JPS6414931A - Chip fixing tape - Google Patents
Chip fixing tapeInfo
- Publication number
- JPS6414931A JPS6414931A JP62171619A JP17161987A JPS6414931A JP S6414931 A JPS6414931 A JP S6414931A JP 62171619 A JP62171619 A JP 62171619A JP 17161987 A JP17161987 A JP 17161987A JP S6414931 A JPS6414931 A JP S6414931A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- base material
- light
- material layer
- scattering film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To ensure the recognition of the pattern of a chip, by laminating an adhesive layer, to which a chip is bonded, on a base material layer, and laminating a light scattering film on the opposite surface of the base material layer with respect to the adhesive layer. CONSTITUTION:A piece of tape 10 is composed of the following perts: a base material layer comprising vinyl, plastics and the like, which has a specified thickness and can be expanded; a scattering film 12, which is laminated on the lower surface of the base materiel layer 11; and an adhesive tape 13, which is laminated on the base material layer 11. In a vacuum sucking apparatus, in which a semiconductor chip 14 is picked up with vacuum sucking, light is projected from a light source 20 through the lower surface (rear surface) under the state the chip 14 is bonded for positioning the semiconductor chip 14. The projected light is scattered through the scattering film 12. Only the scattered light from a part, where the semiconductor chip 14 is not present, is inputted into a detecting means. Therefore, the outer configuration of the chip 14 becomes clear as a silhouette. Thus the positioning based on the pattern recognition is ensured and becomes easy.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62171619A JPS6414931A (en) | 1987-07-09 | 1987-07-09 | Chip fixing tape |
KR1019880008295A KR910006367B1 (en) | 1987-07-09 | 1988-07-05 | Chip package device |
DE3851721T DE3851721T2 (en) | 1987-07-09 | 1988-07-08 | Adhesive tape for holding chips on it. |
EP88110940A EP0298496B1 (en) | 1987-07-09 | 1988-07-08 | Adhesive tape for bonding chips thereon |
CA000571589A CA1325292C (en) | 1987-07-09 | 1988-07-08 | Adhesive tape for bonding chips thereon |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62171619A JPS6414931A (en) | 1987-07-09 | 1987-07-09 | Chip fixing tape |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6414931A true JPS6414931A (en) | 1989-01-19 |
Family
ID=15926530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62171619A Pending JPS6414931A (en) | 1987-07-09 | 1987-07-09 | Chip fixing tape |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6414931A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06305054A (en) * | 1992-12-08 | 1994-11-01 | Focke & Co Gmbh & Co | Method and device for applying adhesive to blank for pack with hinge lid |
-
1987
- 1987-07-09 JP JP62171619A patent/JPS6414931A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06305054A (en) * | 1992-12-08 | 1994-11-01 | Focke & Co Gmbh & Co | Method and device for applying adhesive to blank for pack with hinge lid |
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