JPH05129431A - Adhesive tape - Google Patents

Abstract

PURPOSE:To make sticking work of a weak adhesive tape and a strong adhesive tape or ultraviolet ray irradiation work unnecessary which work have been a problem concerning a dicing tape in the conventional case, reduce manhour, and improve workability. CONSTITUTION:The title tape has a double-sided bonding structure wherein, in a dicing tape 9, a base film 3 is provided, pressure-sensitive adhesive agent 2a of a weak adhesion type is applied to one surface of the base film 3, and pressure-sensitive adhesive agent 2b of strong adhesion type is applied to the other surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive tape, and more particularly, to a technique effective when applied to an adhesive structure capable of peeling a work such as an already bonded semiconductor wafer from an adhesive tape adhered to a tape application jig. Regarding

[0002]

2. Description of the Related Art As this type of adhesive tape, there are, for example, first and second dicing tapes.

As shown in FIG. 2, the first dicing tape 7a includes a weak adhesive tape 5 in which a base film 3 is coated with a weak adhesive type pressure sensitive adhesive 2a, and a base film 3 is a strong adhesive type. Strong adhesive tape 6 coated with pressure sensitive adhesive 2b
The weak adhesive tape 5 is attached to the strong adhesive tape 6 passed between the tape attaching jigs 4 and 4, the semiconductor wafer 1 is attached to the weak adhesive tape 5, and dicing is performed. ..

As shown in FIG. 3, the second dicing tape 7b has a base film 3 on which an ultraviolet-curable adhesive 8 is applied.
After the semiconductor wafer 1 is attached to the second dicing tape 7b for dicing, ultraviolet rays are radiated to cure the ultraviolet-curable adhesive 8 and
The structure is such that chips are taken out from the semiconductor wafer 1.

[0005]

However, the above-mentioned first problem
The structure of the dicing tape of (1) requires the work of bonding the weak adhesive tape and the strong adhesive tape, which causes a problem that the work amount increases and the workability deteriorates.

Further, in the structure of the second dicing tape described above, no consideration is given to the control of the time for irradiating ultraviolet rays and the time for sticking and leaving the semiconductor wafer after the irradiation of ultraviolet rays. There is a problem that the workability is increased and the workability is reduced.

The object of the present invention is to improve the adhesion to the tape sticking jig on the other side surface of the base material, and to facilitate the peeling of the work on the one side surface of the base material to improve the workability. It is to provide an adhesive tape.

[0008]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, the adhesive tape of the present invention comprises a base material, a double-sided adhesive structure in which a weak adhesive type adhesive agent is applied to one side surface of this substrate and a strong adhesive type adhesive agent is applied to the other side surface. It was done.

In this case, the adhesive tape can be used as a dicing tape for adhering a semiconductor wafer.

[0011]

According to the adhesive tape of the present invention, a double-sided adhesive structure comprising a base material, one side of which is coated with a weak adhesive type adhesive and the other side of which is coated with a strong adhesive type adhesive. Therefore, it is possible to improve the adhesion to the tape sticking jig on the other side surface of the base material and facilitate the peeling of the work on the one side surface of the base material to improve the workability.

In this case, since the adhesive tape has a structure used as a dicing tape for sticking a semiconductor wafer, the sticking work of the weak sticking tape and the strong sticking tape or the ultraviolet irradiation work which has been a problem in the past is performed. It is possible to reduce the amount of work, reduce work, and improve workability.

[0013]

1 is a sectional view showing an adhesive tape according to an embodiment of the present invention.

The adhesive tape in this embodiment is applied to a dicing tape 9 used for dicing the semiconductor wafer 1. The dicing tape 9 has a double-sided adhesive structure and has a base film 3. This base film 3
Is a film that serves as a base material for the pressure-sensitive adhesive, and is made of polyethylene, polyester, or vinyl chloride, for example, and has a thickness of about 5 to 200 μm.

The surface of the base film 3 is coated with a weak adhesive type pressure sensitive adhesive 2a. The weak adhesive type pressure sensitive adhesive 2a has a weak adhesive force, and after dicing the semiconductor wafer 1, It is a pressure-sensitive adhesive having a property that chips can be taken out. For example, the material is acrylic and the thickness is about 5 to 30 μm.

A strong adhesive type pressure sensitive adhesive 2b is applied to the back surface of the base film 3, and the strong adhesive type pressure sensitive adhesive 2b is applied to a tape applying jig 4 for dicing. At this time, it is a pressure-sensitive adhesive having an adhesive strength such that it is not peeled off. For example, the material is acrylic and the thickness is about 5 to 30 μm.

Next, the operation of this embodiment will be described.

When dicing the semiconductor wafer 1,
First, using the dicing tape 9, the tape attaching jig 4 is attached to the strong adhesive type pressure sensitive adhesive 2b and the semiconductor wafer 1 is attached to the weak adhesive type pressure sensitive adhesive 2a.

Next, the attached semiconductor wafer 1 is set in a dicer together with the dicing tape 9 and the tape attaching jig 4, and dicing is performed, and thereafter, the chip is taken out from the semiconductor wafer 1.

As described above, the dicing tape 9 has pressure sensitive adhesives 2a, 2 having different adhesive strengths on both sides of the base film 3.
Since b is applied in the structure, the back surface of the base material film 3 can improve the adhesion to the tape attaching jig 4, and the front surface of the base material film 3 can easily peel off the chip.

Therefore, it is possible to reduce the work amount and improve the workability by eliminating the work of attaching the weak adhesive tape and the strong adhesive tape or the ultraviolet irradiation work which has been a problem in the past.

The invention made by the present inventor has been specifically described above based on the embodiments, but the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, in the above-mentioned embodiment, the case of using a polyethylene-based film as the substrate has been described, but not limited to this, cotton, rayon, human silk, aluminum foil can be used as the substrate. ..

Further, in the above-mentioned embodiment, the case where the acrylic pressure-sensitive adhesive is applied to the base film has been described, but instead of the acrylic pressure-sensitive adhesive, a rubber pressure-sensitive adhesive is used. Can be applied to a substrate film.

In the above description, the invention made by the present inventor has been mainly described with respect to the application field of the dicing tape. However, the invention is not limited to this, and other works such as electronic parts for semiconductor manufacturing can be used. It can be applied not only to the adhesive tape used for application but also to the adhesive tape used for application of household or commercial products.

[0026]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

(1). A double-sided adhesive structure is provided in which a base material is provided, and one side of this base material is coated with a weak adhesive type adhesive and the other side is coated with a strong adhesive type adhesive. On the other side, the adhesion to the tape sticking jig can be improved, and on the one side of the substrate, the work can be easily peeled off and the workability can be improved.

(2) In the case of the above (1), since the adhesive tape has a structure used as a dicing tape for sticking a semiconductor wafer, the sticking work of the weak adhesive tape and the strong adhesive tape or the ultraviolet irradiation work is performed. It is possible to reduce the amount of work, reduce work, and improve workability.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an adhesive tape that is an embodiment of the present invention.

FIG. 2 is a sectional view showing a first conventional dicing tape.

FIG. 3 is a sectional view showing a second conventional dicing tape.

[Explanation of symbols]

 1 Semiconductor Wafer 2a Weak Adhesive Type Pressure Sensitive Adhesive 2b Strong Adhesive Type Pressure Sensitive Adhesive 3 Base Film 4 Tape Adhering Jig 5 Weak Adhesive Tape 6 Strong Adhesive Tape 7a First Dicing Tape 7b Second Dicing Tape 8 UV-curable adhesive 9 Dicing tape

Claims (2)

[Claims] 1. A double-sided adhesive structure comprising a base material, one side of which is coated with a weak adhesive type adhesive and the other side of which is coated with a strong adhesive type adhesive. tape. 2. The adhesive tape is a dicing tape for adhering a semiconductor wafer.
Adhesive tape as described.