KR20170114346A - Camera module and optical apparatus - Google Patents

Abstract

The present embodiment is characterized in that the lens unit includes a holder member, a bobbin positioned inside the holder member, a first driving unit positioned at the bobbin, and a second driving unit positioned at the holder member and facing the first driving unit A driving unit; A printed circuit board on which the image sensor is mounted and on which the holder member is located; And a connecting portion for electrically connecting the lens driving unit and the printed circuit board.

Description

[0001] CAMERA MODULE AND OPTICAL APPARATUS [0002]

The present embodiment relates to a camera module and an optical device.

The following description provides background information for the present embodiment and does not describe the prior art.

As the spread of various portable terminals is widely popularized and the wireless Internet service is commercialized, the demands of consumers related to portable terminals are diversified, and various kinds of additional devices are installed in portable terminals.

Among them, there is a camera module which photographs a subject as a photograph or a moving picture. On the other hand, the camera module is manufactured by soldering a lens drive unit to a printed circuit board on which an image sensor is mounted.

However, according to the conventional camera module, as the function of the lens driving unit increases, the number of the soldering terminal portions increases, thereby reducing the size of the pad, thereby making the soldering operation difficult, and the printed circuit board is peeled off during soldering It is a problem.

In addition, there is also a problem that loss of design is caused in the design of the lens driving unit to secure the solder pad.

In order to solve the above problems, the present embodiment intends to provide a camera module for coupling a lens driving unit and a printed circuit board by a connector.

Also, an optical apparatus including the camera module is provided.

The camera module according to the present embodiment includes a holder member, a bobbin positioned inside the holder member, a first driving unit positioned at the bobbin, and a second driving unit positioned at the holder member and opposed to the first driving unit, A lens driving unit comprising: A printed circuit board on which the image sensor is mounted and on which the holder member is located; And a connecting portion for electrically connecting the lens driving unit and the printed circuit board.

Wherein the connecting portion includes a first substrate extending from a side surface of the lens driving unit, a first connector positioned on the first substrate, and a second connector positioned on an upper surface of the printed circuit board and coupled to the first connector, .

The connector includes a third connector positioned on a side surface of the lens driving unit, a flexible second board extending from the printed circuit board, and a fourth connector positioned on the second board and coupled to the third connector, .

The connecting portion may include a Zero Insertion Force (ZIF) connector extending from a side surface of the lens driving unit and directly connected to the printed circuit board.

Wherein the first substrate includes a first surface and a second surface located opposite the first surface, the first connector is located on the first surface of the first substrate, An element section including a plurality of capacitors may be located on the second surface of the substrate.

And an adhesive applied to the connection portion of the first connector and the second connector.

The lens driving unit is coupled to the printed circuit board by soldering and may be electrically connected by the connecting unit.

The lens driving unit may further include a sensing magnet disposed on the bobbin and a sensor disposed on the holder and sensing the sensing magnet.

Wherein the holder member includes a base located on the printed circuit board and a housing which is located on the base and on which the second drive unit is located, the lens drive unit being located on the base and facing the second drive unit A third driving unit, a first supporting member coupled to the bobbin and the housing, and a second supporting member coupled to the housing and the base.

The lens driving unit may include a third substrate positioned on the base and coupled with the third driving unit, and the first substrate may extend from the third substrate.

The optical pick-up apparatus according to the present embodiment includes a holder member, a bobbin positioned inside the holder member, a first driving unit positioned at the bobbin, and a second driving unit positioned at the holder member and opposed to the first driving unit, A lens driving unit comprising: A printed circuit board on which the image sensor is mounted and on which the holder member is located; And a connecting portion for electrically connecting the lens driving unit and the printed circuit board.

Through this embodiment, connection workability of the lens driving unit can be improved.

In addition, the reliability of the camera module can be increased due to an increase in the strength of the connection portion between the lens driving unit and the printed circuit board.

In addition, when the camera module is a small model, the terminal portion for soldering, which is conventionally used, can be removed, and space for designing the lens driving unit can be easily secured.

Fig. 1 (a) is a conceptual view showing a state before the lens driving unit and the printed circuit board are coupled to each other according to the present embodiment. Fig. 1 (b) Is a conceptual diagram showing a combined state.
2 is a conceptual diagram showing a lens driving unit according to the first embodiment of the present invention.
3 is a conceptual diagram showing a lens driving unit according to a second embodiment of the present invention.
4 is a conceptual diagram showing a lens driving unit according to a third embodiment of the present invention.
5 is a perspective view showing the lens driving unit according to the present embodiment.
6 is an exploded perspective view showing the lens driving unit according to this embodiment.
7 is a perspective view showing a part of the configuration of the lens driving unit according to the present embodiment.

Hereinafter, some embodiments of the present invention will be described with reference to exemplary drawings. In describing the components in the drawings, the same components are denoted by the same reference numerals whenever possible, even if they are displayed on other drawings. In describing the embodiments of the present invention, detailed description of some configurations may be omitted.

In describing the components of the embodiment of the present invention, the terms first and second can be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. When a component is described as being "connected" or "coupled" to another component, the component may be directly connected or coupled to the other component, but another component It should be understood that the elements may be connected or coupled.

The "optical axis direction" used below is defined as the optical axis direction of the lens module in a state of being coupled to the lens driving unit. On the other hand, the " optical axis direction " can be used in combination with the up-and-down direction, the z-

The "autofocus function" used below is to focus the subject by adjusting the distance from the image sensor by moving the lens module in the direction of the optical axis according to the distance of the subject so that a clear image of the subject can be obtained with the image sensor Function. On the other hand, "autofocus" can be mixed with "AF (Auto Focus)".

The "camera shake correction function" used below is defined as a function of moving or tilting the lens module in a direction perpendicular to the optical axis direction so as to cancel the shaking (motion) generated in the image sensor by an external force. On the other hand, "camera shake correction" can be mixed with "OIS (Optical Image Stabilization)".

Hereinafter, the direction toward the center of the lens driving unit will be referred to as "inside ", and the direction away from the center of the lens driving unit will be referred to as" outside ".

Hereinafter, any one of the AF coil part 220, the driving magnet 320, and the OIS coil part 420 will be referred to as a "first driving part", the other one as a "second driving part"". Although the AF coil unit 220 is positioned on the bobbin 210 and the OIS coil unit 420 is positioned on the base 500 in the present embodiment, 220, and the OIS coil section 420 can be disposed to exchange positions with each other. Further, at least one of the coil portions 220 and 420 may be replaced with an additional magnet portion. That is, the first to third driving units may be provided in any configuration as long as they are capable of selectively performing electromagnetic interaction with each other. Meanwhile, any one of the AF coil part 220 and the OIS coil part 420 may be referred to as a 'first coil part' and the other one as a 'second coil part'.

Hereinafter, the configuration of the optical device according to the present embodiment will be described.

The optical apparatus according to the present embodiment may be applied to a mobile phone, a mobile phone, a smart phone, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, a PDA (Personal Digital Assistants) ), Navigation, and the like, but is not limited thereto, and any device for capturing an image or a photograph is possible.

The optical apparatus according to the present embodiment includes a main body (not shown), a display unit (not shown) disposed on one side of the main body and displaying information, And a camera (not shown).

Hereinafter, the configuration of the camera module according to the present embodiment will be described with reference to the drawings.

1 (a) and 1 (b) are conceptual diagrams showing a lens driving unit and a printed circuit board according to the present embodiment.

The camera module includes a lens module (not shown), an infrared cut filter (not shown), a printed circuit board 20, an image sensor (not shown), a control unit (not shown), a connecting unit 30, And a lens driving unit 10. However, in the camera module according to the present embodiment, any one of the lens module, the infrared cut filter, the printed circuit board 20, the image sensor, the control unit, the connecting unit 30, the element unit 40, One or more can be omitted. In particular, the element unit 40 is omitted for noise removal generated in the image sensor.

The lens module may include a lens and a lens barrel. The lens module may include one or more lenses (not shown) and a lens barrel for accommodating one or more lenses. However, one configuration of the lens module is not limited to the lens barrel, and any structure can be used as long as it can support one or more lenses. The lens module can be coupled to the lens driving unit 10 and move together with the lens driving unit 10. [ The lens module may be coupled to the inside of the lens driving unit 10 as an example. The lens module can be screwed with the lens driving unit 10 as an example. The lens module may be coupled to the lens driving unit 10 by an adhesive (not shown) as an example. On the other hand, the light having passed through the lens module can be irradiated to the image sensor.

The infrared cutoff filter can block the light of the infrared region from entering the image sensor. The infrared cut filter may be located, for example, between the lens module and the image sensor. The infrared cutoff filter may be located in a holder (not shown) provided separately from the base 500. However, the infrared filter may be mounted on the through hole 510 formed at the center of the base 500. The infrared filter may be formed of, for example, a film material or a glass material. The infrared filter may be formed, for example, by coating an infrared ray blocking coating material on a planar optical filter such as a cover glass for protecting an image pickup surface or a cover glass.

The printed circuit board 20 can support the lens driving unit 10. [ An image sensor can be mounted on the printed circuit board 20. [ An image sensor is disposed on the upper surface of the printed circuit board 20 and a sensor holder (not shown) is provided on the upper surface of the printed circuit board 20, City) can be located. The lens drive unit 10 is located above the sensor holder. Alternatively, the lens driving unit 10 may be located outside the upper surface of the printed circuit board 20, and the image sensor may be positioned inside the upper surface of the printed circuit board 20. Through such a structure, the light having passed through the lens module housed inside the lens driving unit 10 can be irradiated to the image sensor mounted on the printed circuit board 20. The printed circuit board 20 can supply power to the lens driving unit 10. [ On the other hand, a control unit for controlling the lens driving unit 10 may be disposed on the printed circuit board 20.

The image sensor can be mounted on the printed circuit board (20). The image sensor may be positioned such that the optical axis and the lens module are aligned. Thereby, the image sensor can acquire light passing through the lens module. The image sensor can output the irradiated light as an image. The image sensor can be, for example, a charge coupled device (CCD), a metal oxide semiconductor (MOS), a CPD and a CID. However, the type of image sensor is not limited thereto.

The control unit may be mounted on the printed circuit board 20. [ The control unit may be located outside the lens driving unit 10. [ However, the control unit may be located inside the lens driving unit 10. [ The control unit can control the direction, intensity, and amplitude of the current supplied to each of the components constituting the lens driving unit 10. [ The control unit controls the lens driving unit 10 to perform at least one of the autofocus function and the camera shake correction function of the camera module. That is, the control unit can control the lens driving unit 10 to move the lens module in the optical axis direction or tilt it in the direction perpendicular to the optical axis direction. Further, the control unit may perform feedback control of the autofocus function and the shake correction function. More specifically, the control unit receives the position of the bobbin 210 or the housing 310 sensed by the sensor unit 700 and controls the power or current to be applied to the AF coil unit 220 to the OIS coil unit 420 , A more precise autofocus function and an image stabilization function can be provided.

The connecting portion 30 can electrically connect the lens driving unit 10 and the printed circuit board 20. The power supplied from the printed circuit board 20 to the lens driving unit 10 by the connecting portion 30 can be used to drive the lens driving unit 10. [ The power supplied from the printed circuit board 20 to the lens driving unit 10 by the connecting portion 30 can be supplied to the AF coil portion 220 and the OIS coil portion 420 of the lens driving unit 10 .

The connecting portion 30 may include any type of connector. The connecting portion 30 may include at least one of a board type board type B2B type and a ZIF type type insertion type force type connector. However, the connecting portion 30 may be formed by soldering Can be distinguished from binding.

1 (a), a substrate 20 provided with a lens driving unit 10 and a second connector 313 provided with a first connector 312 on one side thereof is prepared. Referring to FIG. 1 (b), only the process of placing the lens driving unit 10 on the substrate 20 in the state of FIG. 1 (a) and coupling the first connector 312 to the second connector 313 It can be confirmed that the assembling of the lens driving unit 10 and the substrate 20 is completed. Of course, soldering can be additionally performed between the lens driving unit 10 and the substrate 20 for robust assembly of the lens driving unit 10 and the substrate 20. [ Further, an adhesive for bonding the first connector 312 and the second connector 313 may be used.

Hereinafter, the connecting portion 30 will be described by way of example with reference to the drawings.

≪ Embodiment 1 >

2 is a conceptual diagram showing a lens driving unit according to the first embodiment of the present invention.

The connecting portion 30 may include a first substrate 311 extending from a side surface of the lens driving unit 10. [ The connecting portion 30 may include a first connector 312 located on the first substrate 311. [ The connecting portion 30 may include a second connector 313 located on the upper surface of the printed circuit board 20 and coupled to the first connector 312.

The first substrate 311 may include a first side 314 and a second side 315 located opposite the first side 314. A first connector 312 may be provided on the first surface 314. The element portion 40 may be provided on the second surface 315. The first substrate 311 may extend from the third substrate 410. The first substrate 311 may be formed integrally with the third substrate 410. Alternatively, the first substrate 311 may be a separate member from the third substrate 410 and may be coupled to the third substrate 410. The first substrate 311 may be any one of a flexible printed circuit board (FPCB) and a rigid printed circuit board (RPCB). Further, the first substrate 311 may be an RF PCB in which the FPCB and the RPCB are combined. The first substrate 311 may extend from the side surface of the lens driving unit 10. However, the position of the first substrate 311 is not limited thereto, and it may be provided at various positions such as the upper surface and the lower surface of the lens driving unit 10. [

The first connector 312 may be located on the first side 314 of the first substrate 311. The first connector 312 may be located on the lower surface of the first substrate 311. The first connector 312 may be positioned to face the upper surface of the printed circuit board 20. The first connector 312 can be coupled with the second connector 313. At least a portion of the first connector 312 may be inserted and coupled to the second connector 313. Alternatively, at least a portion of the second connector 313 may be inserted and coupled to the first connector 312.

The second connector 313 can be located on the upper surface of the printed circuit board 20. [ At this time, the upper surface of the printed circuit board 20 and the lower surface of the first substrate 311 can face each other. The second connector 3130 can be coupled with the first connector 312. [

The element portion 40 may be located on the second surface 315 of the first substrate 311. [ The element portion 40 can overlap with the first connector 312 in the vertical direction. The element section 40 can be positioned so as to be exposed upward. The element portion 40 may include a plurality of capacitors that are spaced apart from each other. The element unit 40 can perform noise removal generated in the image sensor by an electrical signal. However, the function of the element unit 40 is not limited thereto.

The adhesive (not shown) may be applied to the connection portion between the first connector 312 and the second connector 313. The adhesive can maintain the connection between the first connector 312 and the second connector 313 more firmly.

≪ Embodiment 2 >

3 is a conceptual diagram showing a lens driving unit according to a second embodiment of the present invention.

The connecting portion 30 may include a third connector 321 positioned on the side surface of the lens driving unit 10. [ The connecting portion 30 may include a flexible second substrate 322 extending from the printed circuit board 20. [ The connecting portion 30 may include a fourth connector 323 located on the second substrate 322 and coupled to the third connector 321.

The third connector 321 can be located on the side of the lens driving unit 10. [ The third connector 321 may be formed so as to protrude from the side surface of the lens driving unit 10. [ The third connector 321 can be coupled to the fourth connector 323. At least a part of the third connector 321 may be inserted and coupled to the fourth connector 323. Alternatively, at least a part of the fourth connector 323 may be inserted and coupled to the third connector 321. The third connector 321 may be electrically connected to the third substrate 410. The third connector 321 may extend from the third substrate 410. The third connector 321 may be formed integrally with the third substrate 410. Alternatively, the third connector 321 may be a separate member from the third substrate 410 and may be coupled to the third substrate 410.

The second substrate 322 may extend from the side of the printed circuit board 20. In this case, the size of the printed circuit board 20 may correspond to the size of the lens driving unit 10. [ That is, according to the second embodiment, there is an advantage that the camera module can be downsized. Alternatively, the second substrate 322 may extend from the upper surface or the lower surface of the printed circuit board 20. The second substrate 322 may be a flexible printed circuit board (FPCB). Further, the second substrate 322 may be an RF PCB in which the FPCB and the RPCB are combined. The second substrate 322 may extend from the side surface of the printed circuit board 20 and be rounded upward. The second substrate 322 may include a first surface and a second surface opposite to the first surface. At this time, one surface and the other surface may be referred to as a "first surface" and a "second surface" as in the first substrate 311 of the first embodiment. The fourth connector 323 may be disposed on one surface of the second substrate 322 and the device unit 40 may be disposed on the other surface of the second substrate 322. The fourth connector 323 may be located on one side of the second substrate 322 and the element 40 may be located on the other side of the second substrate 322.

The fourth connector 323 may be located on the second substrate 322. The fourth connector 323 can be directed to the lens driving unit 10 side. The fourth connector 323 can be coupled to the third connector 321. [

The element portion 40 may be located on the second substrate 322. [ The element section 40 can overlap with the fourth connector 323 in the horizontal direction. The element section 40 may be positioned so as to be exposed to the outside. The element portion 40 may include a plurality of capacitors that are spaced apart from each other. The element unit 40 can perform noise removal generated in the image sensor by an electrical signal. However, the function of the element unit 40 is not limited thereto.

The adhesive (not shown) may be applied to the connection portion between the third connector 321 and the fourth connector 323. The adhesive can more firmly hold the connection between the third connector 321 and the fourth connector 323.

≪ Third Embodiment >

4 is a conceptual diagram showing a lens driving unit according to a third embodiment of the present invention.

The connecting portion 30 may include a Zero Insertion Force (ZIF) connector 331 extending from the side of the lens driving unit 10 and directly connected to the printed circuit board 20. [

The ZIF connector 331 can extend from the side surface of the lens driving unit 10. [ The ZIF connector 331 can be directly connected to the printed circuit board 20. The ZIF connector 331 may be electrically connected to the third substrate 410. The ZIF connector 331 may be integrally formed with the third substrate 410. Alternatively, the ZIF connector 331 may be a separate member from the third substrate 410 and may be coupled to the ZIF connector 331.

The adhesive (not shown) can be applied to the connection portion of the ZIF connector 331 and the printed circuit board 20. The adhesive can maintain the bond between the ZIF connector 331 and the printed circuit board 20 more firmly.

Hereinafter, the configuration of the lens driving unit according to the present embodiment will be described with reference to the drawings.

6 is an exploded perspective view showing the lens driving unit according to the present embodiment, and Fig. 7 is a sectional view showing a part of the configuration of the lens driving unit according to the present embodiment. Fig. 5 is a perspective view showing the lens driving unit according to this embodiment, FIG.

The lens driving unit 10 may include a holder member 50. The lens driving unit 10 may include a bobbin 210 positioned inside the holder member 50. The lens driving unit 10 may include an AF coil part 220 located in the bobbin 210. [ The lens driving unit 10 may include a driving magnet portion 320 located in the holder member 50 and opposed to the AF coil portion 220. [ The lens driving unit 10 may include a sensing magnet 715 located on the bobbin 210. [ The lens driving unit 10 may include a first sensor unit 710 located in the holder member 50 and sensing the sensing magnet 715. The lens driving unit 10 may include an OIS coil part 420 located at the base 500 and opposed to the driving magnet part 320. The lens driving unit 10 may include an upper support member 610 and a lower support member 620 coupled to the bobbin 210 and the housing 310. The lens driving unit 10 may include a side support member 630 coupled to the housing 310 and the base 500. [ The lens driving unit 10 may include a third substrate 410 located on the base 500 and coupled to the OIS coil part 420.

The holder member 50 may include a base 500 that is located on the printed circuit board 20. The holder member 50 may include a housing 310 that is located on the base 500 and on which the drive magnet portion 320 is located. That is, the holder member 50 can be used to refer to the housing 310 and the base 500.

The lens driving unit 10 may be coupled to the printed circuit board 20 by soldering. The lens driving unit 10 can be electrically connected to the printed circuit board 20 by the connecting portion 30. [

5 to 7, the lens driving unit 10 according to the present embodiment includes a cover member 100, a first mover 200, a second mover 300, a stator 400, (500), a support member (600), and a sensor unit (700). In the lens driving unit 10 according to the present embodiment, the cover member 100, the first mover 200, the second mover 300, the stator 400, the base 500, the support member 600 And the sensor unit 700 may be omitted. In particular, the sensor unit 700 can be omitted for the configuration for the autofocus feedback function and / or the camera shake correction feedback function.

The cover member 100 can form an appearance of the lens driving unit 10. [ The cover member 100 may be in the form of a hexahedron having an open bottom. However, the present invention is not limited thereto.

The cover member 100 may be formed of, for example, a metal material. More specifically, the cover member 100 may be formed of a metal plate. In this case, the cover member 100 may block electromagnetic interference (EMI). Because of this feature of the cover member 100, the cover member 100 can be referred to as an EMI shield can. The cover member 100 can prevent the airflow generated from the outside of the lens driving unit 10 from flowing into the inside of the cover member 100. [ In addition, the cover member 100 can prevent the radio waves generated inside the cover member 100 from being emitted to the outside of the cover member 100. However, the material of the cover member 100 is not limited thereto.

The cover member 100 may include an upper plate 101 and a side plate 102. The cover member 100 may include an upper plate 101 and a side plate 102 extending downward from the outer side of the upper plate 101. [ The lower end of the side plate 102 of the cover member 100 can be mounted on the base 500. [ The cover member 100 may be mounted on the base 500 in such a manner that its inner surface is in close contact with a part or all of the side surface of the base 500. The first mover 200, the second mover 300, the stator 400, and the support member 600 may be positioned in the inner space formed by the cover member 100 and the base 500. [ With such a structure, the cover member 100 can protect the internal components from external impact and prevent the penetration of external contaminants. The lower end of the side plate 102 of the cover member 100 may be directly coupled to the printed circuit board located below the base 500. [

The cover member 100 may include an opening 110 formed in the top plate 101 to expose the lens module. The opening 110 may be formed in a shape corresponding to the lens module. The size of the opening 110 may be larger than the diameter of the lens module so that the lens module can be assembled through the opening 110. On the other hand, the light introduced through the opening 110 can pass through the lens module. At this time, the light passing through the lens module can be acquired as an image from the image sensor.

The first movable element 200 may include a bobbin 210 and an AF coil part 220. The first mover 200 may include a bobbin 210 that engages a lens module. The first movable element 200 may include an AF coil part 220 which is located on the bobbin 210 and moves by electromagnetic interaction with the AF coil part 220.

The bobbin 210 can be received in the inner space of the cover member 100. The bobbin 210 may be coupled to a lens module. More specifically, the outer circumferential surface of the lens module may be coupled to the inner circumferential surface of the bobbin 210. The AF coil part 220 may be positioned on the bobbin 210. The AF coil part 220 may be coupled to the bobbin 210. An upper support member 610 may be coupled to the upper portion of the bobbin 210. The bobbin 210 may be located inside the housing 310. The bobbin 210 can move relative to the housing 310 in the direction of the optical axis.

The bobbin 210 may include a lens accommodating portion 211, a first driving portion engaging portion 212 and an upper engaging portion 213, a lower engaging portion (not shown), and a projection 215.

The bobbin 210 may include a lens accommodating portion 211 of a vertically open type on the inner side. The bobbin 210 may include a lens accommodating portion 211 formed inside. A lens module may be coupled to the lens accommodation portion 211. A thread having a shape corresponding to the thread formed on the outer circumferential surface of the lens module may be formed on the inner circumferential surface of the lens accommodating portion 211. [ That is, the lens accommodation portion 211 can be screwed to the lens module. Between the lens module and the bobbin 210, an adhesive may be interposed. At this time, the adhesive may be an ultraviolet (UV) or an epoxy which is cured by heat. That is, the lens module and the bobbin 210 may be bonded by ultraviolet curing epoxy and / or thermosetting epoxy.

The bobbin 210 may include a first driving portion coupling portion 212 in which the AF coil portion 220 is disposed. The first driving portion engaging portion 212 may be integrally formed with the outer surface of the bobbin 210. The first driving part coupling part 212 may be continuously formed along the outer surface of the bobbin 210 or spaced apart from the bobbin 210 at predetermined intervals. For example, the first driving portion coupling portion 212 may be formed so that a part of the outer surface of the bobbin 210 corresponds to the shape of the AF coil portion 220. At this time, the AF coil part 220 may be directly wound around the first driving part coupling part 212. As a modification, the first driving portion engaging portion 212 may be formed as an upper side or a lower side opening type. At this time, the AF coil part 220 may be inserted into the first driving part engaging part 212 through a portion opened in a previously wound state.

The bobbin 210 may include an upper engagement portion 213 coupled with the upper support member 610. The upper engagement portion 213 can be engaged with the inner side portion 612 of the upper support member 610. The projections (not shown) of the upper coupling portion 213 can be inserted into the grooves or holes (not shown) of the inner side portion 612 of the upper support member 610 to be engaged. At this time, the projections of the upper coupling portion 213 are inserted into the holes of the inner side portion 612 and are thermally fused to fix the upper side support member 610.

The bobbin 210 may include a lower coupling portion coupled with the lower support member 620. The lower coupling portion can be engaged with the inner side portion 622 of the lower support member 620. [ The protrusion (not shown) of the lower coupling portion can be inserted into the groove or hole (not shown) of the inner side portion 622 of the lower support member 620 and coupled thereto. At this time, the protrusion of the lower coupling part is thermally fused in a state of being inserted into the hole of the inner side part 622, so that the lower side support member 620 can be fixed.

The AF coil part 220 can be guided by the first driving part engaging part 212 and wound on the outer surface of the bobbin 210. As another embodiment, the AF coil part 220 may be disposed on the outer surface of the bobbin 210 so that four coils are independently provided so that two neighboring coils are 90 ° apart from each other. The AF coil part 220 can be opposed to. The AF coil portion 220 may be arranged to be capable of electromagnetic interaction with, The AF coil portion 220 can move the bobbin 210 with respect to the housing 310 through electromagnetic interaction with the bobbin 210.

The AF coil part 220 may include a pair of lead wires (not shown) for power supply. At this time, a pair of outgoing lines of the AF coil part 220 can be electrically connected to each of the pair of upper supporting members 610. The pair of outgoing lines of the AF coil part 220 can be electrically connected to the fifth and sixth upper side support units 605 and 606 which are the divisional structure of the upper side support member 610. [ That is, the AF coil unit 220 can be supplied with power through the upper supporting member 610. With such a structure, when power is supplied to the AF coil part 220, an electromagnetic field can be formed around the AF coil part 220.

The second mover 300 can move for the shake correction function. The second mover 300 can be positioned on the outer side of the first mover 200 to face the first mover 200. The second mover 300 can move the first mover 200 or move with the first mover 200. [ The second mover 300 can be movably supported by the lower stator 400 and / or the base 500. The second mover 300 may be located in the inner space of the cover member 100. [

The second movable element 300 may include a housing 310 and a driving magnet 320. The second mover 300 may include a housing 310 located outside the bobbin 210. The second mover 300 may include a driving magnet 320 positioned opposite to the AF coil unit 220 and fixed to the housing 310.

At least a part of the housing 310 may be formed in a shape corresponding to the inner surface of the cover member 100. In particular, the outer surface of the housing 310 may be formed in a shape corresponding to the inner surface of the side plate 120 of the cover member 100. The housing 310 may be in the form of a hexahedron including four sides as an example. However, the shape of the housing 310 may be any shape that can be disposed inside the cover member 100. The housing 310 is formed of an insulating material, and may be formed as an injection molded article in consideration of productivity.

The housing 310 may be located outside the bobbin 210. The housing 310 may be located at a position. The housing 310 may be positioned above the base 500. The housing 310 may be disposed at a distance from the cover member 100 as a moving part for OIS driving. However, in the AF model, the housing 310 can be fixed on the base 500. Alternatively, in the AF model, the housing 310 may be omitted and fixed to the cover member 100. An upper support member 610 may be coupled to the upper portion of the housing 310.

The housing 310 may include an inner space 311, a second driving portion coupling portion 312, an upper coupling portion 313, and a lower coupling portion (not shown).

The upper and lower sides of the housing 310 are opened to accommodate the first mover 200 so as to be movable up and down. The housing 310 may include an inner space 311 which is vertically open on the inner side. The bobbin 210 may be movably disposed in the inner space 311. That is, the inner space 311 may be formed in a shape corresponding to the bobbin 210. The inner circumferential surface of the housing 310 forming the inner space 311 may be spaced apart from the outer circumferential surface of the bobbin 210.

The housing 310 may include a second driving portion coupling portion 312 formed in a side surface thereof to correspond to the driving magnet 320 to receive the driving magnet 320. The second driving part engaging part 312 can receive and fix the driving magnet 320. The driving magnet 320 may be fixed to the second driving part engaging part 312 by an adhesive (not shown). Meanwhile, the second driving portion engaging portion 312 may be located on the inner peripheral surface of the housing 310. In this case, there is an advantage in favor of electromagnetic interaction with the AF coil part 220 located inside the drive magnet 320. In addition, the second driving portion engaging portion 312 may be in the form of an open bottom portion as an example. In this case, there is an advantage in favor of the electromagnetic interaction between the OIS coil part 420 and the drive magnet 320 located below the drive magnet 320. [ The second driving portion coupling portion 312 may be provided as four, for example. The driving magnet 320 may be coupled to each of the four second driving portion engaging portions 312.

The housing 310 may include an upper engagement portion 313 coupled with the upper support member 610. The upper engagement portion 313 can be engaged with the outer side portion 611 of the upper support member 610. The projections of the upper coupling portion 313 can be inserted into the grooves or holes (not shown) of the outer side portion 611 of the upper side support member 610 to be coupled. At this time, the protrusion of the upper coupling part 313 may be thermally fused while being inserted into the hole of the outer side part 611 to fix the upper side support member 610.

The housing 310 may include a lower coupling portion coupled with the lower support member 620. The lower engaging portion can be engaged with the outer side portion 621 of the lower side support member 620. As one example, the protrusion of the lower coupling portion can be inserted and coupled to a groove or a hole (not shown) of the outer side portion 621 of the lower support member 620. At this time, the projections of the lower coupling part are thermally fused while being inserted into the holes of the outer side part 621, so that the lower side support member 620 can be fixed.

The drive magnet 320 can be accommodated in the inner space of the cover member 100. The driving magnet 320 can be opposed to the AF coil part 220. The driving magnet 320 can move the AF coil part 220 through electromagnetic interaction with the AF coil part 220. [ The drive magnet 320 may be located in the housing 310. The driving magnet 320 may be fixed to the second driving portion engaging portion 312 of the housing 310. The driving magnet 320 may be disposed in the housing 310 such that four magnets are independently provided so that two adjacent magnets are 90 ° apart from each other. That is, the driving magnet 320 can efficiently use the internal volume through the magnet mounted at equal intervals on the four side surfaces of the housing 310. Further, the drive magnet 320 can be bonded to the housing 310 with an adhesive. However, the present invention is not limited thereto.

The stator 400 may include a third substrate 410 and an OIS coil section 420 as an example. The stator 400 may include a third substrate 410 positioned between the OIS coil section 420 and the base 500. In addition, the stator 400 may include an OIS coil part 420 opposed to the drive magnet 320.

The third substrate 410 may include a flexible printed circuit board (FPCB), which is a flexible printed circuit board. The third substrate 410 may be positioned between the base 500 and the housing 310. The third substrate 410 may be positioned between the OIS coil part 420 and the base 500. The third substrate 410 may supply power to the OIS coil part 420. The third substrate 410 can supply power to the AF coil part 220. The third substrate 410 can supply power to the AF coil part 220 through the side support member 630 and the upper side support member 610. [ In addition, the third substrate 410 can supply power to the AF sensor unit through the side support member 630 and the upper side support member 610. The third substrate 410 may include a through hole 411 through which light passing through the lens module is passed.

The OIS coil part 420 can move the drive magnet 320 through electromagnetic interactions. The OIS coil section 420 may be located on the third substrate 410. The OIS coil section 420 may be positioned between the base 500 and the housing 310. The OIS coil section 420 can be opposed to the drive magnet 320. When the power is applied to the OIS coil part 420, the housing 310, to which the driving magnet 320 and the driving magnet 320 are fixed by the interaction of the OIS coil part 420 and the driving magnet 320, Can move.

The OIS coil part 420 may be formed of a pattern coil (FP coil) mounted on the third substrate 410. In this case, it may be effective in terms of downsizing (lowering the height in the z-axis direction in the optical axis direction) of the lens driving unit. The OIS coil section 420 may be formed to minimize interference with the OIS sensor section 720 located on the lower side as an example. The OIS coil part 420 may be positioned so as not to overlap with the OIS sensor part 720 in the vertical direction.

The OIS coil section 420 may have a through hole 421 through which the light of the lens module is passed. The through hole 421 may have a diameter corresponding to the diameter of the lens module. The through hole 421 of the OIS coil part 420 may have a diameter corresponding to the through hole 411 of the third substrate 410. The through hole 421 of the OIS coil part 420 may have a diameter corresponding to the through hole 510 of the base 500. The through hole 421 may be circular as an example. However, the present invention is not limited thereto.

The base 500 may be disposed on the printed circuit board 800. The base 500 can be fixed to the printed circuit board 20 by an adhesive for active alignment. The base 500 may be positioned below the bobbin 210. The base 500 may be positioned below the housing 310. The base 500 can support the second mover 300. The printed circuit board 20 may be positioned below the base 500. The base 500 may perform a sensor holder function for protecting an image sensor mounted on the printed circuit board 20. [

The base 500 may include a through hole 510, a foreign matter collecting part 520, and a sensor mounting part 530.

The base 500 may include a through hole 510 formed at a position corresponding to the lens accommodation portion 211 of the bobbin 210. Meanwhile, an infrared ray filter may be coupled to the through hole 510 of the base 500. However, an infrared filter may be coupled to a separate sensor holder disposed under the base 500.

The base 500 may include a foreign matter collecting unit 520 for collecting foreign matter introduced into the cover member 100. The foreign matter collecting unit 520 is disposed on the upper surface of the base 500 and can collect foreign substances on the inner space formed by the cover member 100 and the base 500 including the adhesive material.

The base 500 may include a sensor mounting portion 530 to which the OIS sensor portion 720 is coupled. That is, the OIS sensor unit 720 can be mounted on the sensor mounting unit 530. At this time, the OIS sensor unit 720 senses the movement magnet or the tilt of the housing 310 by sensing the driving magnet 320 coupled to the housing 310. Two sensor mounting portions 530 may be provided as an example. The OIS sensor unit 720 may be positioned in each of the two sensor mounting units 530. In this case, the OIS sensor unit 720 may include a first axis sensor and a second axis sensor arranged to sense both the x-axis and y-axis motions of the housing 310.

The support member 600 can connect any two or more of the first mover 200, the second mover 300, the stator 400, and the base 500. The support member 600 elastically connects any two or more of the first mover 200, the second mover 300, the stator 400, and the base 500 to move relative to each other And the like. The supporting member 600 may be formed such that at least a part thereof is resilient. In this case, the support member 600 may be referred to as an elastic member.

The support member 600 may include, for example, an upper support member 610, a lower support member 620, and a side support member 630 as an example. On the other hand, the upper support member 610 may be referred to as a 'first support member'. Here, the lower support member 620 may be referred to as a 'second support member' to distinguish it from the first support member, and the side support member 630 may be referred to as a 'third support member' Support member '. The upper support member 610 and the lower support member 620 are not limited to the upper and lower support members 610 and 620. However, the upper support member 610 and the lower support member 620 are not limited thereto, May be arranged to change their positions and either one may replace the other.

The upper support member 610 may include an outer portion 611, a medial portion 612, and a connection portion 613 as an example. The upper support member 610 includes an outer portion 611 coupled with the housing 310, a medial portion 612 coupled with the bobbin 210, and a connection portion 612 elastically connecting the outer portion 611 and the medial portion 612 613).

The upper support member 610 may be connected to the upper portion of the first mover 200 and the upper portion of the second mover 300. More specifically, the upper support member 610 may be coupled to the upper portion of the bobbin 210 and the upper portion of the housing 310. The inner side portion 612 of the upper side support member 610 is coupled to the upper side coupling portion 213 of the bobbin 210 and the outer side portion 611 of the upper side support member 610 is coupled to the upper side coupling portion 313 of the housing 310, Lt; / RTI >

The upper support members 610 may be divided into six, for example. Four of the six upper support members 610 may be energized with the first sensor unit 710 and the remaining two may be energized with the AF coil unit 220. In other words, the upper support member 610 may include first to sixth upper support units 601, 602, 603, 604, 605, and 606 spaced from each other. At this time, the first to fourth upper supporting units 601, 602, 603, and 604 may be electrically connected to the first sensor unit 710. Further, the fifth and sixth upper side support units 605 and 606 may be electrically connected to the AF coil part 220. The first to fourth upper support units 601, 602, 603 and 604 are used to supply power to the first sensor unit 710 and to transmit information or signals between the control unit and the first sensor unit 710 . The fifth and sixth upper side support units 605 and 606 may be used to supply power to the AF coil part 220. [

The first to fourth upper side support units 601, 602, 603, and 604 may be positioned on the same plane as shown in FIG. Since the first to fourth upper supporting units 601, 602, 603 and 604 are elastic and deformable, a part of any one of the first to fourth upper supporting units 601, 602, 603 and 604 It may be out of the same plane.

The first to sixth upper support units 601, 602, 603, 604, 605 and 606 may have different shapes from each other. However, the second and third support units 602 and 603 may have a symmetrical shape. More specifically, the second and third support units 602 and 603 may have a shape that is symmetrical with respect to an imaginary straight line dividing the housing 310 in the diagonal direction.

The lower support member 620 may include an outer portion 621, a medial portion 622, and a connection portion 623 as an example. The lower support member 620 includes an outer side portion 621 coupled with the housing 310, an inner side portion 622 coupled with the bobbin 210, and a connecting portion 622 elastically connecting the outer side portion 621 and the inner side portion 622 623).

The lower support member 620 may be connected to a lower portion of the first mover 200 and a lower portion of the second mover 300. More specifically, the lower support member 620 may be coupled to the lower portion of the bobbin 210 and the lower portion of the housing 310. The lower coupling portion of the bobbin 210 may be coupled to the inner side portion 622 of the lower support member 620 and the lower coupling portion of the housing 310 may be coupled to the outer side portion 621 of the lower side support member 620.

The lower support member 620 may be integrally formed as an example. However, the present invention is not limited thereto. Alternatively, the lower support members 620 may be separated into a pair and used to supply power to the AF coil part 220. [

The side support member 630 may be coupled to the stator 400 and / or the base 500 on one side and may be coupled to the upper support member 610 and / or the housing 310 on the other side. One side of the side support member 630 can be coupled to the stator 400 and the other side can be coupled to the upper side support member 610, for example. In another embodiment, the side support member 630 may be coupled to the base 500 at one side and coupled to the housing 310 at the other side. With this structure, the side support member 630 elastically supports the second mover 300 with respect to the stator 400 so that the second mover 300 can be moved or tilted in the horizontal direction . The side support member 630 may include a plurality of wires as an example. Alternatively, the side support members 630 may include a plurality of leaf springs as a modification. Meanwhile, the side support member 630 may be formed integrally with the upper side support member 610.

The side support member 630 may be electrically connected to the circuit board 410 at one end and may be electrically connected to the upper support member 610 at the other end. The side support members 630 may be provided in the same number as the upper side support members 610 as an example.

The side support member 630 or the upper support member 610 may include, for example, an impact absorbing portion (not shown) for shock absorption. The shock absorbing portion may be provided on at least one of the side support member 630 and the upper side support member 610. [ The shock absorbing portion may be a separate member such as a damper. The shock absorbing portion may also be realized by changing the shape of at least one of the side support member 630 and the upper side support member 610. [

The sensor unit 700 may be used for at least one of autofocus feedback and shake correction feedback. The sensor unit 700 can detect the position or movement of any one or more of the first mover 200 and the second mover 300.

The sensor unit 700 may include a first sensor unit 710 and a second sensor unit 720 as an example. The first sensor unit 710 senses the relative up and down movement of the bobbin 210 relative to the housing 310 to provide information for AF feedback. The second sensor unit 720 may sense movement or tilt of the second mover 300 in the horizontal direction to provide information for OIS feedback.

The first sensor unit 710 may include a first sensor (not shown), a substrate 712, and a sensing magnet 715 as an example.

The first sensor may be disposed in the housing 310. The first sensor may be disposed on top of the housing 310. At this time, the sensing magnet 715 may be disposed above the bobbin 210. The first sensor can be mounted on the substrate 712. The first sensor may be disposed on the housing 310 while being mounted on the substrate 712. The first sensor may sense the position or movement of the bobbin 210. The first sensor can sense the position or movement of the bobbin 210 by sensing a sensing magnet 715 disposed on the bobbin 210 as an example. The first sensor may be, for example, a hall sensor for sensing the magnetic force of the magnet. However, the present invention is not limited thereto.

A first sensor may be mounted on the substrate 712. The substrate 712 may be disposed in the housing 310. The substrate 712 can be energized with the upper support member 610. With such a structure, the substrate 712 can supply power to the first sensor and transmit / receive information or signals from the control unit. The substrate 712 may include a terminal portion 713. The upper side support member 610 may be electrically connected to the terminal portion 713.

The sensing magnet 715 may be disposed on the bobbin 210. At this time, the sensing magnet 715 may be referred to as a 'second magnet' in order to distinguish it from the 'first magnet' which is the driving magnet. The lens driving unit 10 according to the present embodiment may further include a compensation magnet 716 disposed on the bobbin 210 and positioned symmetrically with the sensing magnet 715 with respect to the center of the bobbin 210 have. The compensation magnet 716 may be referred to as a 'third magnet' to distinguish it from the second magnet. The compensation magnet 716 may be disposed so as to be magnetically balanced with the sensing magnet 715. That is, the compensation magnet 716 may be disposed to eliminate the magnetic force imbalance caused by the sensing magnet 715. The sensing magnet 715 may be disposed on one side of the bobbin 210 and the compensating magnet 716 may be disposed on the other side of the bobbin 210.

The second sensor unit 720 may be located in the stator 400. The second sensor unit 720 may be located on the upper surface or the lower surface of the circuit board 410. The second sensor unit 720 may be disposed on the sensor mounting unit 530 formed on the bottom surface of the circuit board 410 as an example. The second sensor unit 720 may include a hall sensor as an example. In this case, it is possible to sense the relative motion of the second mover 300 with respect to the stator 400 by sensing the magnetic field of the driving magnet unit 320. The second sensor unit 720 is provided as two or more as an example, and can sense all of the x-axis and y-axis motions of the second mover 300. Meanwhile, the second sensor unit 720 may be positioned so as not to overlap with the FP coil of the OIS coil unit 420 in the vertical direction.

Hereinafter, the operation of the camera module according to the present embodiment will be described.

First, the autofocus function of the camera module according to the present embodiment will be described. When the coil of the AF coil part 220 is supplied with power, the AF coil part 220 is moved by the electromagnetic interaction between the magnet part of the driving coil part 220 and the magnet part of the driving magnet part 320, As shown in FIG. At this time, the bobbin 210 to which the AF coil unit 220 is coupled moves integrally with the AF coil unit 220. That is, the bobbin 210 coupled to the inner side of the lens module moves up and down with respect to the housing 310. This movement of the bobbin 210 results in movement of the lens module toward or away from the image sensor. Thus, in this embodiment, power is supplied to the coil of the AF coil part 220 to adjust the focus Can be performed.

On the other hand, in the camera module according to the present embodiment, autofocus feedback can be applied for more accurate realization of the autofocus function. The first sensor, which is disposed in the housing 310 and is provided as a hall sensor, senses the magnetic field of the sensing magnet 715 fixed to the bobbin 210. Accordingly, when the bobbin 210 performs relative movement with respect to the housing 310, the amount of the magnetic field sensed by the first sensor changes. The first sensor senses the movement amount of the bobbin 210 in the z-axis direction or the position of the bobbin 210 in this manner, and transmits the detection value to the control unit. The control unit determines whether to perform an additional movement with respect to the bobbin 210 through the received sensing value. Since such a process is generated in real time, the autofocus function of the camera module according to the present embodiment can be performed more precisely through autofocus feedback.

The camera shake correction function of the camera module according to the present embodiment will be described. When power is supplied to the coil of the OIS coil part 420, the driving magnet part 320 is moved relative to the OIS coil part 420 by the electromagnetic interaction of the magnets of the OIS coil part 420 and the driving magnet part 320 Movement. At this time, the housing 310 to which the driving magnet 320 is coupled moves integrally with the driving magnet 320. That is, the housing 310 is moved in the horizontal direction with respect to the base 500. However, at this time, the housing 310 may be tilted with respect to the base 500. At this time, the bobbin 210 also moves integrally with the housing 310. Accordingly, since the movement of the housing 310 is a result of moving the lens module in a direction parallel to the direction in which the image sensor is placed with respect to the image sensor, in this embodiment, power is supplied to the coil of the OIS coil part 420 And the camera shake correction function can be performed.

Meanwhile, the camera-shake correction feedback may be applied for more precise realization of the camera-shake correction function of the camera module according to the present embodiment. A pair of second sensor units 720 mounted on the base 500 and provided as hall sensors sense the magnetic field of the magnet of the driving magnet unit 320 fixed to the housing 310. Therefore, when the housing 310 performs relative movement with respect to the base 500, the amount of the magnetic field sensed by the second sensor unit 720 changes. The pair of second sensor units 720 senses the movement amount or position of the housing 310 in the horizontal direction (x-axis and y-axis direction) in this way and transmits the sensed value to the control unit. The control unit determines whether to perform the additional movement to the housing 310 through the received sensing value. Since the above process is performed in real time, the camera shake correction function of the camera module according to the present embodiment can be performed more precisely with the camera shake correction feedback.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. That is, within the scope of the present invention, all of the components may be selectively coupled to one or more of them. Furthermore, the terms "comprises", "comprising", or "having" described above mean that a component can be implanted unless otherwise specifically stated, But should be construed as including other elements. All terms, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used terms, such as predefined terms, should be interpreted to be consistent with the contextual meanings of the related art, and are not to be construed as ideal or overly formal, unless expressly defined to the contrary.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

10: lens driving unit 20: printed circuit board
30: connecting part 40: element part
50: holder member

Claims (11)

A lens driving unit including a holder member, a bobbin positioned inside the holder member, a first driving unit positioned at the bobbin, and a second driving unit positioned at the holder member and facing the first driving unit;
A printed circuit board on which the image sensor is mounted and on which the holder member is located; And
And a connecting portion for electrically connecting the lens driving unit and the printed circuit board.
The method according to claim 1,
Wherein the connecting portion includes a first substrate extending from a side surface of the lens driving unit, a first connector positioned on the first substrate, a second connector positioned on an upper surface of the printed circuit board and coupled to the first connector, Included camera module.
The method according to claim 1,
The connector includes a third connector positioned on a side surface of the lens driving unit, a flexible second board extending from the printed circuit board, and a fourth connector positioned on the second board and coupled to the third connector, Included camera module.
The method according to claim 1,
Wherein the connecting portion includes a Zero Insertion Force (ZIF) connector extending from a side of the lens driving unit and directly connected to the printed circuit board.
3. The method of claim 2,
The first substrate includes a first surface and a second surface located opposite the first surface,
The first connector being located on the first side of the first substrate,
And an element section including a plurality of capacitors is positioned on the second surface of the first substrate.
3. The method of claim 2,
Further comprising an adhesive applied to a connection portion between the first connector and the second connector.
The method according to claim 1,
Wherein the lens driving unit is coupled to the printed circuit board by soldering and is electrically connected by the connecting unit.
The method according to claim 1,
The lens driving unit includes:
A sensing magnet disposed on the bobbin; and a sensor disposed on the holder member and sensing the sensing magnet.
3. The method of claim 2,
Wherein the holder member includes a base located on the printed circuit board and a housing located on the base and in which the second drive is located,
The lens driving unit may include a third driving unit positioned at the base and facing the second driving unit, a first supporting member coupled to the bobbin and the housing, and a second supporting member coupled to the housing and the base, Includes more camera modules.
10. The method of claim 9,
Wherein the lens driving unit includes a third substrate positioned at the base and coupled to the third driving unit,
Wherein the first substrate extends from the third substrate.
A lens driving unit including a holder member, a bobbin positioned inside the holder member, a first driving unit positioned at the bobbin, and a second driving unit positioned at the holder member and facing the first driving unit;
A printed circuit board on which the image sensor is mounted and on which the holder member is located; And
And a connecting portion for electrically connecting the lens driving unit and the printed circuit board.

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