JPS6414931A - Chip fixing tape - Google Patents

Chip fixing tape

Info

Publication number
JPS6414931A
JPS6414931A JP62171619A JP17161987A JPS6414931A JP S6414931 A JPS6414931 A JP S6414931A JP 62171619 A JP62171619 A JP 62171619A JP 17161987 A JP17161987 A JP 17161987A JP S6414931 A JPS6414931 A JP S6414931A
Authority
JP
Japan
Prior art keywords
chip
base material
light
material layer
scattering film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62171619A
Other languages
Japanese (ja)
Inventor
Katsunori Nishiguchi
Mitsuaki Fujihira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP62171619A priority Critical patent/JPS6414931A/en
Priority to KR1019880008295A priority patent/KR910006367B1/en
Priority to DE3851721T priority patent/DE3851721T2/en
Priority to EP88110940A priority patent/EP0298496B1/en
Priority to CA000571589A priority patent/CA1325292C/en
Publication of JPS6414931A publication Critical patent/JPS6414931A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To ensure the recognition of the pattern of a chip, by laminating an adhesive layer, to which a chip is bonded, on a base material layer, and laminating a light scattering film on the opposite surface of the base material layer with respect to the adhesive layer. CONSTITUTION:A piece of tape 10 is composed of the following perts: a base material layer comprising vinyl, plastics and the like, which has a specified thickness and can be expanded; a scattering film 12, which is laminated on the lower surface of the base materiel layer 11; and an adhesive tape 13, which is laminated on the base material layer 11. In a vacuum sucking apparatus, in which a semiconductor chip 14 is picked up with vacuum sucking, light is projected from a light source 20 through the lower surface (rear surface) under the state the chip 14 is bonded for positioning the semiconductor chip 14. The projected light is scattered through the scattering film 12. Only the scattered light from a part, where the semiconductor chip 14 is not present, is inputted into a detecting means. Therefore, the outer configuration of the chip 14 becomes clear as a silhouette. Thus the positioning based on the pattern recognition is ensured and becomes easy.
JP62171619A 1987-07-09 1987-07-09 Chip fixing tape Pending JPS6414931A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP62171619A JPS6414931A (en) 1987-07-09 1987-07-09 Chip fixing tape
KR1019880008295A KR910006367B1 (en) 1987-07-09 1988-07-05 Chip package device
DE3851721T DE3851721T2 (en) 1987-07-09 1988-07-08 Adhesive tape for holding chips on it.
EP88110940A EP0298496B1 (en) 1987-07-09 1988-07-08 Adhesive tape for bonding chips thereon
CA000571589A CA1325292C (en) 1987-07-09 1988-07-08 Adhesive tape for bonding chips thereon

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62171619A JPS6414931A (en) 1987-07-09 1987-07-09 Chip fixing tape

Publications (1)

Publication Number Publication Date
JPS6414931A true JPS6414931A (en) 1989-01-19

Family

ID=15926530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62171619A Pending JPS6414931A (en) 1987-07-09 1987-07-09 Chip fixing tape

Country Status (1)

Country Link
JP (1) JPS6414931A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06305054A (en) * 1992-12-08 1994-11-01 Focke & Co Gmbh & Co Method and device for applying adhesive to blank for pack with hinge lid

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06305054A (en) * 1992-12-08 1994-11-01 Focke & Co Gmbh & Co Method and device for applying adhesive to blank for pack with hinge lid

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