JPS6416693U

JPS6416693U -

Info

Publication number: JPS6416693U
Application number: JP11183187U
Authority: JP
Priority date: 1987-07-20
Filing date: 1987-07-20
Publication date: 1989-01-27

Description

[Brief explanation of the drawing]

第１図は本考案による半導体パツケージの放熱
構造を示す一部断面を含む側面図、第２図は第１
図の枠形取付具の側面図、第３図は第２図の下面
図、第４図は第２図の放熱器への取付け方及び仮
固定された状態を示す一部断面を含む側面図、第
５図は従来技術による一部断面を含む側面図、第
６図は第５図の枠形取付具の側面図、第７図は第
６図の下面図、第８図は第５図の一部破断を含む
平面図、第９図は半導体パツケージの斜視図であ
る。図において、１，１―１は半導体パツケージ、
２はパツケージ本体、３は放熱器、３ａ，３ｂは
放熱フイン、４はプリント基板、５は熱伝導体、
５ａは取付孔、７はねじ、８はゴムシート、９は
装置、１０は外部放熱体、１０ａは取付面、１１
は隙間、２０は枠形取付具、２０ａは枠体部、２
０ｂはフランジ部、２０ｃは回転係止部、２０ｄ
はくぼみ、２０ｅはねじ孔、を示す。 FIG. 1 is a side view including a partial cross section showing the heat dissipation structure of a semiconductor package according to the present invention, and FIG.
Fig. 3 is a bottom view of the frame-shaped fixture shown in Fig. 2, Fig. 4 is a side view including a partial cross section showing how it is attached to the radiator of Fig. 2 and the state in which it is temporarily fixed. , FIG. 5 is a side view including a partial cross section according to the prior art, FIG. 6 is a side view of the frame-shaped fixture shown in FIG. 5, FIG. 7 is a bottom view of FIG. 6, and FIG. FIG. 9 is a partially broken plan view of the semiconductor package, and FIG. 9 is a perspective view of the semiconductor package. In the figure, 1, 1-1 is a semiconductor package,
2 is a package body, 3 is a heat radiator, 3a, 3b are heat radiation fins, 4 is a printed circuit board, 5 is a thermal conductor,
5a is a mounting hole, 7 is a screw, 8 is a rubber sheet, 9 is a device, 10 is an external heat sink, 10a is a mounting surface, 11
20 is a gap, 20 is a frame-shaped fixture, 20a is a frame body part, 2
0b is a flange part, 20c is a rotation locking part, 20d
20e indicates a recess, and 20e indicates a screw hole.

Claims

[Claims for Utility Model Registration] A frame-shaped fixture 20 having a two-part structure is attached to a semiconductor package comprising a disk-shaped heat dissipation fin provided on the upper surface of a rectangular package body 2 in parallel with the body surface in plan view. A frame body part 20a surrounds the heat dissipation fin, and a flange part 20b protruding in the radial direction from the inner circumference of the frame body part is inserted into the lower surface of the heat dissipation fin from both directions, and the heat dissipation fin is surrounded by the flange part. In the configuration in which the frame-shaped fixtures are connected and attached by the heat conductor 5 in a sandwiching manner, a rotation locking portion 20c that is in contact with the outer peripheral side of the package body 2 is formed at the lower end of the frame portion 20a. Features heat dissipation structure of semiconductor package.