flexible wiring board 30A has a pair of rear piece portions 34 and 35 bonded and fixed to each other by a resin 39 filled and cured in an inner space surrounded by the element mounting portion 32 and the extending portions 34e and 35e on both sides thereof. Has been.
In the flexible wiring board 30A, the front end portion constituted by the element mounting portion 32 and the extending portions 34e and 35e on both sides thereof is integrated by the resin 39, and the shape stability of the front end portion is ensured.

FIG. 16 shows that the two insulating tubes 28 of the imaging module 10D accommodated in the metal frame member 41 are bonded and fixed to the metal frame member 41 with a resin 27 that is filled between the metal frame member 41 and the insulating tube 28 and cured. The imaging module 11A with a lens which has the imaging front-end | tip unit 12A of the integrated structure is shown.
The two insulating tubes 28 of the imaging module 10 </ b> D are bonded and fixed to each other by the resin 27 inside the metal frame member 41 and integrated.

In this imaging module 10D as well, the installation position of the insulating tube 28 in the front-rear direction with respect to the flexible wiring board 30 only needs to be behind the extending portions 34e and 35e at the front end of the flexible wiring board 30A, and can be changed as appropriate. It is.
Further, as the insulating tube, instead of the insulating tube 28 which is a sleeve-shaped integrally formed product, a half-structured structure which is assembled into a cylindrical shape by being integrated with each other by resin fixing or heat welding or the like is adopted. It is also possible.

Although the present invention has been described based on the best mode, the present invention is not limited to the above-described best mode, and various modifications can be made without departing from the gist of the present invention.
For example, the flexible wiring board (bend-formed board) of the imaging module according to the present invention has a configuration in which the extending parts extending from both sides of the element mounting part to the rear side are inclined at an acute angle with respect to the element mounting part. It is not limited. As a flexible wiring board (bend-formed board), only one of the two extending parts is inclined at an acute angle with respect to the element mounting part, and the other extending part is substantially perpendicular to the element mounting part to the rear thereof. A configuration in which the connecting piece extends from the rear end of each extending portion to the rear can also be employed. In this case, in addition to a configuration having an extended tail portion obtained by joining the connection piece portions, a configuration in which the two connection piece portions are spaced apart from each other can also be employed. Here, in the case of the configuration in which the two connection piece portions are spaced apart from each other, for example, one or both of the opposing surfaces of the two connection piece portions have wiring and a terminal portion for connecting an electric cable. Then, a configuration is adopted in which this wiring is electrically connected to the wiring on the mounting surface side of the element mounting portion through a through-hole wiring provided in the rear piece.

In addition, the flexible wiring board (bend-formed board) is not limited to the configuration in which the connecting piece part extends backward from the rear end of each extending part extending from both sides of the element mounting part to the rear side. It is also possible to adopt a configuration in which the one part is folded back from the rear end of the extension part to the element mounting part side and disposed between the two extension parts.
In this case, as the flexible wiring board, a configuration is adopted in which each connection piece has a terminal portion for connecting the wiring and the electric cable on the surface facing the extending portion to which each connection piece is connected. In addition, for example, a cable insertion hole is formed at the boundary between the extension part and the connection piece part, and the conductor of the built-in electric cable passed through the cable insertion hole is soldered to the terminal part of the connection piece part for electrical connection. To do.

DESCRIPTION OF SYMBOLS 1 ... Electric cable (cable unit), 2 ... Built-in electric cable, 2a ... Internal conductor, 2b ... External conductor, 3 ... Outer jacket,
DESCRIPTION OF SYMBOLS 10, 10A-10D ... Imaging module, 11, 11A ... Imaging module with lens, 12, 12A ... Imaging tip unit, 21 ... Imaging part, 21a ... Light-receiving surface, 22 ... Solid-state image sensor, 23 ... Cover member, 24 ... Lens Unit, 24a ... barrel, 25, 25A ... insulation tube, 25a, 25b ... (insulation tube) member (tube segment), 26 ... resin, 27 ... resin, 28 ... insulation tube,
30, 30A ... Flexible wiring board, 30a ... Insulating base material, 30b ... Covering resin layer, 30c ... Easily deformable part, 30d ... Bending part, 30e ... Wiring exposed part, 31 ... Space (gap between extension parts), 32 ... Element mounting portion, 32a ... mounting surface, 32b ... back surface of mounting portion, 33 ... notch portion, 34 ... rear piece portion (first rear piece portion), 34a ... opposite surface, 34b ... outer surface, 34c ... terminal portion (inside Conductor terminal part), 34d ... terminal part (external conductor terminal part), 34e ... extension part, 34f ... connection piece part, 35 ... rear piece part (second rear piece part), 35a ... opposing surface, 35b ... 35a ... terminal part (terminal part for external conductor), 35e ... extension part, 35f ... connection piece part, 36 ... wiring, 37a ... cable connection part (internal) Conductor connection part), 37b ... Cable connection part (outer conductor connection part), 38 ... Extension Part, 39 ... resin,
DESCRIPTION OF SYMBOLS 50 ... Flexible wiring board shaping | molding apparatus, 51 ... Flexible wiring board mounting base, 52 ... Elevating base, 53, 53A, 53B, 53C ... Pin, 53a ... Mounting part contact surface, 54 ... Elevating base with pin, 541 ... (pin The initial position of the lifting platform with 542, the comparative position of the lifting platform with the pin, 41, the metal frame member, 70, the endoscope, 71, the tube, 72, the lumen, 75, the insertion portion.

In order to solve the above problems, the present invention provides the following configuration.
According to a first aspect of the present invention, there is provided an element mounting step of mounting a solid-state imaging device on an element mounting portion at a longitudinal center of an elongated flexible wiring board, and the elements on both sides of the flexible wiring board via the element mounting section. Bending with respect to the mounting part, two extending parts extending from the element mounting part to the back side opposite to the mounting surface on which the solid-state imaging device is mounted, and 2 extending from each extending part The resin is filled in the inner region surrounded by the bending process for forming two connecting pieces, the two extending parts formed in this bending process and the element mounting part, and the two extending parts the provides a bonded adhering fixed, the manufacturing method of the imaging module and a cable connecting step for connecting the electrical cable to the connecting piece portion formed by the bending process.
According to a second aspect of the present invention, a pin is projected on a flexible wiring board mounting table on which a flexible wiring board is mounted, and a lifting table that can be raised and lowered with respect to the flexible wiring board mounting table. A lifting platform with a pin formed with a flat mounting portion contact surface with which an element mounting portion at the center in the longitudinal direction of the flexible wiring substrate contacts, and a slide along the upper surface of the flexible wiring substrate mounting table A pair of movable pressing members provided with variable separation distances by movement, and the pin-equipped lift platform has an initial position where the top surface of the lift platform substantially coincides with the top surface of the flexible wiring board mounting table by the lift. A flexible wiring board molding apparatus is provided that is movable from the initial position to a lower retreat position.
According to a third aspect of the present invention, a pin is projected on a flexible wiring board mounting table on which a flexible wiring board is mounted, and a lifting table that can be moved up and down with respect to the flexible wiring board mounting table. A lifting platform with a pin formed with a flat mounting portion contact surface with which an element mounting portion at the center in the longitudinal direction of the flexible wiring substrate contacts, and a slide along the upper surface of the flexible wiring substrate mounting table A pair of movable pressing members provided with variable separation distances by movement, and the pin-equipped lift platform has an initial position where the top surface of the lift platform substantially coincides with the top surface of the flexible wiring board mounting table by the lift. Using the flexible printed circuit board molding apparatus that is movable from the initial position to the lower retracted position, the pin mounting portion contact surface of the lifting platform with the pin disposed at the initial position The element mounting part of the flexible wiring board is brought into contact, and both parts are bent with respect to the element mounting part via the element mounting part of the flexible wiring board and extended from the element mounting part to the rear side opposite to the mounting surface. The flexible printed circuit board mounting step in which the rear piece is placed in the gap between the pair of movable pressing members in the open state, and then the pair of movable pressing members are brought close to each other to form a pair of rear pieces of the flexible wiring board A bending process for forming the two extending portions and the two connecting pieces extending from each extending portion by bringing the portions close to each other, and then lowering the lifting platform with pins from the initial position to the retracted position, mounting portion and drained off the pin from the space surrounded by the extended portion on both sides, and bonded solidifying by filling a resin into the space, electrical to the connecting piece portion formed at the bending step Providing a cable connecting step for connecting the Buru, an element mounting step of mounting the solid-state imaging device in the element mounting portion of the flexible wiring board, a manufacturing method of the imaging module having.

Claims (3)

An element mounting step of mounting a solid-state image sensor on an element mounting portion in the center in the longitudinal direction of the elongated flexible wiring board;
Bends on both sides of the flexible wiring board through the element mounting portion with respect to the element mounting portion, and extends from the element mounting portion to the back side opposite to the mounting surface on which the solid-state imaging device is mounted. Bending process for forming two extending portions and two connecting piece portions extending from each extending portion;
An adhesive fixing step of filling the inner region surrounded by the two extending portions formed in the bending molding step and the element mounting portion, and bonding and fixing the two extending portions;
A method of manufacturing an imaging module, comprising: a cable connection step of connecting an electric cable to a terminal portion provided on each of the outer surface sides of the two connection pieces formed in the bending step. A flexible wiring board mounting table on which the flexible wiring board is mounted;
A flat mounting in which a pin protrudes on a lifting platform that can be moved up and down relative to the flexible wiring board mounting table, and an element mounting portion at the center in the longitudinal direction of the elongated flexible wiring board is in contact with the outer periphery of the pin A lifting platform with a pin formed with a contact surface;
On the flexible wiring board mounting table, a pair of movable pressing members provided with variable separation distance by sliding movement along the upper surface thereof,
A flexible wiring board molding apparatus, wherein the lifting platform with pins is movable up and down to an initial position where an upper surface of the lifting platform substantially coincides with an upper surface of the flexible wiring board mounting table and a retracted position below the initial position. A pin protrudes on a flexible wiring board mounting table on which the flexible wiring board is mounted and a lifting table that can be raised and lowered relative to the flexible wiring board mounting table. A lifting platform with a pin on which a flat mounting portion contact surface with which an element mounting portion at the center in the direction contacts is formed, and a separation distance from each other by sliding movement along the upper surface of the flexible wiring board mounting table A pair of movable pressing members provided so as to be variable, and the lifting platform with pins has an initial position where the upper surface of the lifting platform substantially coincides with the upper surface of the flexible printed circuit board by the lifting and lowering, and the lower position from the initial position. Using a flexible wiring board molding device that can move to the retreat position,
The element mounting part of the flexible wiring board is brought into contact with the mounting part contact surface of the pin of the lifting platform with pins arranged at the initial position, and both sides are made into the element mounting part via the element mounting part of the flexible wiring board. A flexible wiring board mounting step for arranging a rear piece portion bent against the element mounting portion and extending to the rear side opposite to the mounting surface in a gap between a pair of open movable pressing members;
Next, a bending process of forming a pair of movable pressing members close to each other and a pair of rear piece portions of the flexible wiring board close to each other to form two extending portions and two connecting piece portions extending from each extending portion. When,
Next, lowering the lifting platform with pins from the initial position to the retracted position, pulling out the pins from the space surrounded by the element mounting portion and the extending portions on both sides thereof, and filling and fixing the space with resin Process,
A cable connection step of connecting an electric cable to the terminal portions respectively provided on the outer surface sides of the two connection pieces formed in the bending step;
An element mounting process for mounting a solid-state imaging element on an element mounting portion of a flexible wiring board;
Manufacturing method of imaging module having

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