JPS6413723U - - Google Patents

Info

Publication number
JPS6413723U
JPS6413723U JP10753787U JP10753787U JPS6413723U JP S6413723 U JPS6413723 U JP S6413723U JP 10753787 U JP10753787 U JP 10753787U JP 10753787 U JP10753787 U JP 10753787U JP S6413723 U JPS6413723 U JP S6413723U
Authority
JP
Japan
Prior art keywords
coating liquid
liquid supply
coating
die bonder
tab portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10753787U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10753787U priority Critical patent/JPS6413723U/ja
Publication of JPS6413723U publication Critical patent/JPS6413723U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Die Bonding (AREA)
JP10753787U 1987-07-15 1987-07-15 Pending JPS6413723U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10753787U JPS6413723U (enrdf_load_stackoverflow) 1987-07-15 1987-07-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10753787U JPS6413723U (enrdf_load_stackoverflow) 1987-07-15 1987-07-15

Publications (1)

Publication Number Publication Date
JPS6413723U true JPS6413723U (enrdf_load_stackoverflow) 1989-01-24

Family

ID=31342040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10753787U Pending JPS6413723U (enrdf_load_stackoverflow) 1987-07-15 1987-07-15

Country Status (1)

Country Link
JP (1) JPS6413723U (enrdf_load_stackoverflow)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831543A (ja) * 1981-08-19 1983-02-24 Nec Home Electronics Ltd 半導体装置の製造方法
JPS59100545A (ja) * 1982-11-30 1984-06-09 Matsushita Electric Works Ltd Ｉｃチツプのダイボンド装置
JPS6122636A (ja) * 1984-07-11 1986-01-31 Toshiba Corp マウント方法
JPS61121350A (ja) * 1984-11-16 1986-06-09 Matsushita Electronics Corp 半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831543A (ja) * 1981-08-19 1983-02-24 Nec Home Electronics Ltd 半導体装置の製造方法
JPS59100545A (ja) * 1982-11-30 1984-06-09 Matsushita Electric Works Ltd Ｉｃチツプのダイボンド装置
JPS6122636A (ja) * 1984-07-11 1986-01-31 Toshiba Corp マウント方法
JPS61121350A (ja) * 1984-11-16 1986-06-09 Matsushita Electronics Corp 半導体装置の製造方法

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