JP2013088525A - Camera module and method for manufacturing camera module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a camera module having a lens drive unit connected to a substrate with a terminal integrated to a plurality of wirings, allowing the relative position of the individual components of the camera module to be accurately arranged.SOLUTION: A lens drive unit 6 is mounted on a sensor cover part 8 mounted on a substrate. The lens drive unit 6 is fastened to a substrate 2 with a photocurable resin 15 in advance, and then the lens drive unit 6 is fastened to the sensor cover part 8 with a thermosetting resin 13.

Description

  The present invention relates to a camera module and a method for manufacturing the camera module, and more particularly to a camera module in which a lens driving unit and a substrate are connected to each other by a terminal integrated with a plurality of wires, and a method for manufacturing the camera module. is there.

  In recent years, an increasing number of models are equipped with cameras in terminals such as mobile phones, portable game machines, and portable music players. Since such a terminal is required to be small and thin, a camera mounted on the terminal is also required to be small and thin. Therefore, a camera mounted on a terminal is generally configured by modularizing each member such as a lens and an image sensor.

  Here, an example of the configuration of a conventional camera module will be described with reference to FIG. FIG. 5 is an exploded view showing an example of the configuration of a conventional camera module. As shown in FIG. 5, the camera module 51 includes a substrate 52, a sensor element 53, a sensor cover portion 58, a lens driving unit 56, and a lens 57.

  A sensor element 53 is disposed on the substrate 52, and the substrate 52 and the sensor element 53 are electrically connected by a bonding wire or the like. The board 52 outputs the electrical signal (image data) acquired from the sensor element 53 to, for example, a control unit (not shown) of a terminal on which the camera module 51 is mounted via the camera module terminal 61.

  The sensor element 53 receives the light collected by the lens 57 and converts the optical signal into an electrical signal. The sensor element 53 is configured by, for example, a CCD (Charge Coupled Device) sensor element or a CMOS (Complementary Metal Oxide Semiconductor) sensor element.

  The sensor cover portion 58 is disposed on the substrate 52 above the sensor element 53 and seals the sensor element 53. By disposing the sensor cover portion 58, dust or the like is prevented from entering the space closed by the sensor cover portion 58, the sensor element 53, and the substrate 52.

  The sensor cover portion 58 includes a sensor cover housing 54 and a lid glass 55 that fits into a recess on the top surface side of the sensor cover housing 54. The sensor cover housing 54 protects the sensor element 53 from impact or the like. The lid glass 55 has an infrared cut filter function and blocks infrared light out of the light collected by the lens 57.

  The lens driving unit 56 holds the lens 57 and adjusts the position of the lens 57. The lens driving unit 56 is fixedly mounted on the sensor cover portion 58 so that the lens 57 and the sensor element 53 are positioned on the same optical axis. The lens driving unit 56 includes a lens driving terminal 62a. The lens driving terminal 62a and the lens driving terminal 62b of the substrate 52 are connected, and the lens driving unit 56 and the substrate 52 are electrically connected. The lens driving unit 56 receives a control signal instructing driving of the lens from the control unit of the terminal on which the camera module 51 is mounted via the substrate 52, and drives the lens based on the control signal. Hereinafter, the lens driving terminal 62a and the lens driving terminal 62b are collectively referred to as a lens driving terminal 62.

  The camera module 51 may include a shutter and an ND (Neutral Density) filter on the same optical axis as the sensor element 53.

  In the camera module 51 shown in FIG. 5, the lens driving unit 56 has only an autofocus (AF) function. Therefore, the number of terminals for connecting the lens driving unit 56 and the substrate 52 is small (in the example shown in FIG. 5, the lens driving terminal 62a and the lens driving terminal 62b are each composed of three terminals). Therefore, when manufacturing the camera module 51 having only the AF function, it is common to directly connect the lens driving terminal 62a and the lens driving terminal 62b with solder.

  Next, the manufacturing process of the camera module 51 is demonstrated based on FIG. FIG. 6 is a diagram illustrating an example of the manufacturing process of the conventional camera module 51.

  First, the sensor cover portion 58 is disposed on the substrate 52 on which the sensor element 53 is mounted. From this state, a thermosetting resin 63 is applied onto the sensor cover housing 54 as shown in FIG. Next, as shown in FIG. 6B, the lens driving unit 56 is mounted (mounted) on the sensor cover portion 58 by the holding and conveying means 64. Then, as shown in FIG. 6C, heat 65 is applied to the thermosetting resin 63 to cure (cure) the thermosetting resin 63, and the lens driving unit 58 is fixed on the sensor cover portion 58. To do. Thereafter, the lens driving terminal 62a of the lens driving unit 56 and the lens driving terminal 62b of the substrate 52 are directly soldered.

  By the way, normally, in order for the light condensed by the lens 57 to form an image on the sensor element 53, the relative positions of the lens 57 and the sensor element 53 must be aligned with high accuracy. Therefore, in the camera module 51 in which each member is configured as an integral unit, it is required to arrange each member with high accuracy during manufacturing. In view of this, various manufacturing methods have been developed in which the members of the camera module are arranged with high accuracy.

  For example, in Patent Document 1, an image pickup device on a substrate, a transparent plate fixed with a predetermined gap with respect to the surface of the image pickup device, and a tubular cover are arranged to hold a lens. A method for manufacturing a camera module is described in which a tubular lens holder is inserted into an inner surface of a tube of a cover and arranged in contact with the surface of a transparent plate. Thus, since each member is arranged in contact with each other, each member can be arranged with high accuracy by designing the shape of each member in advance so that the relative positions of the imaging element and the lens are matched. .

  However, if the respective members are simply placed in contact with each other, the relative positions of the respective members may be out of the proper range due to variations in the external dimensions of the respective members. Therefore, there is a manufacturing method in which the members are joined using resin to fix the positions of the members.

  For example, Patent Document 2 discloses a sensor package including a substrate, an image sensor mounted on the substrate, and a cover glass that protects the image sensor, a lens, an IR cut filter, and a sensor package inside the sensor package. A method for manufacturing a camera module is described in which a lens structure including a holder member having a space to be accommodated is joined with a resin. More specifically, in the manufacturing method described in Patent Document 2, first, a photocurable resin is applied to the housing portion of the lens structure, and the sensor package is fitted into the holder member for positioning. Next, UV light is irradiated from a UV irradiation window provided in the lens structure to cure the photocurable resin. Then, a thermosetting resin is filled between the sensor package and the lens structure, and heat treatment is performed to cure the thermosetting resin.

JP 2006-148710 A (June 8, 2006) JP 2010-045650 A (February 25, 2010)

  In recent years, camera modules mounted on mobile phones are required to have the same functions as compact digital cameras, and there is a demand for higher performance and higher functionality of camera modules. For example, in addition to the AF function, a camera module having an optical zoom lens function and an optical camera shake correction function is required.

  In such a high-performance and high-function camera module, the number of lens drive terminals increases in order for the lens drive unit to perform various lens drives. Specifically, in a high-performance / high-function camera module, the lens driving terminal is, for example, several tens of pins. Therefore, like the conventional camera module, it is not practical to directly solder the terminals (Pin) to connect the lens driving unit and the substrate.

  Conventionally, in order to connect lens driving terminals composed of several tens of terminals, a connector terminal or a flexible printed board in which a plurality of wires are integrated is used for the connection.

  However, when a connector terminal or a flexible printed circuit board is used, there is a problem that the relative position of the lens driving unit may be shifted during the manufacturing process of the camera module.

  This problem will be specifically described with reference to FIG. FIG. 7 is a diagram illustrating an example of a manufacturing process of a camera module in which a lens driving unit and a substrate are connected by a connector terminal.

  First, the sensor cover portion 78 is disposed on the substrate 72 on which the sensor element 73 is mounted. From this state, a thermosetting resin 83 is applied onto the sensor cover housing 74 as shown in FIG. Next, as shown in FIG. 7B, the lens driving unit 76 is mounted (mounted) on the sensor cover portion 78 by the holding and conveying means 84. Then, as shown in FIG. 7C, heat 85 is applied to the thermosetting resin 83. Thereafter, the lens driving terminal 82a and the lens driving terminal 82b which are connector terminals are electrically connected.

  At this time, an external force may act on the lens driving unit due to interference between the connector terminals or between the connector terminal and another member. Since it takes time until the thermosetting resin is completely cured, the position of the lens driving unit may be shifted by this external force.

  In addition, when the lens driving unit and the substrate are connected by a flexible printed board, an external force such as a repulsive force against the bending stress of the flexible printed board may act on the lens driving unit.

  The present invention has been made in view of the above-described problems, and an object of the present invention is a camera module in which a lens driving unit and a substrate are connected to each other by a terminal in which a plurality of wirings are integrated. It is to realize a camera module in which the relative positions of these are arranged with high accuracy and a method of manufacturing the camera module.

  In order to solve the above problems, a method for manufacturing a camera module according to the present invention includes a substrate, a sensor element mounted on the substrate, a sensor cover portion that protects the sensor element and is mounted on the substrate, A camera module including a lens driving unit that holds a lens and drives the lens, wherein the lens driving unit and the substrate are electrically connected to each other through a connection portion in which a plurality of wirings are integrated. A manufacturing method, the step of applying a thermosetting resin to a first joint portion to be joined to the lens drive unit on the sensor cover portion, the step of mounting the lens drive unit on the sensor cover portion, A step of applying a photocurable resin to a second bonding portion to be bonded to the substrate in the lens driving unit; Irradiating, and the step of applying heat to the thermosetting resin, a step of electrically connecting the substrate and the lens drive unit via the connecting portion, characterized in that it comprises a.

  According to said structure, before the process of applying heat to the said thermosetting resin, the said photocurable resin is hardened and the said lens drive unit and the said board | substrate are joined. Next, the thermosetting resin is cured, and the lens driving unit and the sensor cover unit are joined. Finally, the lens driving unit and the substrate are electrically connected via the connecting portion.

  Therefore, even if an external force caused by connecting the connecting portion acts on the lens driving unit before the lens driving unit and the sensor cover portion are fixed, the lens driving unit and the substrate are Since it is fixed by the photo-curing resin, the relative position of the lens driving unit does not shift.

  Therefore, there is an effect that the relative positions of the respective members constituting the camera module in which the lens driving unit and the substrate are electrically connected to each other through a connection portion in which a plurality of wirings are integrated can be arranged with high accuracy. .

  In the method for manufacturing a camera module according to the present invention, it is preferable that the connection portion is a connector terminal.

  In the camera module manufacturing method according to the present invention, it is preferable that the connection portion is a flexible substrate.

  In order to solve the above problems, a camera module according to the present invention protects a substrate, a sensor element mounted on the substrate, a sensor cover portion mounted on the substrate, and a lens. And a lens driving unit for driving the lens. The lens driving unit is mounted on the sensor cover part, and the lens driving unit and the substrate are electrically connected to each other by a connection part in which a plurality of wires are integrated. A camera module to be connected, wherein a first joining portion for joining the sensor cover portion and the lens driving unit with a thermosetting resin, and a first joining portion for joining the lens driving unit and the substrate with a photocurable resin. It is characterized by having two joint portions.

  According to said structure, a 1st junction part joins the said sensor cover part and the said lens drive unit with thermosetting resin, and a 2nd junction part joins the said lens drive unit and the said board | substrate with photocurable resin. To do.

  Here, in general, it takes a relatively long time to cure the thermosetting resin, and the photocurable resin is cured in a relatively short time.

  Therefore, even if an external force caused by connecting the connecting portion acts on the lens driving unit before the lens driving unit and the sensor cover portion are fixed, the lens driving unit and the substrate are Since it is fixed by the photo-curing resin, the relative position of the lens driving unit does not shift.

  Therefore, there is an effect that the relative positions of the respective members constituting the camera module in which the lens driving unit and the substrate are electrically connected to each other through a connection portion in which a plurality of wirings are integrated can be arranged with high accuracy. .

  As described above, the method for manufacturing a camera module according to the present invention includes a step of applying a thermosetting resin to the first joint portion that joins the lens driving unit on the sensor cover portion, and the sensor cover portion. Mounting the lens driving unit; applying a photocurable resin to a second joint portion of the lens driving unit that is bonded to the substrate; irradiating the photocurable resin with light; and A step of applying heat to the curable resin, and a step of electrically connecting the lens driving unit and the substrate via the connecting portion.

  Further, the camera module according to the present invention joins the sensor cover part and the lens driving unit with a thermosetting resin, and joins the lens driving unit and the substrate with a photocurable resin. It is the structure provided with the 2nd junction part.

  Therefore, there is an effect that the relative positions of the respective members constituting the camera module in which the lens driving unit and the substrate are electrically connected to each other through a connection portion in which a plurality of wirings are integrated can be arranged with high accuracy. .

1, showing an embodiment of the present invention, is an exploded view showing an example of the configuration of a camera module. FIG. It is an exploded view which shows another example of a structure of the said camera module. It is a figure which shows an example of the manufacturing process of the said camera module. It is an external view of the said camera module. It is an exploded view which shows a prior art and shows an example of a structure of the camera module which has only AF function. It is a figure which shows a prior art and shows an example of the manufacturing process of the camera module which has only AF function. It is a figure which shows a prior art and shows an example of the manufacturing process of a highly functional camera module.

  Hereinafter, embodiments of the present invention will be described in detail. It should be noted that the dimensions, materials, shapes, relative arrangements, and the like of the components described in this embodiment are not intended to limit the scope of the present invention only to those unless otherwise specified. It is only an illustration.

[Configuration of camera module]
First, an example of the configuration of the camera module according to the present invention will be described with reference to FIG. FIG. 1 is an exploded view showing an example of the configuration of a camera module according to the present invention. As shown in FIG. 1, the camera module 1 includes a substrate 2, a sensor element 3, a sensor cover portion 8, a lens driving unit 6, and a lens 7.

  A sensor element 3 is disposed on the substrate 2 and the substrate 2 and the sensor element 3 are electrically connected by a bonding wire or the like. The board 2 outputs the electrical signal (image data) acquired from the sensor element 3 to, for example, a control unit (not shown) of a terminal on which the camera module 11 is mounted via the camera module terminal 11.

  The terminal on which the camera module 1 according to the present invention is mounted is, for example, a mobile phone, a portable game machine, a portable music player, a digital camera, or the like.

  The sensor element 3 receives the light collected by the lens 7 and converts the optical signal into an electric signal. The sensor element 3 is composed of, for example, a CCD sensor element or a CMOS sensor element.

  The sensor cover portion 8 is disposed on the substrate 2 above the sensor element 3 and seals the sensor element 3. By disposing the sensor cover portion 8, dust or the like can be prevented from entering the space closed by the sensor cover portion 8, the sensor element 3, and the substrate 2.

  The sensor cover portion 8 includes a sensor cover housing 4 and a lid glass 5 that fits into a recess on the top surface side of the sensor cover housing 4. The sensor cover housing 4 protects the sensor element 3 from impact or the like. The lid glass 5 has an infrared cut filter function, and blocks infrared light out of the light collected by the lens 7.

  The lens driving unit 6 holds the lens 7 and adjusts the position of the lens 7. The lens driving unit 6 is fixedly mounted on the sensor cover unit 8 so as to accommodate the sensor cover unit 8 so that the lens 7 and the sensor element 3 are positioned on the same optical axis. The lens driving unit 6 includes a lens driving terminal 12a. The lens driving terminal 12a and the lens driving terminal 12b of the substrate 2 are connected, and the lens driving unit 6 and the substrate 2 are electrically connected. The lens driving unit 6 receives a control signal instructing driving of the lens from the control unit of the terminal on which the camera module 1 is mounted via the substrate 2 and drives the lens 7 based on the control signal. Hereinafter, the lens driving terminal 12a and the lens driving terminal 12b are collectively referred to as a lens driving terminal (connection portion) 12.

  The lens driving terminal 12 is a connector terminal or a flexible printed circuit board in which a plurality of wirings are integrated because the lens driving unit 6 has not only the AF function but also various functions such as a zoom function and a camera shake correction function. Composed. In the example shown in FIG. 1, the lens drive terminal 12 is a connector terminal. That is, the lens drive terminal 12a shown in FIG. 1 is the male side of the connector terminal, and the lens drive terminal 12b is the female side of the connector terminal.

  An example in which the lens driving terminal 12 is a flexible substrate is shown in FIG. The camera module 1a shown in FIG. 2 differs from the camera module 1 shown in FIG. 1 only in the configuration of lens drive terminals, and the other members are the same. As shown in FIG. 2, the lens driving terminal 10 is formed of a flexible substrate, the lens driving terminal 10a shown in FIG. 2 is a male terminal formed of a flexible substrate, and the lens driving terminal 10b is replaced with the lens driving terminal 10a. A female terminal to be connected.

  The camera module 1 may include a shutter and an ND filter on the same optical axis as the sensor element 3.

  Further, in order to facilitate the alignment of each member, it is desirable that the shape of each member is designed so that the members can be fitted to each other. For example, the lens drive unit 6 and the sensor cover unit 8 are desirably designed so that the sensor cover unit 8 is fitted from the bottom surface side of the lens drive unit 6. Further, in order to facilitate positioning when the sensor cover housing 4 and the lens driving unit 6 are mounted on the substrate 2, respectively, the sensor cover housing 4 and the lens driving unit 6 are supported on the surface of the substrate 2, respectively. It is desirable that a positioning portion (not shown) having a concave shape or a convex shape is provided.

[Camera module manufacturing process]
Next, the manufacturing process of the camera module 1 according to the present invention will be described with reference to FIG. FIG. 3 is a diagram showing an example of the manufacturing process of the camera module 1 according to the present invention.

  First, the sensor cover portion 8 is disposed on the substrate 2 on which the sensor element 3 is mounted. From this state, as shown in FIG. 3A, the thermosetting resin 13 is applied on the sensor cover housing 4 on the portion (first joint portion) where the lens drive unit 6 is joined.

  Next, as shown in FIG. 3B, the lens driving unit 6 is mounted (mounted) on the sensor cover portion 8 so as to cover the sensor cover portion 8 by the holding and conveying means 14. At this time, the holding and conveying means 14 adjusts the position of the lens driving unit 6 to position the relative positions of the lens driving unit 6, the sensor cover unit 8, and the substrate 2. As shown in FIG. 3B, here, the lens driving unit 6 is arranged so that the side surface 21 opposite to the side surface where the lens driving terminal 12a of the lens driving unit 6 is located and the end surface 22 of the substrate 2 substantially coincide. Deploy.

  After positioning the lens driving unit 6, the lens driving unit 6 is pressed by the holding and conveying means 14, and the lower portion of the side surface 21 of the lens driving unit 6 and the end surface of the substrate 2, as shown in FIG. 22 is coated with a photocurable resin 15.

  Next, as shown in FIG. 3C, the photocurable resin 15 is irradiated with light 16 while the lens driving unit 6 is continuously pressed by the holding and conveying means 14 to cure the photocurable resin 15. Let Since the photocurable resin 15 is cured, the relative positions of the lens driving unit 6, the sensor cover unit 8, and the substrate 2 are fixed.

  Next, the holding and conveying means 14 is removed from the lens driving unit 6, and as shown in FIG. 3D, heat 17 is applied to the thermosetting resin 13 to cure (cure) the thermosetting resin 13. Let And as shown in FIG.3 (e), the lens drive terminal 12a which is a connector terminal, and the lens drive terminal 12b are electrically connected.

  In general, a part used for a terminal such as a mobile phone needs strength against a drop impact. Therefore, a thermosetting resin excellent in mechanical strength such as an epoxy resin is often used for the adhesive resin used for manufacturing the camera module 1. Even in the present invention, the lens driving unit can maintain the relative position between the lens driving unit 6 and the sensor cover 8, that is, the relative position between the lens 7 and the sensor element 3 even when subjected to an impact. 6 and the sensor cover portion 8 are joined together by a thermosetting resin 13.

  However, it takes a relatively long time for a thermosetting resin to be completely cured after being heated. Therefore, as described above, the relative position of the lens driving unit 6 may be shifted due to the external force resulting from the connection of the lens driving terminal 12. Therefore, in the present invention, before the thermosetting resin 13 is heated, the lens driving unit 6 and the substrate 2 are fixed to each other by the photo-curing resin 15 that is fast-curing. Thereby, even if the lens drive terminal 12 is connected before the thermosetting resin 13 is completely cured, the relative position shift of the lens drive unit 6 due to the external force can be prevented.

  As the photocurable resin 15, for example, an ultraviolet (UV) curable resin that is an acrylic resin can be applied. In this case, although it depends on the characteristics of the resin, the photocurable resin 15 can be cured in several seconds to several tens of seconds after being irradiated with UV light. The photocurable resin 15 is preferably a one-component and solventless resin in order to simplify the coating process.

  In this embodiment, the photocurable resin 15 is applied to the lower portion of the side surface 21 of the lens driving unit 6 and the end surface 22 of the substrate 2. However, the position where the photocurable resin 15 is applied is not limited to this. Absent. For example, you may apply | coat to the lower part of the other side surface (for example, front side surface of FIG. 3) of the lens drive unit 6, and the other end surface (for example, front end surface of FIG. 3) of the board | substrate 2. Moreover, you may apply | coat to the bottom face of the lens drive unit 6, and the surface of the board | substrate 2 facing the said bottom face. In other words, the position of the joint portion (second joint portion) between the lens drive unit 6 and the substrate 2 may be arbitrary as long as the displacement of the lens drive unit 6 due to external force can be prevented.

  FIG. 4 shows an external view of the camera module 1 completed through the above manufacturing process as seen from above and from the four sides. The camera module 1up shown in the center of FIG. 4 is an external view of the camera module 1 as viewed from above, and the camera modules 1sideA, 1sideB, 1sideC, and 1sideD shown around the camera module 1 are viewed from the side. FIG.

  In this embodiment, in order to match the optical positional relationship between the lens 7 and the sensor element 3 with high accuracy, the shape of each member is appropriately designed, and the respective members are brought into contact so that the respective members are fitted. Arrange. Further, a positioning portion such as a concave portion or a convex portion may be appropriately provided in each member, and each member may be disposed in contact with the positioning portion as a reference. Thereby, compared with the manufacturing method described in Patent Document 2, for example, the positioning of the lens 7 and the sensor element 3 can be performed with high accuracy and easily.

  In the present embodiment, the thermosetting resin 13 is applied to the upper surface of the sensor cover housing 4. Therefore, as in the manufacturing method described in Patent Document 2, resin application can be performed more easily than a method of filling a closed space formed between the sensor package and the holder member with a thermosetting resin. In addition, the number of manufacturing steps can be reduced.

  Further, in the present embodiment, after the thermosetting resin 13 is applied, the photocurable resin 15 is cured in a state where the lens driving unit 6 is pressed by the holding and conveying means 14, and after the photocurable resin 15 is cured, The holding / carrying means 14 is removed and the thermosetting resin 13 is cured. On the other hand, in the manufacturing method described in Patent Document 2, after the photocurable resin is cured, the chip mounter is removed and then the thermosetting resin is injected and cured. Therefore, there is a possibility that the positions of the sensor package, the holder member, and the like are shifted in the resin injection process or the like. Therefore, the manufacturing process in this embodiment can arrange | position the position of each member with high precision.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  The present invention can be suitably used for a camera module that is required to be downsized and highly functional.

DESCRIPTION OF SYMBOLS 1, 1a Camera module 2 Board | substrate 3 Sensor element 4 Sensor cover housing | casing 5 Lid glass 6 Lens drive unit 7 Lens 8 Sensor cover part 10, 10a, 10b Lens drive terminal (connection part)
11 Camera module terminal 12, 12a, 12b Lens drive terminal (connection part)
13 Thermosetting resin 14 Holding / transporting means 15 Photocurable resin 16 Light 17 Heat

Claims (4)

A camera module including a substrate, a sensor element mounted on the substrate, a sensor cover portion that protects the sensor element and is mounted on the substrate, and a lens driving unit that holds the lens and drives the lens A method of manufacturing a camera module in which the lens driving unit and the substrate are electrically connected to each other through a connection portion in which a plurality of wirings are integrated.
Applying a thermosetting resin to a first joint portion to be joined to the lens driving unit on the sensor cover portion;
Mounting the lens driving unit on the sensor cover;
Applying a photo-curing resin to a second bonding portion to be bonded to the substrate in the lens driving unit;
Irradiating the photocurable resin with light;
Applying heat to the thermosetting resin;
And a step of electrically connecting the lens driving unit and the substrate through the connecting portion.   The method of manufacturing a camera module according to claim 1, wherein the connection portion is a connector terminal.   The method of manufacturing a camera module according to claim 1, wherein the connection portion is a flexible substrate. The lens includes a substrate, a sensor element mounted on the substrate, a sensor cover unit that protects the sensor element and is mounted on the substrate, and a lens driving unit that holds the lens and drives the lens. The drive unit is mounted on the sensor cover part, and is a camera module that is electrically connected to the lens drive unit and the substrate through a connection part in which a plurality of wires are integrated,
A first joining part for joining the sensor cover part and the lens driving unit with a thermosetting resin;
A camera module, comprising: a second joint that joins the lens driving unit and the substrate with a photocurable resin.

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