JPH0436236U - - Google Patents

Info

Publication number
JPH0436236U
JPH0436236U JP7850390U JP7850390U JPH0436236U JP H0436236 U JPH0436236 U JP H0436236U JP 7850390 U JP7850390 U JP 7850390U JP 7850390 U JP7850390 U JP 7850390U JP H0436236 U JPH0436236 U JP H0436236U
Authority
JP
Japan
Prior art keywords
solder
roller
circumferential surface
auxiliary roller
die bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7850390U
Other languages
Japanese (ja)
Other versions
JP2522833Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990078503U priority Critical patent/JP2522833Y2/en
Publication of JPH0436236U publication Critical patent/JPH0436236U/ja
Application granted granted Critical
Publication of JP2522833Y2 publication Critical patent/JP2522833Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａは本考案の実施例１を示す平面図、第
１図ｂは同断面図、第２図ａは本考案の実施例２
を示す平面図、第２図ｂは同断面図、第３図ａは
従来のソルダー塗布ユニツトを示す平面図、第３
図ｂは同断面図である。 １……スキージ部、２……ソルダーストツク部
、３……ベースブロツク、４……軸受、５……回
転駆動軸、６……ソルダー塗布ローラ、７……補
助ローラ、８，８′……ソルダー、９ａ，９ｂ…
…切込溝、１０……半導体ペレツト、１１……ダ
イボンデイングノズル。 Figure 1a is a plan view showing Embodiment 1 of the present invention, Figure 1b is a sectional view of the same, and Figure 2a is Embodiment 2 of the present invention.
FIG. 2b is a sectional view of the same, FIG. 3a is a plan view showing a conventional solder application unit, and FIG.
Figure b is a sectional view of the same. DESCRIPTION OF SYMBOLS 1... Squeegee part, 2... Solder stock part, 3... Base block, 4... Bearing, 5... Rotation drive shaft, 6... Solder application roller, 7... Auxiliary roller, 8, 8'... ...Solder, 9a, 9b...
... Cut groove, 10 ... Semiconductor pellet, 11 ... Die bonding nozzle.

Claims (1)

【実用新案登録請求の範囲】 (1) ソルダーストツク部と、ソルダー塗布ロー
ラと、補助ローラとを有するダイボンダーのソル
ダー塗布ユニツトであつて、 ソルダーストツク部は、ソルダーを貯瑠するの
ものであり、 ソルダー塗布ローラは、ソルダーストツク部内
のソルダーが周面に供給されるものであり、 補助ローラは、ソルダー塗布ローラと相対回転
し、該ソルダー塗布ローラの周面に付着したソル
ダーをソルダーストツク部内のソルダーに練り込
むものであることを特徴とするダイボンダーのソ
ルダー塗布ユニツト。 (2) 前記補助ローラは、周面に螺旋状の切込溝
を有するものであり、 該螺旋状の切込溝は、補助ローラの長手方向中
心に対し左右対称に設けてあることを特徴とする
請求項(1)項記載のダイボンダーのソルダー塗布
ユニツト。[Scope of Claim for Utility Model Registration] (1) A solder application unit for a die bonder having a solder stock section, a solder application roller, and an auxiliary roller, where the solder stock section stores solder. Yes, the solder application roller supplies the solder in the solder stock portion to the circumferential surface, and the auxiliary roller rotates relative to the solder application roller to solder paste the solder attached to the circumferential surface of the solder application roller. A solder application unit for a die bonder, characterized in that it is applied to solder in a solder part. (2) The auxiliary roller has a spiral cut groove on its circumferential surface, and the spiral cut groove is provided symmetrically with respect to the longitudinal center of the auxiliary roller. A solder coating unit for a die bonder according to claim (1).
JP1990078503U 1990-07-24 1990-07-24 Die bonder solder application unit Expired - Lifetime JP2522833Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990078503U JP2522833Y2 (en) 1990-07-24 1990-07-24 Die bonder solder application unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990078503U JP2522833Y2 (en) 1990-07-24 1990-07-24 Die bonder solder application unit

Publications (2)

Publication Number Publication Date
JPH0436236U true JPH0436236U (en) 1992-03-26
JP2522833Y2 JP2522833Y2 (en) 1997-01-16

Family

ID=31621834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990078503U Expired - Lifetime JP2522833Y2 (en) 1990-07-24 1990-07-24 Die bonder solder application unit

Country Status (1)

Country Link
JP (1) JP2522833Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62154765A (en) * 1985-12-27 1987-07-09 Murata Mfg Co Ltd Creamy solder feeding method for lead frame
JPH01143124U (en) * 1988-03-25 1989-10-02

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62154765A (en) * 1985-12-27 1987-07-09 Murata Mfg Co Ltd Creamy solder feeding method for lead frame
JPH01143124U (en) * 1988-03-25 1989-10-02

Also Published As

Publication number Publication date
JP2522833Y2 (en) 1997-01-16

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