JPS6417449A - Formation of bump electrode of semiconductor device - Google Patents

Formation of bump electrode of semiconductor device

Info

Publication number
JPS6417449A
JPS6417449A JP62172290A JP17229087A JPS6417449A JP S6417449 A JPS6417449 A JP S6417449A JP 62172290 A JP62172290 A JP 62172290A JP 17229087 A JP17229087 A JP 17229087A JP S6417449 A JPS6417449 A JP S6417449A
Authority
JP
Japan
Prior art keywords
bump electrode
solder
electrical plating
resist film
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62172290A
Other languages
English (en)
Inventor
Hisashi Shirahata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP62172290A priority Critical patent/JPS6417449A/ja
Publication of JPS6417449A publication Critical patent/JPS6417449A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Wire Bonding (AREA)
JP62172290A 1987-07-10 1987-07-10 Formation of bump electrode of semiconductor device Pending JPS6417449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62172290A JPS6417449A (en) 1987-07-10 1987-07-10 Formation of bump electrode of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62172290A JPS6417449A (en) 1987-07-10 1987-07-10 Formation of bump electrode of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6417449A true JPS6417449A (en) 1989-01-20

Family

ID=15939185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62172290A Pending JPS6417449A (en) 1987-07-10 1987-07-10 Formation of bump electrode of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6417449A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02244722A (ja) * 1989-03-17 1990-09-28 Casio Comput Co Ltd 半導体素子のバンプ電極形成方法
JPH0346233A (ja) * 1989-07-13 1991-02-27 Sharp Corp バンプの製造方法
JPH05228983A (ja) * 1992-02-25 1993-09-07 Mitsuba Seisakusho:Kk 押出機への発泡用注入ガス制御装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365663A (en) * 1976-11-24 1978-06-12 Nec Corp Manufacture of semiconductor device
JPS62266851A (ja) * 1986-05-14 1987-11-19 Nec Corp 半田バンプ電極の形成方法
JPS63119551A (ja) * 1986-11-07 1988-05-24 Toshiba Corp パタ−ニングされた金属膜の形成方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365663A (en) * 1976-11-24 1978-06-12 Nec Corp Manufacture of semiconductor device
JPS62266851A (ja) * 1986-05-14 1987-11-19 Nec Corp 半田バンプ電極の形成方法
JPS63119551A (ja) * 1986-11-07 1988-05-24 Toshiba Corp パタ−ニングされた金属膜の形成方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02244722A (ja) * 1989-03-17 1990-09-28 Casio Comput Co Ltd 半導体素子のバンプ電極形成方法
JPH0346233A (ja) * 1989-07-13 1991-02-27 Sharp Corp バンプの製造方法
JPH05228983A (ja) * 1992-02-25 1993-09-07 Mitsuba Seisakusho:Kk 押出機への発泡用注入ガス制御装置

Similar Documents

Publication Publication Date Title
CA2077406A1 (en) Process for flip chip connecting semiconductor chip
MY125582A (en) Process for surface mounting flip chip carrier modules.
MY106847A (en) Method of connecting tab tape to semiconductor chip, and bump sheet and bumped tape used in the method.
JPS6417449A (en) Formation of bump electrode of semiconductor device
JPS5599731A (en) Method of assembling electronic device and lead frame used for assembly
JPS5618454A (en) Hybrid integrated circuit
JPS57190341A (en) Circuit borad composition
JPS56148840A (en) Mounting structure for ic
JPS5742138A (en) Semiconductor device
JPS6474795A (en) Method of mounting semiconductor device
JPS648649A (en) Semiconductor device
JPS5645044A (en) Forming method for electrode lead
JPS56129356A (en) Packaging and package
JPS5380161A (en) Electrode formation of semiconductor
JPS6477135A (en) Semiconductor device
JPS6420696A (en) Manufacture of film carrier board
JPS6450450A (en) Package for semiconductor integrated circuit
JPH0642366Y2 (ja) プリント基板
JPS5571053A (en) Circuit device
Asher Sr et al. Solderability of ENP on Semiconductor Component Leads
JPS57180155A (en) Vessel for electronic circuit
JPS57143835A (en) Mounting method of ic
JPS6472537A (en) Solder bump carrier
JPS6417451A (en) Semiconductor device
JPS5732660A (en) Semiconductor device