JPS6398630U - - Google Patents
Info
- Publication number
- JPS6398630U JPS6398630U JP19474986U JP19474986U JPS6398630U JP S6398630 U JPS6398630 U JP S6398630U JP 19474986 U JP19474986 U JP 19474986U JP 19474986 U JP19474986 U JP 19474986U JP S6398630 U JPS6398630 U JP S6398630U
- Authority
- JP
- Japan
- Prior art keywords
- syringe
- resin adhesive
- needles
- semiconductor chip
- bonding apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims 4
- 230000001070 adhesive effect Effects 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19474986U JPS6398630U (enrdf_load_stackoverflow) | 1986-12-18 | 1986-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19474986U JPS6398630U (enrdf_load_stackoverflow) | 1986-12-18 | 1986-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6398630U true JPS6398630U (enrdf_load_stackoverflow) | 1988-06-25 |
Family
ID=31152009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19474986U Pending JPS6398630U (enrdf_load_stackoverflow) | 1986-12-18 | 1986-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6398630U (enrdf_load_stackoverflow) |
-
1986
- 1986-12-18 JP JP19474986U patent/JPS6398630U/ja active Pending