JPS6414930A - Chip fixing tape - Google Patents

Chip fixing tape

Info

Publication number
JPS6414930A
JPS6414930A JP62171618A JP17161887A JPS6414930A JP S6414930 A JPS6414930 A JP S6414930A JP 62171618 A JP62171618 A JP 62171618A JP 17161887 A JP17161887 A JP 17161887A JP S6414930 A JPS6414930 A JP S6414930A
Authority
JP
Japan
Prior art keywords
light
chip
semiconductor chip
base material
projected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62171618A
Other languages
Japanese (ja)
Inventor
Mitsuaki Fujihira
Katsunori Nishiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP62171618A priority Critical patent/JPS6414930A/en
Priority to KR1019880008295A priority patent/KR910006367B1/en
Priority to DE3851721T priority patent/DE3851721T2/en
Priority to CA000571589A priority patent/CA1325292C/en
Priority to EP88110940A priority patent/EP0298496B1/en
Publication of JPS6414930A publication Critical patent/JPS6414930A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To make it possible to recognize the pattern of a chip positively and readily, by laminating an adhesive layer, to which the chip is bonded, on a base material layer and laminating a light diffusing film between the adhesive layer, on which light for detecting the position of the chip is projected, and the base material layer. CONSTITUTION:As a light diffusing film 12, which is provided between a base amaterial layer 11 and an adhesive layer 13, soft plastics, in which projected light is diffused, is used. The lamination can be readily performed by immersing the base material 11 in the fused plastics. In a vacuum sucking apparatus, in which a semiconductor chip 14 is sucked with vacuum, the light is projected under the state the chip is bonded for positioning the semiconductor chip 14. The light is reflected from the surface of the semiconductor chip 14. The light, which has reached a piece of tape 10, is scattered in every direction. The reflected light from the semiconductor chip 14 is inputted into a detecting means by a remarkably large amount, and the outer configuration of the chip 14 becomes clear.
JP62171618A 1987-07-09 1987-07-09 Chip fixing tape Pending JPS6414930A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP62171618A JPS6414930A (en) 1987-07-09 1987-07-09 Chip fixing tape
KR1019880008295A KR910006367B1 (en) 1987-07-09 1988-07-05 Chip package device
DE3851721T DE3851721T2 (en) 1987-07-09 1988-07-08 Adhesive tape for holding chips on it.
CA000571589A CA1325292C (en) 1987-07-09 1988-07-08 Adhesive tape for bonding chips thereon
EP88110940A EP0298496B1 (en) 1987-07-09 1988-07-08 Adhesive tape for bonding chips thereon

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62171618A JPS6414930A (en) 1987-07-09 1987-07-09 Chip fixing tape

Publications (1)

Publication Number Publication Date
JPS6414930A true JPS6414930A (en) 1989-01-19

Family

ID=15926511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62171618A Pending JPS6414930A (en) 1987-07-09 1987-07-09 Chip fixing tape

Country Status (1)

Country Link
JP (1) JPS6414930A (en)

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