JPS6417841A - Lead frame material for semiconductor - Google Patents

Lead frame material for semiconductor

Info

Publication number
JPS6417841A
JPS6417841A JP62174392A JP17439287A JPS6417841A JP S6417841 A JPS6417841 A JP S6417841A JP 62174392 A JP62174392 A JP 62174392A JP 17439287 A JP17439287 A JP 17439287A JP S6417841 A JPS6417841 A JP S6417841A
Authority
JP
Japan
Prior art keywords
wire
time
lead frame
alloy
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62174392A
Other languages
English (en)
Other versions
JPH0674496B2 (ja
Inventor
Ryoichi Ozaki
Riichi Tsuno
Masumitsu Soeda
Motohisa Miyato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP62174392A priority Critical patent/JPH0674496B2/ja
Publication of JPS6417841A publication Critical patent/JPS6417841A/ja
Publication of JPH0674496B2 publication Critical patent/JPH0674496B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP62174392A 1987-07-13 1987-07-13 リードフレーム材料の製造方法 Expired - Fee Related JPH0674496B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62174392A JPH0674496B2 (ja) 1987-07-13 1987-07-13 リードフレーム材料の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62174392A JPH0674496B2 (ja) 1987-07-13 1987-07-13 リードフレーム材料の製造方法

Publications (2)

Publication Number Publication Date
JPS6417841A true JPS6417841A (en) 1989-01-20
JPH0674496B2 JPH0674496B2 (ja) 1994-09-21

Family

ID=15977791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62174392A Expired - Fee Related JPH0674496B2 (ja) 1987-07-13 1987-07-13 リードフレーム材料の製造方法

Country Status (1)

Country Link
JP (1) JPH0674496B2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4112416A1 (de) * 1990-04-16 1991-10-17 Mitsubishi Electric Corp Leiterrahmenmaterial fuer einen halbleiter und verfahren zur herstellung des leiterrahmenmaterials
JPH04366A (ja) * 1990-04-16 1992-01-06 Mitsubishi Electric Corp 半導体リードフレーム材料及びその製造方法
JPH04184969A (ja) * 1990-11-20 1992-07-01 Mitsubishi Electric Corp 半導体装置リードフレーム材料及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4112416A1 (de) * 1990-04-16 1991-10-17 Mitsubishi Electric Corp Leiterrahmenmaterial fuer einen halbleiter und verfahren zur herstellung des leiterrahmenmaterials
JPH04366A (ja) * 1990-04-16 1992-01-06 Mitsubishi Electric Corp 半導体リードフレーム材料及びその製造方法
US5167794A (en) * 1990-04-16 1992-12-01 Mitsubishi Denki Kabushiki Kaisha Method for producing lead frame material
JPH04184969A (ja) * 1990-11-20 1992-07-01 Mitsubishi Electric Corp 半導体装置リードフレーム材料及びその製造方法

Also Published As

Publication number Publication date
JPH0674496B2 (ja) 1994-09-21

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees