JPS6417349A - Temperature fuse mechanism - Google Patents

Temperature fuse mechanism

Info

Publication number
JPS6417349A
JPS6417349A JP17099987A JP17099987A JPS6417349A JP S6417349 A JPS6417349 A JP S6417349A JP 17099987 A JP17099987 A JP 17099987A JP 17099987 A JP17099987 A JP 17099987A JP S6417349 A JPS6417349 A JP S6417349A
Authority
JP
Japan
Prior art keywords
heat sensing
connection
sensing body
temperature fuse
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17099987A
Other languages
Japanese (ja)
Other versions
JPH0787065B2 (en
Inventor
Takashi Fukumaki
Kyo Matsuzaka
Mitsuo Nakamura
Kazuyoshi Terakado
Shigeru Kuriyama
Yukihiro Tochio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17099987A priority Critical patent/JPH0787065B2/en
Publication of JPS6417349A publication Critical patent/JPS6417349A/en
Publication of JPH0787065B2 publication Critical patent/JPH0787065B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Fuses (AREA)

Abstract

PURPOSE:To make the void coefficient very small, increase the connecting strength of elements, and improve the function and reliability as a temperature fuse by using a solder member satisfactorily reacted with both conductors and a heat sensing body and forming a connection reaction layer on the connection section. CONSTITUTION:Conductors 1, 2 and a heat sensing body 8 are connected via a solder member 4' satisfactorily reacted with both the conductors 1, 2 and the heat sensing body 3 and forming the connection reaction layer 4 of the connection section, and the solder member 4' is constituted of a metal or an alloy with the composition that the melting point of the connection reaction layer 4 is higher than the melting point of the heat sensing body 3. A temperature fuse mechanism with a small void coefficient and high connection strength is thereby obtained, the connection position is never melted earlier than the heat sensing body 3, and the temperature fuse function can be improved.
JP17099987A 1987-07-10 1987-07-10 Temperature fuse mechanism Expired - Lifetime JPH0787065B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17099987A JPH0787065B2 (en) 1987-07-10 1987-07-10 Temperature fuse mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17099987A JPH0787065B2 (en) 1987-07-10 1987-07-10 Temperature fuse mechanism

Publications (2)

Publication Number Publication Date
JPS6417349A true JPS6417349A (en) 1989-01-20
JPH0787065B2 JPH0787065B2 (en) 1995-09-20

Family

ID=15915235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17099987A Expired - Lifetime JPH0787065B2 (en) 1987-07-10 1987-07-10 Temperature fuse mechanism

Country Status (1)

Country Link
JP (1) JPH0787065B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013258017A (en) * 2012-06-12 2013-12-26 Murata Mfg Co Ltd Fuse

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013258017A (en) * 2012-06-12 2013-12-26 Murata Mfg Co Ltd Fuse

Also Published As

Publication number Publication date
JPH0787065B2 (en) 1995-09-20

Similar Documents

Publication Publication Date Title
MX168019B (en) METHOD TO PRODUCE A SELF-SUPPORTING CERAMIC BODY AND THE PRODUCT OBTAINED
KR950000902A (en) High Temperature Lead Free Tin Based Multi-Component Soldering Alloys
JPS5730206A (en) Contact extra fine conductor for semiconductor constituent element
EP0292225A3 (en) A fuse
FR2321193B1 (en)
JPS6417349A (en) Temperature fuse mechanism
GB2009528A (en) Electrical soldered contact assembly
JPS5337929A (en) Sheathed heater
CA2165189A1 (en) Coaxial Thermoelements and Thermocouples Made from the Coaxial Thermoelements
JPS57145352A (en) Lead frame for semiconductor
EP0128261A3 (en) Fuse link for an electrical fuse
JPS55141397A (en) High temperature solder
JPS5572048A (en) Semiconductor element
JPS5684432A (en) Gold brazing material
ES440185A1 (en) Procedure for fixing a cable member in a semiconductor device. (Machine-translation by Google Translate, not legally binding)
JPS6422019A (en) Solid electrolytic capacitor
JPS6418245A (en) Ceramic substrate having metal pin and its manufacture
JPS54100941A (en) Low temperature fusion plating material
JPS6448437A (en) Electrode structure
CA1250871A (en) Slow blow fuse
Fritz et al. The influence of lead on eutectic SnAg 3. 5 solder alloy
Abdel-Reihim et al. Grain Refinement and Properties of Lead--Tin Soldering Alloys
Drits et al. Relationship Between Heat Resistance and Composition and Structural State of Alloys of Systems Mg--Y, Mg--Dy, and Mg--Sm
ANAND et al. Rapid solidification of a modified 7075 aluminum alloy by ultrasonic gas atomization[Technical Report, 1978- 1979]
JPS647630A (en) Bonding structure of semiconductor device

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term
FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20070920

Year of fee payment: 12