JP2522833Y2 - ダイボンダーのソルダー塗布ユニット - Google Patents
ダイボンダーのソルダー塗布ユニットInfo
- Publication number
- JP2522833Y2 JP2522833Y2 JP1990078503U JP7850390U JP2522833Y2 JP 2522833 Y2 JP2522833 Y2 JP 2522833Y2 JP 1990078503 U JP1990078503 U JP 1990078503U JP 7850390 U JP7850390 U JP 7850390U JP 2522833 Y2 JP2522833 Y2 JP 2522833Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- roller
- solder application
- stock
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 87
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 description 6
- 239000008188 pellet Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990078503U JP2522833Y2 (ja) | 1990-07-24 | 1990-07-24 | ダイボンダーのソルダー塗布ユニット |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990078503U JP2522833Y2 (ja) | 1990-07-24 | 1990-07-24 | ダイボンダーのソルダー塗布ユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0436236U JPH0436236U (enrdf_load_stackoverflow) | 1992-03-26 |
JP2522833Y2 true JP2522833Y2 (ja) | 1997-01-16 |
Family
ID=31621834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990078503U Expired - Lifetime JP2522833Y2 (ja) | 1990-07-24 | 1990-07-24 | ダイボンダーのソルダー塗布ユニット |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2522833Y2 (enrdf_load_stackoverflow) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62154765A (ja) * | 1985-12-27 | 1987-07-09 | Murata Mfg Co Ltd | リ−ドフレ−ムへのクリ−ム半田の供給方法 |
JPH01143124U (enrdf_load_stackoverflow) * | 1988-03-25 | 1989-10-02 |
-
1990
- 1990-07-24 JP JP1990078503U patent/JP2522833Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0436236U (enrdf_load_stackoverflow) | 1992-03-26 |
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