JPS62190671U - - Google Patents
Info
- Publication number
- JPS62190671U JPS62190671U JP8044286U JP8044286U JPS62190671U JP S62190671 U JPS62190671 U JP S62190671U JP 8044286 U JP8044286 U JP 8044286U JP 8044286 U JP8044286 U JP 8044286U JP S62190671 U JPS62190671 U JP S62190671U
- Authority
- JP
- Japan
- Prior art keywords
- container
- resin
- nozzle
- tube body
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Coating Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8044286U JPS62190671U (enrdf_load_stackoverflow) | 1986-05-28 | 1986-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8044286U JPS62190671U (enrdf_load_stackoverflow) | 1986-05-28 | 1986-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62190671U true JPS62190671U (enrdf_load_stackoverflow) | 1987-12-04 |
Family
ID=30931250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8044286U Pending JPS62190671U (enrdf_load_stackoverflow) | 1986-05-28 | 1986-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62190671U (enrdf_load_stackoverflow) |
-
1986
- 1986-05-28 JP JP8044286U patent/JPS62190671U/ja active Pending