JPH01143124U - - Google Patents
Info
- Publication number
- JPH01143124U JPH01143124U JP3977388U JP3977388U JPH01143124U JP H01143124 U JPH01143124 U JP H01143124U JP 3977388 U JP3977388 U JP 3977388U JP 3977388 U JP3977388 U JP 3977388U JP H01143124 U JPH01143124 U JP H01143124U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit element
- view
- soft solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3977388U JPH01143124U (enrdf_load_stackoverflow) | 1988-03-25 | 1988-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3977388U JPH01143124U (enrdf_load_stackoverflow) | 1988-03-25 | 1988-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143124U true JPH01143124U (enrdf_load_stackoverflow) | 1989-10-02 |
Family
ID=31266265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3977388U Pending JPH01143124U (enrdf_load_stackoverflow) | 1988-03-25 | 1988-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143124U (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0436236U (enrdf_load_stackoverflow) * | 1990-07-24 | 1992-03-26 |
-
1988
- 1988-03-25 JP JP3977388U patent/JPH01143124U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0436236U (enrdf_load_stackoverflow) * | 1990-07-24 | 1992-03-26 |