JPS6414929A - Chip fixing tape - Google Patents

Chip fixing tape

Info

Publication number
JPS6414929A
JPS6414929A JP62171617A JP17161787A JPS6414929A JP S6414929 A JPS6414929 A JP S6414929A JP 62171617 A JP62171617 A JP 62171617A JP 17161787 A JP17161787 A JP 17161787A JP S6414929 A JPS6414929 A JP S6414929A
Authority
JP
Japan
Prior art keywords
tape
base material
adhesive layer
material layer
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62171617A
Other languages
Japanese (ja)
Inventor
Mitsuaki Fujihira
Katsunori Nishiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP62171617A priority Critical patent/JPS6414929A/en
Priority to KR1019880008295A priority patent/KR910006367B1/en
Priority to EP88110940A priority patent/EP0298496B1/en
Priority to DE3851721T priority patent/DE3851721T2/en
Priority to CA000571589A priority patent/CA1325292C/en
Publication of JPS6414929A publication Critical patent/JPS6414929A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To make it possible to recognize the pattern of a chip positively and readily, by laminating an adhesive layer for bonding a chip on a base material layer, and laminating a reflection preventing film for light between the tape adhesive layer, on which light for detecting the chip is projected, and the base material layer. CONSTITUTION:A piece of tape 10 is composed of the following parts: a base material layer 11 comprising plastics or the like, which has a specified thickness and can be expanded; a reflection preventing film 12, which is laminated on the base material layer 11; and an adhesive layer 13, which is laminated on the reflection preventing film 12. The tape 10 is cut at a size or shape, which is larger than the diameter of a semiconductor wafer. Under the state the semiconductor wafer is bonded to the adhesive layer 13, the device undergoes a dicing step. After the dicing, the tape 10 is expanded, and the semiconductor chip 14 is separated into individual pieces on the tape 10. The reflection preventing film 12, which is inserted between the base material layer 11 and the adhesive layer 13, can be formed by, e.g., coating a film, whose thickness corresponds to the wavelength of projected light. The thickness of the film to be coated is adjusted in correspondence with the expanding rate of the tape after dicing.
JP62171617A 1987-07-09 1987-07-09 Chip fixing tape Pending JPS6414929A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP62171617A JPS6414929A (en) 1987-07-09 1987-07-09 Chip fixing tape
KR1019880008295A KR910006367B1 (en) 1987-07-09 1988-07-05 Chip package device
EP88110940A EP0298496B1 (en) 1987-07-09 1988-07-08 Adhesive tape for bonding chips thereon
DE3851721T DE3851721T2 (en) 1987-07-09 1988-07-08 Adhesive tape for holding chips on it.
CA000571589A CA1325292C (en) 1987-07-09 1988-07-08 Adhesive tape for bonding chips thereon

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62171617A JPS6414929A (en) 1987-07-09 1987-07-09 Chip fixing tape

Publications (1)

Publication Number Publication Date
JPS6414929A true JPS6414929A (en) 1989-01-19

Family

ID=15926493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62171617A Pending JPS6414929A (en) 1987-07-09 1987-07-09 Chip fixing tape

Country Status (1)

Country Link
JP (1) JPS6414929A (en)

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