JPH0436236U - - Google Patents

Info

Publication number
JPH0436236U
JPH0436236U JP7850390U JP7850390U JPH0436236U JP H0436236 U JPH0436236 U JP H0436236U JP 7850390 U JP7850390 U JP 7850390U JP 7850390 U JP7850390 U JP 7850390U JP H0436236 U JPH0436236 U JP H0436236U
Authority
JP
Japan
Prior art keywords
solder
roller
circumferential surface
auxiliary roller
die bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7850390U
Other languages
English (en)
Japanese (ja)
Other versions
JP2522833Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990078503U priority Critical patent/JP2522833Y2/ja
Publication of JPH0436236U publication Critical patent/JPH0436236U/ja
Application granted granted Critical
Publication of JP2522833Y2 publication Critical patent/JP2522833Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1990078503U 1990-07-24 1990-07-24 ダイボンダーのソルダー塗布ユニット Expired - Lifetime JP2522833Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990078503U JP2522833Y2 (ja) 1990-07-24 1990-07-24 ダイボンダーのソルダー塗布ユニット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990078503U JP2522833Y2 (ja) 1990-07-24 1990-07-24 ダイボンダーのソルダー塗布ユニット

Publications (2)

Publication Number Publication Date
JPH0436236U true JPH0436236U (enrdf_load_stackoverflow) 1992-03-26
JP2522833Y2 JP2522833Y2 (ja) 1997-01-16

Family

ID=31621834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990078503U Expired - Lifetime JP2522833Y2 (ja) 1990-07-24 1990-07-24 ダイボンダーのソルダー塗布ユニット

Country Status (1)

Country Link
JP (1) JP2522833Y2 (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62154765A (ja) * 1985-12-27 1987-07-09 Murata Mfg Co Ltd リ−ドフレ−ムへのクリ−ム半田の供給方法
JPH01143124U (enrdf_load_stackoverflow) * 1988-03-25 1989-10-02

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62154765A (ja) * 1985-12-27 1987-07-09 Murata Mfg Co Ltd リ−ドフレ−ムへのクリ−ム半田の供給方法
JPH01143124U (enrdf_load_stackoverflow) * 1988-03-25 1989-10-02

Also Published As

Publication number Publication date
JP2522833Y2 (ja) 1997-01-16

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